BE805169A - Dispositif pour degager d'une plaque-support un element fonctionnel de faibles dimensions - Google Patents

Dispositif pour degager d'une plaque-support un element fonctionnel de faibles dimensions

Info

Publication number
BE805169A
BE805169A BE135917A BE135917A BE805169A BE 805169 A BE805169 A BE 805169A BE 135917 A BE135917 A BE 135917A BE 135917 A BE135917 A BE 135917A BE 805169 A BE805169 A BE 805169A
Authority
BE
Belgium
Prior art keywords
support plate
functional element
low dimensional
dimensional functional
low
Prior art date
Application number
BE135917A
Other languages
English (en)
French (fr)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BE805169A publication Critical patent/BE805169A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H05K13/0491—Hand tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53274—Means to disassemble electrical device
    • Y10T29/53283—Means comprising hand-manipulatable implement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
BE135917A 1972-09-22 1973-09-21 Dispositif pour degager d'une plaque-support un element fonctionnel de faibles dimensions BE805169A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2246732A DE2246732C3 (de) 1972-09-22 1972-09-22 Vorrichtung zur Entnahme eines mit einer Trägerplatte durch Verlöten von Anschlußelementen verbundenen Bauteils kleiner Abmessungen

Publications (1)

Publication Number Publication Date
BE805169A true BE805169A (fr) 1974-01-16

Family

ID=5857163

Family Applications (1)

Application Number Title Priority Date Filing Date
BE135917A BE805169A (fr) 1972-09-22 1973-09-21 Dispositif pour degager d'une plaque-support un element fonctionnel de faibles dimensions

Country Status (9)

Country Link
US (1) US3842478A (is)
JP (1) JPS5621280B2 (is)
BE (1) BE805169A (is)
DE (1) DE2246732C3 (is)
FR (1) FR2200730B1 (is)
GB (1) GB1401116A (is)
IT (1) IT993273B (is)
NL (1) NL7312784A (is)
SE (1) SE386351B (is)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4022370A (en) * 1976-04-30 1977-05-10 Burroughs Corporation Dual in-line chip extractor-exchanger apparatus
US4141138A (en) * 1977-05-31 1979-02-27 King Radio Corporation Tool for inserting and extracting integrated circuits
US4552300A (en) * 1983-05-09 1985-11-12 Pace, Incorporated Method and apparatus for soldering and desoldering leadless semiconductor modules for printed wiring boards
JPS6035872U (ja) * 1983-08-20 1985-03-12 タキゲン製造株式会社 ステ−
JPS6037567U (ja) * 1983-08-24 1985-03-15 タキゲン製造株式会社 固定型ステ−
JPS6162175U (is) * 1984-09-27 1986-04-26
ATE47641T1 (de) * 1985-05-21 1989-11-15 Cooper Ind Inc Vorrichtung zum loeten und entloeten von oberflaechenmontierten bauelementen.
JPH0531183Y2 (is) * 1986-01-23 1993-08-10
DE4338094C2 (de) * 1993-11-08 1995-08-24 Helmut W Leicht Vorrichtung zum Entlöten eines Gegenstands mittels thermischer Volumenänderung
TWI455244B (zh) * 2012-03-19 2014-10-01 Wistron Corp 用於重工製程之夾持治具及設備
JP6249694B2 (ja) * 2013-09-09 2017-12-20 矢崎総業株式会社 部品取り外し治具
US9591795B2 (en) * 2014-09-18 2017-03-07 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Sensor-based removal of a soldered device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3045336A (en) * 1960-02-15 1962-07-24 Ibm Removal tool
US3377689A (en) * 1965-09-30 1968-04-16 James P. Kimmett Apparatus for removing electrical components from a circuit board
US3557430A (en) * 1968-08-21 1971-01-26 Rca Corp De-soldering apparatus

Also Published As

Publication number Publication date
DE2246732C3 (de) 1975-02-20
JPS5047170A (is) 1975-04-26
GB1401116A (en) 1975-07-16
JPS5621280B2 (is) 1981-05-18
SE386351B (sv) 1976-08-02
FR2200730B1 (is) 1976-05-14
DE2246732A1 (de) 1974-04-04
US3842478A (en) 1974-10-22
NL7312784A (is) 1974-03-26
DE2246732B2 (de) 1974-07-04
IT993273B (it) 1975-09-30
FR2200730A1 (is) 1974-04-19

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