BE728469A - - Google Patents

Info

Publication number
BE728469A
BE728469A BE728469DA BE728469A BE 728469 A BE728469 A BE 728469A BE 728469D A BE728469D A BE 728469DA BE 728469 A BE728469 A BE 728469A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE728469A publication Critical patent/BE728469A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
BE728469D 1968-02-16 1969-02-14 BE728469A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6802279A NL6802279A (ja) 1968-02-16 1968-02-16

Publications (1)

Publication Number Publication Date
BE728469A true BE728469A (ja) 1969-08-14

Family

ID=19802794

Family Applications (1)

Application Number Title Priority Date Filing Date
BE728469D BE728469A (ja) 1968-02-16 1969-02-14

Country Status (8)

Country Link
US (1) US3628716A (ja)
AT (1) AT299312B (ja)
BE (1) BE728469A (ja)
CH (1) CH503450A (ja)
DE (1) DE1906948A1 (ja)
FR (1) FR2002016A1 (ja)
GB (1) GB1251694A (ja)
NL (1) NL6802279A (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3727822A (en) * 1970-10-05 1973-04-17 Gen Electric Electromagnetic force system for integrated circuit fabrication
US3867232A (en) * 1972-05-22 1975-02-18 Eastman Kodak Co Ultrasonic splicing apparatus
FR2201948B1 (ja) * 1972-10-09 1976-03-26 Saint Gobain
JPS5626788A (en) * 1979-08-14 1981-03-14 Asahi Glass Co Ltd Solder bonding device for ceramic body
DE3118897A1 (de) * 1981-05-13 1982-12-02 Compur-Electronic GmbH, 8000 München Ultraschallschweiss-verfahren und -vorrichtung
US5930666A (en) * 1997-10-09 1999-07-27 Astralux, Incorporated Method and apparatus for packaging high temperature solid state electronic devices
US6885522B1 (en) * 1999-05-28 2005-04-26 Fujitsu Limited Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation
CN100411159C (zh) * 1999-05-28 2008-08-13 富士通株式会社 半导体零件和制造集成电路芯片的方法
DE102004008082A1 (de) * 2004-02-19 2005-09-08 Marconi Communications Gmbh Verfahren zum Bestücken eines Schaltungsträgers
DE102006020418A1 (de) * 2006-04-26 2007-10-31 Herrmann Ultraschalltechnik Gmbh & Co. Kg Vorrichtung zum Bearbeiten von Werkstücken mittels Ultraschall
DE102007058802B3 (de) * 2007-12-06 2009-06-10 Datacon Technology Gmbh Thermodenvorrichtung
DE102008060301B4 (de) * 2008-12-03 2012-05-03 Grenzebach Maschinenbau Gmbh Verfahren und Vorrichtung zum kraftschlüssigen Verbinden von glasartigen Bauteilen mit Metallen sowie Computerprogramm und maschinenlesbarer Träger zur Durchführung des Verfahrens
US10295506B2 (en) * 2014-05-23 2019-05-21 Utcomp Inc. Ultrasound transducer with reduced aperture delay line
DE102015106265A1 (de) 2015-02-06 2016-08-11 Auto-Kabel Management Gmbh Ultraschallschweißvorrichtung sowie Verfahren zum Ultraschallschweißen
US10818514B1 (en) * 2017-07-14 2020-10-27 Triad National Security, Llc Fine wire manipulator

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3201864A (en) * 1960-11-25 1965-08-24 Sonobond Corp Method and apparatus for ultrasonic welding
US3477119A (en) * 1964-11-23 1969-11-11 Bunker Ramo Method and apparatus for forming an electric bond between two metallic members
US3382564A (en) * 1965-09-27 1968-05-14 Gen Dynamics Corp Soldering apparatus and method for microelectronic circuits
US3440118A (en) * 1965-12-17 1969-04-22 Branson Instr Method and apparatus for bonding together a plurality of insulated electrical conductors by sonic energy
US3464102A (en) * 1967-03-10 1969-09-02 Branson Instr Solid acoustic horn with suction means

Also Published As

Publication number Publication date
DE1906948A1 (de) 1969-10-30
GB1251694A (ja) 1971-10-27
AT299312B (de) 1972-06-12
FR2002016A1 (ja) 1969-10-03
NL6802279A (ja) 1969-08-19
US3628716A (en) 1971-12-21
CH503450A (de) 1971-02-15

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