BE708352A - - Google Patents

Info

Publication number
BE708352A
BE708352A BE708352DA BE708352A BE 708352 A BE708352 A BE 708352A BE 708352D A BE708352D A BE 708352DA BE 708352 A BE708352 A BE 708352A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE708352A publication Critical patent/BE708352A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/08—Removing material, e.g. by cutting, by hole drilling
    • B23K15/085—Boring
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
BE708352D 1967-02-14 1967-12-21 BE708352A (US20100170793A1-20100708-C00006.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61596867A 1967-02-14 1967-02-14

Publications (1)

Publication Number Publication Date
BE708352A true BE708352A (US20100170793A1-20100708-C00006.png) 1968-05-02

Family

ID=24467503

Family Applications (1)

Application Number Title Priority Date Filing Date
BE708352D BE708352A (US20100170793A1-20100708-C00006.png) 1967-02-14 1967-12-21

Country Status (4)

Country Link
US (1) US3562009A (US20100170793A1-20100708-C00006.png)
BE (1) BE708352A (US20100170793A1-20100708-C00006.png)
FR (1) FR1559706A (US20100170793A1-20100708-C00006.png)
NL (1) NL6801963A (US20100170793A1-20100708-C00006.png)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3656988A (en) * 1969-02-27 1972-04-18 Watch Stones Co Ltd Method for the fabrication of holes in a workpiece by means of laser-beams and apparatus for the performance of the aforesaid method
US3804667A (en) * 1969-09-30 1974-04-16 Techni Tool Inc Method for opening eyelet holes in printed circuit boards
US3770529A (en) * 1970-08-25 1973-11-06 Ibm Method of fabricating multilayer circuits
DE2230578A1 (de) * 1972-06-22 1974-01-17 Dynamit Nobel Ag Antistatischer und/oder elektrisch leitfaehiger bodenbelag sowie verfahren zu seiner herstellung
US3934109A (en) * 1972-06-23 1976-01-20 The Torrington Company Latch pivot for latch needle
US4042006A (en) * 1973-01-05 1977-08-16 Siemens Aktiengesellschaft Pyrolytic process for producing a band-shaped metal layer on a substrate
US4059707A (en) * 1975-08-29 1977-11-22 Rca Corporation Method of filling apertures with crystalline material
US4074616A (en) * 1975-09-02 1978-02-21 Caterpillar Tractor Co. Aluminum piston with steel reinforced piston ring grooves
US4030190A (en) * 1976-03-30 1977-06-21 International Business Machines Corporation Method for forming a multilayer printed circuit board
US4071932A (en) * 1976-10-28 1978-02-07 Standaart Adrian W Method of making electron guns for cathode ray tubes and the like
US4183137A (en) * 1977-02-15 1980-01-15 Lomerson Robert B Method for metalizing holes in insulation material
US4341942A (en) * 1978-10-31 1982-07-27 International Business Machines Corporation Method of bonding wires to passivated chip microcircuit conductors
US4258468A (en) * 1978-12-14 1981-03-31 Western Electric Company, Inc. Forming vias through multilayer circuit boards
US4224493A (en) * 1978-12-22 1980-09-23 Siegfried Pretzsch Contact switch arrangement
JPS6351398B2 (US20100170793A1-20100708-C00006.png) * 1979-11-16 1988-10-13 Rabato Bogadasu Romasun
US4348253A (en) * 1981-11-12 1982-09-07 Rca Corporation Method for fabricating via holes in a semiconductor wafer
US4627565A (en) * 1982-03-18 1986-12-09 Lomerson Robert B Mechanical bonding of surface conductive layers
US4458134A (en) * 1982-06-30 1984-07-03 Burroughs Corporation Method and apparatus for drilling holes with a laser
US4445978A (en) * 1983-03-09 1984-05-01 Rca Corporation Method for fabricating via connectors through semiconductor wafers
US4628174A (en) * 1984-09-17 1986-12-09 General Electric Company Forming electrical conductors in long microdiameter holes
