BE754034A - Dispositif pour l'attache de conducteurs a des semiconducteurs - Google Patents

Dispositif pour l'attache de conducteurs a des semiconducteurs

Info

Publication number
BE754034A
BE754034A BE754034DA BE754034A BE 754034 A BE754034 A BE 754034A BE 754034D A BE754034D A BE 754034DA BE 754034 A BE754034 A BE 754034A
Authority
BE
Belgium
Prior art keywords
semiconductors
attaching conductors
conductors
attaching
Prior art date
Application number
Other languages
English (en)
Inventor
A D Aird
S I Gabrail
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Priority claimed from DE2042463A external-priority patent/DE2042463C2/de
Publication of BE754034A publication Critical patent/BE754034A/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H01L29/0657—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
BE754034D 1969-07-01 1970-07-28 Dispositif pour l'attache de conducteurs a des semiconducteurs BE754034A (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US83821369A 1969-07-01 1969-07-01
GB3535870 1970-07-21
NLAANVRAGE7011336,A NL172903C (nl) 1969-07-01 1970-07-31 Werkwijze voor het vervaardigen van halfgeleiderinrichtingen waarbij de door onderverdeling van een plaat halfgeleidermateriaal te verkrijgen afzonderlijke halfgeleiderelementen met behoud van de plaats ten opzichte van elkaar in de plaat halfgeleidermateriaal na het onderverdelen bijeen worden gehouden op een gemeenschappelijk dragerlichaam.
DE2042463A DE2042463C2 (de) 1970-07-31 1970-08-27 Befestigungsvorrichtung zum Anbringen von äußeren Halbleiterzuleitungen

Publications (1)

Publication Number Publication Date
BE754034A true BE754034A (fr) 1971-01-28

Family

ID=27431121

Family Applications (1)

Application Number Title Priority Date Filing Date
BE754034D BE754034A (fr) 1969-07-01 1970-07-28 Dispositif pour l'attache de conducteurs a des semiconducteurs

Country Status (2)

Country Link
BE (1) BE754034A (fr)
NL (1) NL172903C (fr)

Also Published As

Publication number Publication date
NL172903B (nl) 1983-06-01
NL172903C (nl) 1983-11-01
NL7011336A (fr) 1972-02-02

Similar Documents

Publication Publication Date Title
FR1538006A (fr) Dispositif d'allaitement
FR1528657A (fr) Perfectionnements aux dispositifs d'ensachage
FR1514101A (fr) Dispositif pour faciliter le lavage de la vaisselle
BE778791A (fr) Dispositif d'exploration pour compteur d'electricite
BE747752A (fr) Perfectionnements aux dispositifs d'etancheite
FR94538E (fr) Dispositif d'attache en particulier pour gaines électriques.
BE754034A (fr) Dispositif pour l'attache de conducteurs a des semiconducteurs
FR1504496A (fr) Dispositif d'agrafe-fermoir pour bracelets
FR1516340A (fr) Dispositif pour l'établissement du relevé des températures cutanées
BE750356A (fr) Dispositif de deplacement d'une charge
BE770565A (fr) Dispositif pour empecher l'embuage d'appareils d'observation
FR1502930A (fr) Dispositif de préparation d'une solution
BE758760A (fr) Dispositif d'antipatinage
BE760821A (fr) Dispositif pour concentrer une solution ou une
CH495125A (fr) Dispositif de jonction pour montre-bracelet
BE756755A (fr) Dispositif pour l'entretien des chaussures
CH441855A (fr) Dispositif pour favoriser le développement de plants
FR1488567A (fr) Dispositif pour l'établissement de scintillogrammes
BE746993A (fr) Dispositif d'etancheite
FR1521106A (fr) Dispositif d'introduction pour appareils électroniques
FR1537315A (fr) Dispositif pour l'établissement d'hologrammes
FR1494319A (fr) Dispositif aspirateur pour l'assèchement de surfaces
FR1450803A (fr) Dispositif d'aiguillage pour transporteurs
FR1389031A (fr) Dispositif pour l'obtention de paquets parallélépipédiques
BE757974A (fr) Dispositif d'attache a encadrement du cou pour l'immobilisationde bestiaux

Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: GENERAL ELECTRIC CY

Effective date: 19870731