BE714152A - - Google Patents

Info

Publication number
BE714152A
BE714152A BE714152DA BE714152A BE 714152 A BE714152 A BE 714152A BE 714152D A BE714152D A BE 714152DA BE 714152 A BE714152 A BE 714152A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE714152A publication Critical patent/BE714152A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/32—Seals for leading-in conductors
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
    • C30B11/04—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt
    • C30B11/08—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt every component of the crystal composition being added during the crystallisation
    • C30B11/12—Vaporous components, e.g. vapour-liquid-solid-growth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/107—Melt
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/17—Vapor-liquid-solid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4922—Contact or terminal manufacturing by assembling plural parts with molding of insulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BE714152D 1967-04-26 1968-04-24 BE714152A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6705847A NL6705847A (zh) 1967-04-26 1967-04-26

Publications (1)

Publication Number Publication Date
BE714152A true BE714152A (zh) 1968-10-24

Family

ID=19799962

Family Applications (1)

Application Number Title Priority Date Filing Date
BE714152D BE714152A (zh) 1967-04-26 1968-04-24

Country Status (9)

Country Link
US (1) US3772774A (zh)
AT (1) AT286411B (zh)
BE (1) BE714152A (zh)
CH (1) CH473469A (zh)
DE (1) DE1765402A1 (zh)
DK (1) DK119668B (zh)
FR (1) FR1563376A (zh)
GB (1) GB1215505A (zh)
NL (1) NL6705847A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0452950A2 (en) * 1990-04-20 1991-10-23 Hitachi, Ltd. Semiconductor device using whiskers and manufacturing method of the same

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5137461A (en) * 1988-06-21 1992-08-11 International Business Machines Corporation Separable electrical connection technology
DE4223152C1 (de) * 1992-07-14 1993-10-21 Sanol Arznei Schwarz Gmbh Vorrichtung und Verfahren zur Herstellung eines Mikrosteckverbindungselementes sowie elektrische Versorgungsleitung mit wenigstens einem Mikrosteckverbindungselement
WO1995003632A1 (en) * 1993-07-19 1995-02-02 Fiber Materials, Inc. Method of fabricating a piezocomposite material
JP3442895B2 (ja) * 1994-07-04 2003-09-02 新光電気工業株式会社 基板製造用焼成体、基板およびその製造方法
TW511103B (en) * 1998-01-16 2002-11-21 Littelfuse Inc Polymer composite materials for electrostatic discharge protection
US7034652B2 (en) * 2001-07-10 2006-04-25 Littlefuse, Inc. Electrostatic discharge multifunction resistor
DE10297040T5 (de) * 2001-07-10 2004-08-05 Littelfuse, Inc., Des Plaines Elektrostatische Entladungsgerät für Netzwerksysteme
US7258819B2 (en) 2001-10-11 2007-08-21 Littelfuse, Inc. Voltage variable substrate material
US7202770B2 (en) 2002-04-08 2007-04-10 Littelfuse, Inc. Voltage variable material for direct application and devices employing same
US7183891B2 (en) 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
US7132922B2 (en) 2002-04-08 2006-11-07 Littelfuse, Inc. Direct application voltage variable material, components thereof and devices employing same
US20050150682A1 (en) * 2004-01-12 2005-07-14 Agere Systems Inc. Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material
US20060152334A1 (en) * 2005-01-10 2006-07-13 Nathaniel Maercklein Electrostatic discharge protection for embedded components

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3346414A (en) * 1964-01-28 1967-10-10 Bell Telephone Labor Inc Vapor-liquid-solid crystal growth technique
US3383760A (en) * 1965-08-09 1968-05-21 Rca Corp Method of making semiconductor devices
US3384955A (en) * 1964-11-04 1968-05-28 Trw Inc Circuit board packaging techniques
NL133717C (zh) * 1965-06-28 1900-01-01
US3433686A (en) * 1966-01-06 1969-03-18 Ibm Process of bonding chips in a substrate recess by epitaxial growth of the bonding material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0452950A2 (en) * 1990-04-20 1991-10-23 Hitachi, Ltd. Semiconductor device using whiskers and manufacturing method of the same
EP0452950A3 (en) * 1990-04-20 1992-07-22 Hitachi, Ltd. Semiconductor device using whiskers and manufacturing method of the same
US5362972A (en) * 1990-04-20 1994-11-08 Hitachi, Ltd. Semiconductor device using whiskers

Also Published As

Publication number Publication date
US3772774A (en) 1973-11-20
GB1215505A (en) 1970-12-09
NL6705847A (zh) 1968-10-28
FR1563376A (zh) 1969-04-11
AT286411B (de) 1970-12-10
DE1765402A1 (de) 1971-07-22
DK119668B (da) 1971-02-08
CH473469A (de) 1969-05-31

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