BR0202594A - Sistema e procedimento para o controle da qualidade de um corte ou perfuração a laser - Google Patents

Sistema e procedimento para o controle da qualidade de um corte ou perfuração a laser

Info

Publication number
BR0202594A
BR0202594A BR0202594-9A BR0202594A BR0202594A BR 0202594 A BR0202594 A BR 0202594A BR 0202594 A BR0202594 A BR 0202594A BR 0202594 A BR0202594 A BR 0202594A
Authority
BR
Brazil
Prior art keywords
perforation
cut
quality control
sensor means
procedure
Prior art date
Application number
BR0202594-9A
Other languages
English (en)
Inventor
Luca Bolognese
Giuseppe D Angelo
Giorgio Pasquettaz
Original Assignee
Salvagnini Italia Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Salvagnini Italia Spa filed Critical Salvagnini Italia Spa
Publication of BR0202594A publication Critical patent/BR0202594A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

"SISTEMA E PROCEDIMENTO PARA O CONTROLE DA QUALIDADE DE UM CORTE OU PERFURAçãO A LASER". Em um sistema para o controle da qualidade de um corte ou perfuração a laser compreendendo um meio (4) para focalizar um feixe de laser (1) em uma zona de corte ou perfuração, um meio de sensor de fotodiodo (7) para detectar a radiação (E) emitida pela zona de corte ou perfuração, e uma unidade eletrónica de controle e processamento (8) para processar os sinais emitidos pelo dito meio de sensor (7) um filtro ótico (11) é fomecido e é associado com o dito meio de sensor de fotodiodo (7) para selecionar uma faixa ótica em torno de 620 nm. O sinal proveniente do dito meio de sensor (7) é adquirido com uma freq³ência compreendida entre 10 e 60 kHz e filtrado com um filtro de passagem de banda entre 7 e 16 kHz. Dessa forma o controle da qualidade de corte ou perfuração pode ser realizado com base no sinal processado dessa forma, sem a necessidade de uma comparação com o sinal de referência predeterminado correspondente a um corte ou perfuração de boa qualidade (figura 1).
BR0202594-9A 2001-07-13 2002-07-09 Sistema e procedimento para o controle da qualidade de um corte ou perfuração a laser BR0202594A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2001MI001506A ITMI20011506A1 (it) 2001-07-13 2001-07-13 Sistema per il controllo della qualita' di un taglio o foratura laser, particolaramente per fogli di lamiera

Publications (1)

Publication Number Publication Date
BR0202594A true BR0202594A (pt) 2003-05-06

Family

ID=11448060

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0202594-9A BR0202594A (pt) 2001-07-13 2002-07-09 Sistema e procedimento para o controle da qualidade de um corte ou perfuração a laser

Country Status (9)

Country Link
US (1) US6674044B2 (pt)
EP (1) EP1275465B1 (pt)
JP (1) JP2003053569A (pt)
KR (1) KR20030007167A (pt)
AT (1) ATE275021T1 (pt)
BR (1) BR0202594A (pt)
CA (1) CA2390424A1 (pt)
DE (1) DE60201110T2 (pt)
IT (1) ITMI20011506A1 (pt)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITTO20020508A1 (it) * 2002-06-14 2003-12-15 Fiat Ricerche Sistema e procedimento per il monitoraggio di saldature laser
ITTO20040013A1 (it) * 2004-01-13 2004-04-13 Fiat Ricerche Procedimento per il controllo della qualita' di processi industriali in particolare processi di saldatura laser
EP1677170A1 (en) * 2004-12-30 2006-07-05 C.R.F. Società Consortile per Azioni Module with sensor means for monitoring industrial processes
EP1886757B1 (en) 2006-08-07 2009-07-01 LVD Company NV Arrangement and method for the on-line monitoring of the quality of a laser process exerted on a workpiece using a heat detection camera and a tilted mirror
US8546724B2 (en) * 2010-01-26 2013-10-01 King Fahd University Of Petroleum & Minerals Apparatus and method for controlling laser cutting through surface plasma monitoring
DE102011004117A1 (de) 2011-02-15 2012-08-16 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zur Kontrolle einer schneidenden Bearbeitung an einem Werkstück
CN103181655A (zh) * 2011-12-27 2013-07-03 武汉金运激光股份有限公司 鞋面激光打孔系统
EP2624091B1 (en) * 2012-02-06 2014-07-30 C.R.F. Società Consortile per Azioni A method for monitoring the quality of industrial processes and system therefrom
EP3294488B1 (de) 2015-05-13 2020-03-25 Bystronic Laser AG Laserschneidvorrichtung mit einer überwachunganordnung
DE102018129407B4 (de) 2018-11-22 2023-03-30 Precitec Gmbh & Co. Kg Verfahren zum Schneiden eines Werkstücks mittels eines Laserstrahls und Laserbearbeitungssystem zum Durchführen des Verfahrens
EP3885069A1 (de) 2020-03-25 2021-09-29 Bystronic Laser AG Qualitätskontrolle eines laserbearbeitungsprozesses mittels maschinellem lernen
CN115413251A (zh) * 2020-03-25 2022-11-29 百超激光有限公司 使用机器学习的激光加工过程的质量控制
CN113414503B (zh) * 2021-06-11 2022-10-04 武汉理工大学 一种高质量激光切割质量保障系统及方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9321866D0 (en) * 1993-10-22 1993-12-15 Kinsman Grant Fuzzy logic control of laser welding
US6210514B1 (en) * 1998-02-11 2001-04-03 Xerox Corporation Thin film structure machining and attachment
US6140604A (en) * 1998-06-18 2000-10-31 General Electric Company Laser drilling breakthrough detector
JP3603843B2 (ja) * 2001-02-23 2004-12-22 日産自動車株式会社 レーザー溶接部の品質モニタリング方法およびその装置

Also Published As

Publication number Publication date
ITMI20011506A0 (it) 2001-07-13
DE60201110D1 (de) 2004-10-07
ITMI20011506A1 (it) 2003-01-13
DE60201110T2 (de) 2005-09-15
ATE275021T1 (de) 2004-09-15
KR20030007167A (ko) 2003-01-23
US20030010760A1 (en) 2003-01-16
US6674044B2 (en) 2004-01-06
CA2390424A1 (en) 2003-01-13
JP2003053569A (ja) 2003-02-26
EP1275465A1 (en) 2003-01-15
EP1275465B1 (en) 2004-09-01

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]