BR0104544A - Process for electroplating a workpiece coated with an electrically conductive polymer - Google Patents

Process for electroplating a workpiece coated with an electrically conductive polymer

Info

Publication number
BR0104544A
BR0104544A BR0104544-0A BR0104544A BR0104544A BR 0104544 A BR0104544 A BR 0104544A BR 0104544 A BR0104544 A BR 0104544A BR 0104544 A BR0104544 A BR 0104544A
Authority
BR
Brazil
Prior art keywords
electrically conductive
workpiece
electroplating
contact elements
conductive polymer
Prior art date
Application number
BR0104544-0A
Other languages
Portuguese (pt)
Inventor
Walter Kronenberg
Juergen Hupe
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone filed Critical Enthone
Publication of BR0104544A publication Critical patent/BR0104544A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Abstract

Patente de Invenção: "PROCESSO PARA ELETROGALVANIZAR UMA PEçA A TRABALHAR REVESTIDA COM UM POLìMERO ELETRICAMENTE CONDUTOR". A invenção refere-se a um processo para eletrogalvanizar uma peça a trabalhar (1), que é revestida com um polímero eletricamente condutor ou modificado, em que, independentemente da peça a trabalhar ser eletrogalvanizada, é possível simultaneamente reduzir a densidade de corrente e encurtar o tempo de eletrogalvanização. A invenção inclui, em uma primeira etapa, a conexão da peça a trabalhar a uma fonte de corrente (8) por meio de múltiplos elementos de contato adjacentes (5) e a cobertura da mesma com um revestimento fino metálico, exceto nos pontos cobertos pelos elementos de contato, sendo removidos, subseq³entemente, em uma segunda etapa, os elementos de contato e formado um revestimento de metal irrompível (10).Invention Patent: "PROCESS FOR ELECTRAL GANVANIZING A PIECE OF WORK COATED WITH AN ELECTRICALLY CONDUCTIVE POLYMER". The invention relates to a process for electroplating a workpiece (1), which is coated with an electrically conductive or modified polymer, in which, regardless of the workpiece being electroplated, it is possible to simultaneously reduce the current density and shorten electroplating time. The invention includes, in a first step, the connection of the workpiece to a current source (8) by means of multiple adjacent contact elements (5) and the covering of the same with a thin metallic coating, except in the points covered by contact elements, being subsequently removed, in a second stage, the contact elements and an unbreakable metal coating is formed (10).

BR0104544-0A 2000-02-18 2001-02-20 Process for electroplating a workpiece coated with an electrically conductive polymer BR0104544A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10007435A DE10007435A1 (en) 2000-02-18 2000-02-18 Process for electroplating a workpiece coated with an electrically conductive polymer
PCT/US2001/001235 WO2001061079A1 (en) 2000-02-18 2001-02-20 Process for electroplating a work piece coated with an electrically conducting polymer

Publications (1)

Publication Number Publication Date
BR0104544A true BR0104544A (en) 2002-01-08

Family

ID=7631430

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0104544-0A BR0104544A (en) 2000-02-18 2001-02-20 Process for electroplating a workpiece coated with an electrically conductive polymer

Country Status (11)

Country Link
US (1) US20020157959A1 (en)
EP (1) EP1198624A4 (en)
KR (1) KR20020021629A (en)
CN (1) CN1366563A (en)
AU (1) AU2001237942A1 (en)
BR (1) BR0104544A (en)
CA (1) CA2369687A1 (en)
DE (1) DE10007435A1 (en)
IL (1) IL145890A0 (en)
MX (1) MXPA01010570A (en)
WO (1) WO2001061079A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100495420C (en) * 2000-02-21 2009-06-03 特科2000国际有限公司 Portable date storing device
WO2003038158A2 (en) * 2001-10-25 2003-05-08 Infineon Technologies Ag Electroplating device and electroplating system for coating already conductive structures
ES2637799T3 (en) 2011-11-15 2017-10-17 Ashwin-Ushas Corporation, Inc. Electrochromic device with complementary polymers
CN103046031B (en) * 2012-12-11 2014-08-13 胜宏科技（惠州）股份有限公司 Method for chemically gold-plating circuit board
US9207515B2 (en) 2013-03-15 2015-12-08 Ashwin-Ushas Corporation, Inc. Variable-emittance electrochromic devices and methods of preparing the same
US9632059B2 (en) 2015-09-03 2017-04-25 Ashwin-Ushas Corporation, Inc. Potentiostat/galvanostat with digital interface
US9482880B1 (en) 2015-09-15 2016-11-01 Ashwin-Ushas Corporation, Inc. Electrochromic eyewear
US9945045B2 (en) 2015-12-02 2018-04-17 Ashwin-Ushas Corporation, Inc. Electrochemical deposition apparatus and methods of using the same
CN110499527B (en) * 2019-08-12 2021-07-13 嘉兴市上村电子有限公司 Installation method for BT resin base material electroplating

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619382A (en) * 1970-01-27 1971-11-09 Gen Electric Process of reducing metal compounds to metal in a matrix
DE2101049A1 (en) * 1971-01-11 1972-08-03 Siemens Ag Process for preferably double-sided coating of plastic foils with .Metall
DE3810992A1 (en) * 1988-03-31 1989-10-12 Hoechst Ceram Tec Ag METHOD AND DEVICE FOR PLATING PIN GRID ARRAYS
US5114558A (en) * 1989-02-15 1992-05-19 Kadija Igor V Method and apparatus for manufacturing interconnects with fine lines and spacing
US5516416A (en) * 1994-12-14 1996-05-14 International Business Machines Corporation Apparatus and method for electroplating pin grid array packaging modules
DE19612555C2 (en) * 1996-03-29 1998-03-19 Atotech Deutschland Gmbh Process for the selective electrochemical treatment of printed circuit boards and device for carrying out the process
US5871629A (en) * 1996-09-18 1999-02-16 International Business Machines Corporation Method and apparatus for fixturing substrate assemblies for electrolytic plating
US5869139A (en) * 1997-02-28 1999-02-09 International Business Machines Corporation Apparatus and method for plating pin grid array packaging modules
EP0889680A3 (en) * 1997-07-01 2000-07-05 Deutsche Thomson-Brandt Gmbh Method of removing and/or applying conductive material
DE19822075C2 (en) * 1998-05-16 2002-03-21 Enthone Gmbh Process for the metallic coating of substrates
US6214180B1 (en) * 1999-02-25 2001-04-10 International Business Machines Corporation Method for shorting pin grid array pins for plating
US6197171B1 (en) * 1999-03-31 2001-03-06 International Business Machines Corporation Pin contact mechanism for plating pin grid arrays

Also Published As

Publication number Publication date
EP1198624A1 (en) 2002-04-24
DE10007435A1 (en) 2001-08-23
MXPA01010570A (en) 2003-09-04
EP1198624A4 (en) 2003-05-21
IL145890A0 (en) 2002-07-25
CN1366563A (en) 2002-08-28
CA2369687A1 (en) 2001-08-23
WO2001061079A1 (en) 2001-08-23
KR20020021629A (en) 2002-03-21
AU2001237942A1 (en) 2001-08-27
US20020157959A1 (en) 2002-10-31

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]