BE705527A - - Google Patents

Info

Publication number
BE705527A
BE705527A BE705527DA BE705527A BE 705527 A BE705527 A BE 705527A BE 705527D A BE705527D A BE 705527DA BE 705527 A BE705527 A BE 705527A
Authority
BE
Belgium
Prior art keywords
notches
diamond segments
web
diamond
improvements according
Prior art date
Application number
Other languages
English (en)
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE705527A publication Critical patent/BE705527A/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B24D5/123—Cut-off wheels having different cutting segments

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
BE705527D 1967-10-24 1967-10-24 BE705527A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE705527 1967-10-24

Publications (1)

Publication Number Publication Date
BE705527A true BE705527A (https=) 1968-03-01

Family

ID=3851712

Family Applications (1)

Application Number Title Priority Date Filing Date
BE705527D BE705527A (https=) 1967-10-24 1967-10-24

Country Status (1)

Country Link
BE (1) BE705527A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002002265A1 (en) * 2000-06-29 2002-01-10 Advanced Micro Devices, Inc. Saw blade for cutting integrated circuit package boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002002265A1 (en) * 2000-06-29 2002-01-10 Advanced Micro Devices, Inc. Saw blade for cutting integrated circuit package boards
US6422229B1 (en) 2000-06-29 2002-07-23 Advanced Micro Devices, Inc. Saw blade for cutting integrated circuit package boards

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