BE808461A - DIODES WITH MICROBEAM CONNECTIONS AND THEIR MANUFACTURING PROCESS - Google Patents

DIODES WITH MICROBEAM CONNECTIONS AND THEIR MANUFACTURING PROCESS

Info

Publication number
BE808461A
BE808461A BE138720A BE138720A BE808461A BE 808461 A BE808461 A BE 808461A BE 138720 A BE138720 A BE 138720A BE 138720 A BE138720 A BE 138720A BE 808461 A BE808461 A BE 808461A
Authority
BE
Belgium
Prior art keywords
microbeam
diodes
connections
manufacturing process
manufacturing
Prior art date
Application number
BE138720A
Other languages
French (fr)
Inventor
L S Napoli
J J Hughes
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of BE808461A publication Critical patent/BE808461A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
BE138720A 1972-12-11 1973-12-10 DIODES WITH MICROBEAM CONNECTIONS AND THEIR MANUFACTURING PROCESS BE808461A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31408972A 1972-12-11 1972-12-11

Publications (1)

Publication Number Publication Date
BE808461A true BE808461A (en) 1974-03-29

Family

ID=23218508

Family Applications (1)

Application Number Title Priority Date Filing Date
BE138720A BE808461A (en) 1972-12-11 1973-12-10 DIODES WITH MICROBEAM CONNECTIONS AND THEIR MANUFACTURING PROCESS

Country Status (10)

Country Link
JP (1) JPS5116291B2 (en)
BE (1) BE808461A (en)
BR (1) BR7309628D0 (en)
CA (1) CA998186A (en)
DE (1) DE2360055A1 (en)
FR (1) FR2210015A1 (en)
GB (1) GB1451085A (en)
IT (1) IT995593B (en)
NL (1) NL7316869A (en)
SE (1) SE385062B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5368063A (en) * 1976-11-29 1978-06-17 Oki Electric Ind Co Ltd Logical circuit system
SE8306663L (en) * 1982-12-08 1984-06-09 Int Rectifier Corp PROCEDURE FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

Also Published As

Publication number Publication date
JPS4990488A (en) 1974-08-29
IT995593B (en) 1975-11-20
FR2210015A1 (en) 1974-07-05
SE385062B (en) 1976-05-31
DE2360055A1 (en) 1974-06-20
GB1451085A (en) 1976-09-29
NL7316869A (en) 1974-06-13
CA998186A (en) 1976-10-05
BR7309628D0 (en) 1974-08-29
JPS5116291B2 (en) 1976-05-22

Similar Documents

Publication Publication Date Title
BE799903A (en) RACKET AND ITS MANUFACTURING PROCESS
BE809232A (en) POLYVINYL ACETAL MANUFACTURING PROCESS
BE794428A (en) ELECTRICAL CONNECTOR AND ITS MANUFACTURING PROCESS
BE795445A (en) CONVECTOR AND ITS MANUFACTURING PROCESS
FR2327480A1 (en) PIPE AND ITS MANUFACTURING PROCESS
FR2330260A5 (en) THERMOCOPIANT SHEETS AND THEIR MANUFACTURING PROCESS
BE792887A (en) DIE MANUFACTURING PROCESS AND SET
BE808192A (en) TOOTHED BELTS AND MANUFACTURING PROCESS
BE800670Q (en) VISCOSE MANUFACTURING PROCESS
BE804580A (en) ALPHA-PHENYLINDOLE DERIVATIVES, THEIR MANUFACTURING PROCESS AND THEIR USE
BE821864A (en) THERMOPLASTIC SYNTHETIC RUBBERS AND THEIR MANUFACTURING PROCESS
BE810991A (en) IMPROVED CAPSULES AND THEIR MANUFACTURING PROCESS
BE815370A (en) ELECTRIC DISCHARGE TUBE AND ITS MANUFACTURING PROCESS
BE801900A (en) POLYETHYLENE MANUFACTURING PROCESS
BE801692A (en) LAMINATES AND THEIR MANUFACTURING PROCESS
BE808461A (en) DIODES WITH MICROBEAM CONNECTIONS AND THEIR MANUFACTURING PROCESS
BE801184A (en) ADVANCED MAGNETIC TRANSDUCERS AND THEIR MANUFACTURING PROCESS
BE793841A (en) ADVANCED UPHOLSTERY ARTICLES AND THEIR MANUFACTURING PROCESS
BE801535A (en) TERTIOBUTYL-4 TERTIOBUTYL PERBENZOATE AND ITS MANUFACTURING PROCESS
BE795527A (en) CHLORINATED POLYIMIDE-ETHERS AND THEIR MANUFACTURING PROCESS
BE808245A (en) VINCAMONE AND VINCANOL MANUFACTURING PROCESS
BE798978A (en) CRUSHABLE TUBE AND ITS MANUFACTURING PROCESS,
BE882929A (en) TRICYCLIC DIPHENYLAMINE DERIVATIVES AND THEIR MANUFACTURING METHOD
BE802553A (en) PROCESS FOR MANUFACTURING THERMO-FUSE COMPOSITIONS AND RESULTING COMPOSITIONS
CH552894A (en) METHOD OF MANUFACTURING A BATTERY AND BATTERY MANUFACTURED BY THIS PROCESS.