BG66267B1 - Method for developing a security document with integrated circuit - Google Patents

Abstract

The invention relates to a method for developing documents protected with a chip (integrated circuit). By the method the chip is built-in directly into part of the document.

Description

Field of application

The present invention generally relates to the production of secured documents.

In particular, the invention relates to a method for producing secure documents containing a chip (integrated circuit).

The invention also relates to a security document produced in accordance with this method and to a method of verifying the authenticity of this document.

BACKGROUND OF THE INVENTION

Many methods are known, similar to the method mentioned above.

Patent DE19601 358 discloses a security document incorporating an integrated circuit (or chip - these two terms are understood to be equivalent herein). The chip is of the classical type - silicon.

WO 1999/054842 discloses a security document, such as a banknote, which incorporates a chip based on a semiconductor organic polymer.

Therefore, the use of a document security chip is known: this offers many interesting perspectives, as the chip offers many options for providing a high level of document security.

But on the other hand, the document protections used above include significant limitations.

In particular, in known methods, a pre-fabricated chip is used for document security. It is therefore necessary to provide for certain steps and means for embedding this chip in the document.

As a result, the document production method is complicated and the requirements are difficult to meet.

In addition, integrating a pre-fabricated chip into a document poses issues that are related to the compatibility and durability of the document / chip link.

Also known is the description of the manufacture of multilayer plastic structures for security documents.

Such descriptions are given, for example, in application WO 1983/000659 and in patent US 5 698 333.

Such multilayer structures may also be of interest for use, for example, in the production of banknotes, which is one of the applications of the present invention.

Such structures really allow the production of banknotes that are very resistant (especially moisture) and that are difficult to imitate.

The two documents mentioned above do not mention or suggest the ability to build a chip directly in multilayer plastic documents, which, as mentioned above, is a much better document security.

Indeed, the two types of documents mentioned above (those with a chip and those with multilayer structures) may indeed be combined.

However, the incorporation of chips into multilayer structures would be problematic and would impose special requirements not included in the descriptions mentioned above.

Even if such an amalgamation is used, the aforementioned problems associated with embedding pre-made chips in secure documents will remain.

Similar technical solutions are also disclosed in patent documents WO 2001/047043 A1; WO 1999/019900 A2. They also do not completely remove the existing restrictions on the production of security documents.

SUMMARY OF THE INVENTION

It is an object of the present invention to realize secured documents by removing the above limitations.

Another object of the present invention is to provide secure documents that are robust and durable (including moisture).

It is another object of the present invention to produce extremely difficult documents to counterfeit.

To achieve these goals, a method is proposed for producing protected chip chip2

66267 Bl cents.

The method according to the present invention involves directly constructing the chip in a particular part of the document in its production, whereby in the multilayer structure of the document, by locally selectively dissolving the dielectric elements, conclusions are drawn on some of the layers that identify the constituent elements of the chip.

The preferred, but not limiting, embodiments of the chip security (integrated circuit) manufacturing method of the present invention are the following:

it is possible for the chip to be based on transistors of organic materials such as conductive polymers;

said materials may be of the F8T2 type and / or PEDOT / IPSS;

it is preferable that the structure of the chip be constructed by direct jet printing;

it is possible to inject ink droplets of an aqueous solution of conductive polymers into said portion of the document upon direct inkjet printing, pre-treating this portion to form hydrophilic and hydrophobic zones;

it is preferable that these areas in the document during its production be constructed by selectively applying a hydrophobic coating in the relevant parts of the document;

said hydrophobic coating may be TEFLON;

it is possible that the construction of said hydrophilic and hydrophobic zones in said part of the document is accomplished by connecting layers of hydrophobic and / or hydrophilic character;

the bonding of the layers may be effected with a binding elastomer;

it is possible to build the structure of a chip into a document by transfer;

it is preferable for the document to be made on the basis of at least one central layer comprising the part in which said chip is to be constructed between two security layers;

preferably the protective layers are made of polypropylene.

The invention also relates to a method for verifying the authenticity of a security document, which method involves retrieving at least one chip information that is built into the security document implemented according to one of the manufacturing method variants disclosed in any is one of the appended claims.

According to one of the preferred, but not limiting, variants of the method of authentication of the security document, authentication is performed without contact with the chip.