DE271426T1 (de) * 1986-11-07 1989-01-05 United Technologies Corp., Hartford, Conn. Verfahren zur herstellung eines multimetallischen gegenstandes.
US4808273A (en) * 1988-05-10 1989-02-28 Avantek, Inc. Method of forming completely metallized via holes in semiconductors
US4842699A (en) * 1988-05-10 1989-06-27 Avantek, Inc. Method of selective via-hole and heat sink plating using a metal mask
US4925723A (en) * 1988-09-29 1990-05-15 Microwave Power, Inc. Microwave integrated circuit substrate including metal filled via holes and method of manufacture
US4978639A (en) * 1989-01-10 1990-12-18 Avantek, Inc. Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips
US5189261A (en) * 1990-10-09 1993-02-23 Ibm Corporation Electrical and/or thermal interconnections and methods for obtaining such
US5483100A (en) * 1992-06-02 1996-01-09 Amkor Electronics, Inc. Integrated circuit package with via interconnections formed in a substrate
US5584956A (en) * 1992-12-09 1996-12-17 University Of Iowa Research Foundation Method for producing conductive or insulating feedthroughs in a substrate
US5871868A (en) * 1993-02-26 1999-02-16 General Dynamics Information Systems, Inc. Apparatus and method for machining conductive structures on substrates
US5401913A (en) * 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5614114A (en) * 1994-07-18 1997-03-25 Electro Scientific Industries, Inc. Laser system and method for plating vias
US6675469B1 (en) * 1999-08-11 2004-01-13 Tessera, Inc. Vapor phase connection techniques
AU6640000A (en) * 1999-08-11 2001-03-05 Tessera, Inc. Vapor phase connection techniques
US6908845B2 (en) * 2002-03-28 2005-06-21 Intel Corporation Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US20030183943A1 (en) * 2002-03-28 2003-10-02 Swan Johanna M. Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US6848177B2 (en) 2002-03-28 2005-02-01 Intel Corporation Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
JP2004243404A (ja) * 2003-02-17 2004-09-02 Internatl Business Mach Corp <Ibm> 穴形成方法および穴形成装置
BRPI0510332A (pt) * 2004-04-29 2007-10-23 Siemens Ag processo para a produção de contatos transversais em estruturas de placas de circuitos impressos
EP1762128B1 (de) * 2004-06-30 2016-08-10 Gigaset Communications GmbH Verfahren zur herstellung von durchkontaktierungen aufweisenden leiterplattengebilden
US8569632B2 (en) * 2006-10-16 2013-10-29 Napra Co., Ltd. Wiring board having through hole or non-through hole, and method for producing the same
US7674997B2 (en) * 2006-10-17 2010-03-09 Johns Manville Spinner for fiberizing glass and method
US20090057282A1 (en) * 2007-08-15 2009-03-05 Chunfu Huang Laser machining method utilizing variable inclination angle
US8609512B2 (en) * 2009-03-27 2013-12-17 Electro Scientific Industries, Inc. Method for laser singulation of chip scale packages on glass substrates
DE102010025967B4 (de) * 2010-07-02 2015-12-10 Schott Ag Verfahren zur Erzeugung einer Vielzahl von Löchern, Vorrichtung hierzu und Glas-Interposer
DE102010025966B4 (de) 2010-07-02 2012-03-08 Schott Ag Interposer und Verfahren zum Herstellen von Löchern in einem Interposer
JP5587219B2 (ja) * 2011-01-28 2014-09-10 サンコール株式会社 ステンレス鋼への導電材料の接合方法
US8951350B2 (en) * 2011-05-03 2015-02-10 United Technologies Corporation Coating methods and apparatus
US9951420B2 (en) * 2014-11-10 2018-04-24 Sol Voltaics Ab Nanowire growth system having nanoparticles aerosol generator
CN104661450B (zh) * 2015-02-16 2018-05-04 珠海元盛电子科技股份有限公司 一种基于激光钻孔直接孔金属化的方法

Also Published As

Publication number Publication date
US3562009A (en) 1971-02-09
NL6801963A (US20100170793A1-20100708-C00006.png) 1968-08-15
FR1559706A (US20100170793A1-20100708-C00006.png) 1969-03-14

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