BG24677A3 - Method of local gold-plating of perforated tape or integrated electronic circuits and device for effect ng same - Google Patents
Method of local gold-plating of perforated tape or integrated electronic circuits and device for effect ng sameInfo
- Publication number
- BG24677A3 BG24677A3 BG024819A BG2481973A BG24677A3 BG 24677 A3 BG24677 A3 BG 24677A3 BG 024819 A BG024819 A BG 024819A BG 2481973 A BG2481973 A BG 2481973A BG 24677 A3 BG24677 A3 BG 24677A3
- Authority
- BG
- Bulgaria
- Prior art keywords
- plating
- effect
- same
- electronic circuits
- integrated electronic
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7238340A FR2203891A1 (en) | 1972-10-24 | 1972-10-24 | Gilding perforated metal workpieces - e.g. for integrated circuitry using automatic appts operating at high speed for local or general gilding |
Publications (1)
Publication Number | Publication Date |
---|---|
BG24677A3 true BG24677A3 (en) | 1978-04-12 |
Family
ID=9106378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BG024819A BG24677A3 (en) | 1972-10-24 | 1973-10-23 | Method of local gold-plating of perforated tape or integrated electronic circuits and device for effect ng same |
Country Status (4)
Country | Link |
---|---|
BG (1) | BG24677A3 (en) |
FR (1) | FR2203891A1 (en) |
HU (1) | HU167100B (en) |
PL (1) | PL89481B1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4367123A (en) * | 1980-07-09 | 1983-01-04 | Olin Corporation | Precision spot plating process and apparatus |
JPS5836067B2 (en) * | 1980-10-16 | 1983-08-06 | アイシン精機株式会社 | Plating equipment for partial plating on the inner edge of the top surface of an annular body |
US9583125B1 (en) * | 2009-12-16 | 2017-02-28 | Magnecomp Corporation | Low resistance interface metal for disk drive suspension component grounding |
-
1972
- 1972-10-24 FR FR7238340A patent/FR2203891A1/en active Granted
-
1973
- 1973-10-04 HU HUCA000352 patent/HU167100B/hu unknown
- 1973-10-19 PL PL16595973A patent/PL89481B1/pl unknown
- 1973-10-23 BG BG024819A patent/BG24677A3/en unknown
Also Published As
Publication number | Publication date |
---|---|
FR2203891B1 (en) | 1975-03-28 |
FR2203891A1 (en) | 1974-05-17 |
HU167100B (en) | 1975-08-28 |
PL89481B1 (en) | 1976-11-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5282081A (en) | Ic device and method of producing same | |
JPS5210075A (en) | Tape of connecting ganggbonding for semiconductor devices and method of making the same | |
JPS5338977A (en) | Method of and apparatus for mounting integrated circuits on board | |
JPS51148362A (en) | Semiconductor device and method of making the same | |
JPS5267582A (en) | Semiconductor device and method of producing same | |
JPS51147979A (en) | Microelectronic device and method of producing same | |
JPS5234682A (en) | Semiconductor device and method of producing same | |
JPS51113475A (en) | Integrated semiconductor circuit and method of producing same | |
JPS525287A (en) | Ic device and method of producing same | |
JPS5226190A (en) | Semiconductor device and method of producing same | |
GB1553730A (en) | Semiconductor device and method of manufacturing the same | |
IL35510A (en) | Method and apparatus for the production of chip board | |
BG24677A3 (en) | Method of local gold-plating of perforated tape or integrated electronic circuits and device for effect ng same | |
JPS51121274A (en) | Semiconductor device and method of producing same | |
JPS5210076A (en) | Tape of connecting ganggbonding for semiconductor devices and method of making the same | |
JPS51120669A (en) | Package for electronic circuits and method of making the same | |
JPS5272584A (en) | Semiconductor device and method of producing same | |
JPS51134589A (en) | Semiconductor device and method of producing same | |
CA915318A (en) | Method and apparatus for manufacture of integrated circuit devices | |
JPS5234677A (en) | Ic device and method of producing same | |
CS182326B1 (en) | Assembly elements of printed circuits disoldering method and apparatus | |
ZA717238B (en) | Method and apparatus for the electronic testing of coins | |
JPS5229960A (en) | Electronic parts* method of covering same and covering device | |
JPS523160A (en) | Method of connecting electronic circuits | |
JPS5283081A (en) | Semiconductor device and method of producing same |