BE797750A - METHOD AND DEVICE FOR THE MANUFACTURE OF PRINTED CIRCUITS - Google Patents

METHOD AND DEVICE FOR THE MANUFACTURE OF PRINTED CIRCUITS

Info

Publication number
BE797750A
BE797750A BE129623A BE129623A BE797750A BE 797750 A BE797750 A BE 797750A BE 129623 A BE129623 A BE 129623A BE 129623 A BE129623 A BE 129623A BE 797750 A BE797750 A BE 797750A
Authority
BE
Belgium
Prior art keywords
manufacture
printed circuits
printed
circuits
Prior art date
Application number
BE129623A
Other languages
Dutch (nl)
Inventor
E C Johnson Et R D Klint
Original Assignee
Buckbee Mears Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buckbee Mears Co filed Critical Buckbee Mears Co
Publication of BE797750A publication Critical patent/BE797750A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesives Or Adhesive Processes (AREA)
BE129623A 1972-07-17 1973-04-04 METHOD AND DEVICE FOR THE MANUFACTURE OF PRINTED CIRCUITS BE797750A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27219872A 1972-07-17 1972-07-17

Publications (1)

Publication Number Publication Date
BE797750A true BE797750A (en) 1973-10-04

Family

ID=23038817

Family Applications (1)

Application Number Title Priority Date Filing Date
BE129623A BE797750A (en) 1972-07-17 1973-04-04 METHOD AND DEVICE FOR THE MANUFACTURE OF PRINTED CIRCUITS

Country Status (8)

Country Link
JP (1) JPS4951561A (en)
BE (1) BE797750A (en)
CA (1) CA990413A (en)
DE (1) DE2333445A1 (en)
FR (1) FR2193301B1 (en)
GB (1) GB1419027A (en)
IT (1) IT991068B (en)
NL (1) NL7304482A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3322772C2 (en) * 1983-06-24 1986-05-22 Didier-Werke Ag, 6200 Wiesbaden Composite film for lining liquid containers
WO2017026208A1 (en) * 2015-08-10 2017-02-16 株式会社村田製作所 Resin multilayer substrate and method for manufacturing same
CN107529294A (en) * 2017-09-27 2017-12-29 生益电子股份有限公司 A kind of PCB preparation method and PCB

Also Published As

Publication number Publication date
NL7304482A (en) 1974-01-21
IT991068B (en) 1975-07-30
JPS4951561A (en) 1974-05-18
FR2193301A1 (en) 1974-02-15
GB1419027A (en) 1975-12-24
CA990413A (en) 1976-06-01
FR2193301B1 (en) 1977-02-04
DE2333445A1 (en) 1974-01-31

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