According to a third embodiment of the present invention there is provided a security document produced by the method described in one of the appended claims, wherein the chip-protected document has a multilayer structure consisting of plastic layers, wherein in the multilayer structure, by locally selective dissolution of the dielectric elements of some of the layers, conclusions are drawn for the components of the chip.

Preferred but non-limiting embodiments of the security document of the present invention are the following:

it is possible for the document to have one central layer that includes the part in which the chip is built between two security layers;

the document may be of paper type fibrous material.

Embodiments of the invention

Other aspects, objects and advantages of the present invention will become apparent upon familiarity with the following description of one of the preferred embodiments of the invention

It must first be emphasized that the features of "protected documents" which constitute the subject matter of the invention cover banknotes, as well as any documents that must be protected (in particular fiduciary documents, official documents, etc.).

One preferred embodiment of the invention is to produce documents based on a multilayer laminated substrate that contains several plastic layers.

In this respect, the recommendations given in patent document US 5 698 333 could be used.

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This document describes in particular a multilayer structure comprising at least 50% high density polyethylene (density greater than about 0.94) as well as an adhesive resin for lamination between these two layers.

The resin is preferably selected from the group of LDPELow Density Polyethylene and LLDPE (Linear Low Density Polyethylene).

According to the present invention, the multilayer structure described in US 5 698 333 can be used in which the two polyethylene layers are oriented so that one of the main directions of each of these layers coincides.

Alternatively, it is also possible to construct a multilayer structure by overlapping the two sides of a central polyethylene layer with two protective layers, for example polyester or polypropylene.

The bonding of the central layer to the protective layers can be accomplished by laminating using an adhesive.

In particular, it is possible to produce papers of fibrous paper type materials according to the present invention.

In any case, it is important to note that according to the invention, the chip is built directly into the document to be protected during its production, instead of being pre-fabricated into the document, as proposed in known solutions, according to the invention. prior art.

Different methods can be used to build the chip directly in the document in its production.

According to a preferred method, one portion of the document is printed by direct ink jet printing using ink droplets based on an aqueous solution of conductive polymers.

In particular, the ink may contain at least one solvent to facilitate the integration of the polymers.

In order to be able to construct in this part of the document a motif of semiconductor material for critical distances (for example, the distance between the source and the drain of a transistor), which motif should be similar to that obtained for classical transistors, the part is prepared according to in a specific manner as described below.

Such preparation is really necessary as classic direct printing does not allow a resolution higher than 20 mm (1000 dpi).

Therefore, for the desired application, it is necessary to achieve a resolution of the order of 5 mm corresponding to 5000 dpi in order to determine the critical distances mentioned above.

For this purpose, it is necessary to prepare that part of the document in which the chip will be built, before hydrophilic and hydrophobic zones are determined by hydrophobic coating prior to printing with semiconductor ink.

This allows the print part to determine the conductive motif that will be on the chip.

Indeed, during direct printing with semi-conductive ink, this aqueous solution-based semi-conductive ink will be fixed to the hydrophilic zones, thus forming the desired conductive motif.

The direct jet printing step allows the selected part of the document to obtain the conductive motif that defines the chip.

In particular, the hydrophobic coating that serves to shape this motif may be TEFLON.

It is also possible for the hydrophilic and hydrophobic zones to be determined by combining layers of coatings, each layer bearing a motif determined by the selective coating of hydrophilic and / or hydrophobic matter.

In this case, the bonding between the layers can be accomplished with a bonding elastomer applied between each layer.

In particular, the conductive polymers used to prepare the water-based ink may be of the F8T2 type and / or PEDOT / 1PPSS.

In general, the chip used according to the invention is preferably at

66267 Bl based on matched semiconductor polymers.

It should be remembered that these polymers form a class of organic polymers that encompass long atomic chains of hybrid carbon, in which the electronic states change along the polymer chain in a similar fashion to that observed in the benzene molecule.

This feature makes these semiconductor materials jump into the energy band in the visible spectrum, and they can be used in electronic devices as inorganic silicon.

Details of the polymers used can be found in the article Sirringhaus et al. in the journal Nature 401,685 (1999).

Generally, such conducting polymers allow the transistors to be realized and the electrical connections between these transistors.

