BE723315A - - Google Patents

Info

Publication number
BE723315A
BE723315A BE723315DA BE723315A BE 723315 A BE723315 A BE 723315A BE 723315D A BE723315D A BE 723315DA BE 723315 A BE723315 A BE 723315A
Authority
BE
Belgium
Prior art keywords
foil
layer
transfer material
die
adhesive
Prior art date
Application number
Other languages
English (en)
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE723315A publication Critical patent/BE723315A/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
BE723315D 1968-11-04 1968-11-04 BE723315A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE723315 1968-11-04

Publications (1)

Publication Number Publication Date
BE723315A true BE723315A (de) 1969-04-16

Family

ID=3853774

Family Applications (1)

Application Number Title Priority Date Filing Date
BE723315D BE723315A (de) 1968-11-04 1968-11-04

Country Status (1)

Country Link
BE (1) BE723315A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988003356A2 (en) * 1986-10-27 1988-05-05 Black & Decker Inc. Method and apparatus for producing a stamped substrate
US4897919A (en) * 1986-10-27 1990-02-06 Black & Decker Inc. Method for producing a stamped substrate
US5035049A (en) * 1986-10-27 1991-07-30 Black & Decker Inc. Method for producing a stamped substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988003356A2 (en) * 1986-10-27 1988-05-05 Black & Decker Inc. Method and apparatus for producing a stamped substrate
WO1988003356A3 (en) * 1986-10-27 1988-06-02 Black & Decker Inc Method and apparatus for producing a stamped substrate
US4897919A (en) * 1986-10-27 1990-02-06 Black & Decker Inc. Method for producing a stamped substrate
US5035049A (en) * 1986-10-27 1991-07-30 Black & Decker Inc. Method for producing a stamped substrate

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