BE813190A - Dispositif de refroidissement pour composants a forte dissipation thermique - Google Patents

Dispositif de refroidissement pour composants a forte dissipation thermique

Info

Publication number
BE813190A
BE813190A BE142753A BE142753A BE813190A BE 813190 A BE813190 A BE 813190A BE 142753 A BE142753 A BE 142753A BE 142753 A BE142753 A BE 142753A BE 813190 A BE813190 A BE 813190A
Authority
BE
Belgium
Prior art keywords
components
cooling system
high thermal
thermal dissipation
dissipation
Prior art date
Application number
BE142753A
Other languages
English (en)
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE813190A publication Critical patent/BE813190A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/08Cooling, heating or ventilating arrangements
    • H01C1/082Cooling, heating or ventilating arrangements using forced fluid flow
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
BE142753A 1973-04-03 1974-04-02 Dispositif de refroidissement pour composants a forte dissipation thermique BE813190A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7311980A FR2224875B1 (de) 1973-04-03 1973-04-03

Publications (1)

Publication Number Publication Date
BE813190A true BE813190A (fr) 1974-07-31

Family

ID=9117343

Family Applications (1)

Application Number Title Priority Date Filing Date
BE142753A BE813190A (fr) 1973-04-03 1974-04-02 Dispositif de refroidissement pour composants a forte dissipation thermique

Country Status (6)

Country Link
JP (1) JPS49131385A (de)
BE (1) BE813190A (de)
DE (1) DE2415893A1 (de)
FR (1) FR2224875B1 (de)
GB (1) GB1454836A (de)
IT (1) IT1011209B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5722449Y2 (de) * 1977-12-28 1982-05-15
CH659735A5 (de) * 1982-05-13 1987-02-13 Bbc Brown Boveri & Cie Kuehlkoerper zur fluessigkeitskuehlung von leistungshalbleiterelementen.
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
DE4244721A1 (de) * 1992-05-25 1994-04-21 Mannesmann Ag Elektrische Maschine mit fluidgekühlten Halbleiterelementen
DE4217598A1 (de) * 1992-05-27 1993-12-02 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte, gehäuselose Bausteine
DE4217599C2 (de) * 1992-05-27 1994-08-25 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte, hochintegrierte, gehäuselose Bausteine
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
US7228888B2 (en) * 2005-10-13 2007-06-12 International Business Machines Corporation Rotatable liquid reservoir for computer cooling
KR101622267B1 (ko) * 2008-07-25 2016-05-18 코닌클리케 필립스 엔.브이. 반도체 다이를 냉각하는 냉각 장치
JP2010114121A (ja) * 2008-11-04 2010-05-20 Daikin Ind Ltd 電装部品の放熱器

Also Published As

Publication number Publication date
FR2224875A1 (de) 1974-10-31
DE2415893A1 (de) 1974-10-17
GB1454836A (en) 1976-11-03
JPS49131385A (de) 1974-12-17
IT1011209B (it) 1977-01-20
FR2224875B1 (de) 1978-10-27

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