BE709837A - - Google Patents

Info

Publication number
BE709837A
BE709837A BE709837DA BE709837A BE 709837 A BE709837 A BE 709837A BE 709837D A BE709837D A BE 709837DA BE 709837 A BE709837 A BE 709837A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE709837A publication Critical patent/BE709837A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
BE709837D 1967-01-26 1968-01-24 BE709837A (ja�@�@)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL676701217A NL143369B (nl) 1967-01-26 1967-01-26 Werkwijze voor het aanbrengen van een elektrische aansluiting op een oppervlak van een halfgeleiderinrichting en halfgeleiderinrichting verkregen volgens deze werkwijze.

Publications (1)

Publication Number Publication Date
BE709837A true BE709837A (ja�@�@) 1968-07-24

Family

ID=19799131

Family Applications (1)

Application Number Title Priority Date Filing Date
BE709837D BE709837A (ja�@�@) 1967-01-26 1968-01-24

Country Status (11)

Country Link
JP (1) JPS514631B1 (ja�@�@)
AT (1) AT280351B (ja�@�@)
BE (1) BE709837A (ja�@�@)
CA (1) CA918813A (ja�@�@)
CH (1) CH468698A (ja�@�@)
DE (1) DE1614310C3 (ja�@�@)
ES (1) ES349649A1 (ja�@�@)
FR (1) FR1551826A (ja�@�@)
GB (1) GB1193373A (ja�@�@)
NL (1) NL143369B (ja�@�@)
SE (1) SE363191B (ja�@�@)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2176938A (en) * 1985-06-24 1987-01-07 Nat Semiconductor Corp Pad metallization structure

Also Published As

Publication number Publication date
CA918813A (en) 1973-01-09
ES349649A1 (es) 1969-10-01
GB1193373A (en) 1970-05-28
AT280351B (de) 1970-04-10
CH468698A (de) 1969-02-15
NL6701217A (ja�@�@) 1968-07-29
DE1614310A1 (de) 1970-08-13
NL143369B (nl) 1974-09-16
JPS514631B1 (ja�@�@) 1976-02-13
FR1551826A (ja�@�@) 1968-12-27
DE1614310C3 (de) 1975-05-28
DE1614310B2 (de) 1974-10-10
SE363191B (ja�@�@) 1974-01-07

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