|
US3656988A
(en)
*
|
1969-02-27 |
1972-04-18 |
Watch Stones Co Ltd |
Method for the fabrication of holes in a workpiece by means of laser-beams and apparatus for the performance of the aforesaid method
|
|
US3804667A
(en)
*
|
1969-09-30 |
1974-04-16 |
Techni Tool Inc |
Method for opening eyelet holes in printed circuit boards
|
|
US3770529A
(en)
*
|
1970-08-25 |
1973-11-06 |
Ibm |
Method of fabricating multilayer circuits
|
|
DE2230578A1
(de)
*
|
1972-06-22 |
1974-01-17 |
Dynamit Nobel Ag |
Antistatischer und/oder elektrisch leitfaehiger bodenbelag sowie verfahren zu seiner herstellung
|
|
US3934109A
(en)
*
|
1972-06-23 |
1976-01-20 |
The Torrington Company |
Latch pivot for latch needle
|
|
US4042006A
(en)
*
|
1973-01-05 |
1977-08-16 |
Siemens Aktiengesellschaft |
Pyrolytic process for producing a band-shaped metal layer on a substrate
|
|
US4059707A
(en)
*
|
1975-08-29 |
1977-11-22 |
Rca Corporation |
Method of filling apertures with crystalline material
|
|
US4074616A
(en)
*
|
1975-09-02 |
1978-02-21 |
Caterpillar Tractor Co. |
Aluminum piston with steel reinforced piston ring grooves
|
|
US4030190A
(en)
*
|
1976-03-30 |
1977-06-21 |
International Business Machines Corporation |
Method for forming a multilayer printed circuit board
|
|
US4071932A
(en)
*
|
1976-10-28 |
1978-02-07 |
Standaart Adrian W |
Method of making electron guns for cathode ray tubes and the like
|
|
US4183137A
(en)
*
|
1977-02-15 |
1980-01-15 |
Lomerson Robert B |
Method for metalizing holes in insulation material
|
|
US4341942A
(en)
*
|
1978-10-31 |
1982-07-27 |
International Business Machines Corporation |
Method of bonding wires to passivated chip microcircuit conductors
|
|
US4258468A
(en)
*
|
1978-12-14 |
1981-03-31 |
Western Electric Company, Inc. |
Forming vias through multilayer circuit boards
|
|
US4224493A
(en)
*
|
1978-12-22 |
1980-09-23 |
Siegfried Pretzsch |
Contact switch arrangement
|
|
EP0040190B1
(en)
*
|
1979-11-16 |
1988-06-08 |
LOMERSON, Robert Bogardus |
Method for metalizing holes in insulating material
|
|
US4348253A
(en)
*
|
1981-11-12 |
1982-09-07 |
Rca Corporation |
Method for fabricating via holes in a semiconductor wafer
|
|
US4627565A
(en)
*
|
1982-03-18 |
1986-12-09 |
Lomerson Robert B |
Mechanical bonding of surface conductive layers
|
|
US4458134A
(en)
*
|
1982-06-30 |
1984-07-03 |
Burroughs Corporation |
Method and apparatus for drilling holes with a laser
|
|
US4445978A
(en)
*
|
1983-03-09 |
1984-05-01 |
Rca Corporation |
Method for fabricating via connectors through semiconductor wafers
|
|
US4628174A
(en)
*
|
1984-09-17 |
1986-12-09 |
General Electric Company |
Forming electrical conductors in long microdiameter holes
|
|
DE271426T1
(de)
*
|
1986-11-07 |
1989-01-05 |
United Technologies Corp., Hartford, Conn. |
Verfahren zur herstellung eines multimetallischen gegenstandes.