Alternatively, it is also possible to construct the chip by transforming (cold or warm) a conductive motif, this motif can also be realized on the basis of organic materials of the conductive polymer type. More precisely, this application can be performed in several steps, by successively applying to the desired part of the document sequential conductive motifs in such a way as to create a multi-layered structure. Following the construction (by direct printing or otherwise) of the source electrode source, as explained above, the transistors of the integrated circuit are proceeded to be constructed on the same part of the document.

These transistors are of the type TFT - Thin Film Transistor. For the construction of these TFT transistors based on preformed sourdrain electrodes, a part of the document is coated using a continuous layer of semiconducting polymer.

Persistent polymers with high mobility and auto-organization capability are used for this purpose.

This layer is then covered with a new polymeric coating, which is an electrical polymer, at the inlet and finally from a single line of electrodes at the PEDOT / PSS inlet, passing to the channel separating the source and the drain, and constructed by direct printing.

More details on the production method of chips by printing semiconductor polymers can be found at - http: // homepage, dtn. nt / com / mark. harrisson6 / tech. htm.

To build the links between the chip elements, the dielectric material of some of the layers of a multilayer structure is locally and selectively dissolved, which defines and contains the various chip elements.

Generally, in all embodiments of the invention, the chip is built directly into one part of the document to be protected.

If the document is made on the basis of a multilayer plastic carrier, it is preferable to construct the chip on one central layer, then by lamination this central layer to be combined with two protective surface layers on one side and on the other side.

As mentioned above, this central layer can be polyethylene and the two protective layers are polyester or polypropylene.

Therefore, this method allows a simple way to produce a document containing a chip that provides a very high level of security.

According to the present invention, the problems mentioned in connection with the prior art and relating to the integration of a pre-fabricated chip into a document are avoided.

The chip may represent ordinary memory.

In addition, the chip may also include a microprocessor, which can be used to process data.

Authentication tools are provided to allow the identification of the banknote chip. This makes it possible to provide means of authentication to read the information contained in the chip upon contact with the chip through electrical contact means or remotely, without having contact with the chip, for example through ultra-high frequency means.

Claims (19)

Claims 1. A method for producing secure documents containing a chip, characterized in that the chip is built directly into one part of the document, whereby conclusions are provided in the multilayer structure of the document by locally selectively opening some of the layers, which identify the chip components. Production method according to the preceding claim, characterized in that the chip is constructed on the basis of transistors of organic materials of the conductive polymer type. Production method according to the preceding claim, characterized in that the materials are of the F8T2 type and / or PEDOT / IPSS. Production method according to any one of the preceding claims, characterized in that the chip construction is carried out by direct inkjet printing. Production method according to the preceding claim, characterized in that, in direct jet printing, ink droplets of aqueous conductive polymers are injected into the corresponding portion of the document, which is pre-treated to form hydrophilic and hydrophobic zones. Production method according to the preceding claim, characterized in that 30, said hydrophilic and hydrophobic zones are formed in the respective portion of the document by selectively coating the hydrophobic coating. Production method according to the preceding claim, characterized in that the hydrophobic coating is TEFLON. 3 5 Production method according to any one of the two preceding claims, characterized in that the construction in said part of the document of the respective hydrophilic and hydrophobic zones is accomplished by 4θ bonding of layers bearing a hydrophobic and / or hydrophilic motif. Production method according to the preceding claim, characterized in that the layers are bonded by a binding elastomer. Production method according to claims 1 to 3, characterized in that the structure of a chip is constructed by transfer. Production method according to one of the preceding claims, characterized in that the document is constructed by laminating layers of plastic material. Production method according to the preceding claim, characterized in that the document is constructed on the basis of at least one chip between two protective layers. Production method according to the preceding claim, characterized in that the center layer is polyethylene. Production method according to one of the preceding two claims, characterized in that the protective layers are made of polypropylene. 15. A chip security authentication method, wherein the method comprises reading at least one chip information in a security document constructed according to one of the manufacturing methods according to any one of the preceding claims. 16. A method of authentication according to the preceding claim, characterized in that the verification is performed without contact with the chip. A security document according to any one of claims 1 to 14, comprising a chip, characterized in that the document is a multilayer structure of plastic layers, wherein in a multilayer structure there are conclusions obtained by locally selectively dissolving some of the layers and which identify the chip building blocks. 18. A security document according to the preceding claim, characterized in that there is a central layer in which is included the part on which the chip is formed between two security layers. A security document according to one of the two preceding claims, characterized in that the document is made of fibrous paper-like material.