BE814391A - SEMICONDUCTOR MODULE - Google Patents

SEMICONDUCTOR MODULE

Info

Publication number
BE814391A
BE814391A BE143779A BE143779A BE814391A BE 814391 A BE814391 A BE 814391A BE 143779 A BE143779 A BE 143779A BE 143779 A BE143779 A BE 143779A BE 814391 A BE814391 A BE 814391A
Authority
BE
Belgium
Prior art keywords
semiconductor module
semiconductor
module
Prior art date
Application number
BE143779A
Other languages
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19732324370 external-priority patent/DE2324370C3/en
Application filed filed Critical
Publication of BE814391A publication Critical patent/BE814391A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
BE143779A 1973-05-14 1974-04-30 SEMICONDUCTOR MODULE BE814391A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732324370 DE2324370C3 (en) 1973-05-14 Semiconductor component

Publications (1)

Publication Number Publication Date
BE814391A true BE814391A (en) 1974-08-16

Family

ID=5880926

Family Applications (1)

Application Number Title Priority Date Filing Date
BE143779A BE814391A (en) 1973-05-14 1974-04-30 SEMICONDUCTOR MODULE

Country Status (7)

Country Link
JP (1) JPS5421074B2 (en)
AT (1) AT327323B (en)
BE (1) BE814391A (en)
CH (1) CH570701A5 (en)
FR (1) FR2230077B3 (en)
NL (1) NL7406110A (en)
ZA (1) ZA742941B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3215192A1 (en) * 1982-04-23 1983-10-27 Siemens AG, 1000 Berlin und 8000 München CLAMPING DEVICE FOR DISC-SHAPED SEMICONDUCTOR COMPONENTS

Also Published As

Publication number Publication date
ATA361674A (en) 1975-04-15
FR2230077B3 (en) 1977-03-11
NL7406110A (en) 1974-11-18
CH570701A5 (en) 1975-12-15
JPS5421074B2 (en) 1979-07-27
DE2324370B2 (en) 1975-12-11
FR2230077A1 (en) 1974-12-13
DE2324370A1 (en) 1974-11-28
ZA742941B (en) 1975-05-28
JPS5019366A (en) 1975-02-28
AT327323B (en) 1976-01-26

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