|
|
US4808273A
(en)
*
|
1988-05-10 |
1989-02-28 |
Avantek, Inc. |
Method of forming completely metallized via holes in semiconductors
|
|
US4842699A
(en)
*
|
1988-05-10 |
1989-06-27 |
Avantek, Inc. |
Method of selective via-hole and heat sink plating using a metal mask
|
|
US4925723A
(en)
*
|
1988-09-29 |
1990-05-15 |
Microwave Power, Inc. |
Microwave integrated circuit substrate including metal filled via holes and method of manufacture
|
|
US4978639A
(en)
*
|
1989-01-10 |
1990-12-18 |
Avantek, Inc. |
Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips
|
|
US5189261A
(en)
*
|
1990-10-09 |
1993-02-23 |
Ibm Corporation |
Electrical and/or thermal interconnections and methods for obtaining such
|
|
US5483100A
(en)
*
|
1992-06-02 |
1996-01-09 |
Amkor Electronics, Inc. |
Integrated circuit package with via interconnections formed in a substrate
|
|
US5584956A
(en)
*
|
1992-12-09 |
1996-12-17 |
University Of Iowa Research Foundation |
Method for producing conductive or insulating feedthroughs in a substrate
|
|
US5871868A
(en)
*
|
1993-02-26 |
1999-02-16 |
General Dynamics Information Systems, Inc. |
Apparatus and method for machining conductive structures on substrates
|
|
US5401913A
(en)
*
|
1993-06-08 |
1995-03-28 |
Minnesota Mining And Manufacturing Company |
Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
|
|
US5614114A
(en)
*
|
1994-07-18 |
1997-03-25 |
Electro Scientific Industries, Inc. |
Laser system and method for plating vias
|
|
US5593606A
(en)
*
|
1994-07-18 |
1997-01-14 |
Electro Scientific Industries, Inc. |
Ultraviolet laser system and method for forming vias in multi-layered targets
|
|
EP1206325A4
(en)
*
|
1999-08-11 |
2006-08-02 |
Tessera Inc |
CONNECTION TECHNOLOGY IN THE GAS PHASE
|
|
US6675469B1
(en)
*
|
1999-08-11 |
2004-01-13 |
Tessera, Inc. |
Vapor phase connection techniques
|
|
US6908845B2
(en)
*
|
2002-03-28 |
2005-06-21 |
Intel Corporation |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
|
|
US20030183943A1
(en)
*
|
2002-03-28 |
2003-10-02 |
Swan Johanna M. |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
|
|
US6848177B2
(en)
*
|
2002-03-28 |
2005-02-01 |
Intel Corporation |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
|
|
JP2004243404A
(ja)
*
|
2003-02-17 |
2004-09-02 |
Internatl Business Mach Corp <Ibm> |
穴形成方法および穴形成装置
|
|
KR20070004929A
(ko)
*
|
2004-04-29 |
2007-01-09 |
지멘스 악티엔게젤샤프트 |
인쇄회로기판 세트들에서 횡연결들을 생성하기 위한 방법
|
|
WO2006003097A1
(de)
*
|
2004-06-30 |
2006-01-12 |
Siemens Aktiengesellschaft |
Verfahren zur herstellung von durchkontaktierungen aufweisenden leiterplattengebilden, elektronische geräteeinheit und verwendung einer flexiblen leiterbahnenfolie in einer solchen geräteeinheit
|
|
US8569632B2
(en)
*
|
2006-10-16 |
2013-10-29 |
Napra Co., Ltd. |
Wiring board having through hole or non-through hole, and method for producing the same
|
|
US7674997B2
(en)
*
|
2006-10-17 |
2010-03-09 |
Johns Manville |
Spinner for fiberizing glass and method
|
|
US20090057282A1
(en)
*
|
2007-08-15 |
2009-03-05 |
Chunfu Huang |
Laser machining method utilizing variable inclination angle
|
|
US8609512B2
(en)
*
|
2009-03-27 |
2013-12-17 |
Electro Scientific Industries, Inc. |
Method for laser singulation of chip scale packages on glass substrates
|
|
DE102010025967B4
(de)
*
|
2010-07-02 |
2015-12-10 |
Schott Ag |
Verfahren zur Erzeugung einer Vielzahl von Löchern, Vorrichtung hierzu und Glas-Interposer
|
|
DE102010025966B4
(de)
|
2010-07-02 |
2012-03-08 |
Schott Ag |
Interposer und Verfahren zum Herstellen von Löchern in einem Interposer
|
|
JP5587219B2
(ja)
*
|
2011-01-28 |
2014-09-10 |
サンコール株式会社 |
ステンレス鋼への導電材料の接合方法
|
|
US8951350B2
(en)
*
|
2011-05-03 |
2015-02-10 |
United Technologies Corporation |
Coating methods and apparatus
|
|
US9951420B2
(en)
*
|
2014-11-10 |
2018-04-24 |
Sol Voltaics Ab |
Nanowire growth system having nanoparticles aerosol generator
|
|
CN104661450B
(zh)
*
|
2015-02-16 |
2018-05-04 |
珠海元盛电子科技股份有限公司 |
一种基于激光钻孔直接孔金属化的方法
|
