BE705527A - - Google Patents
Info
- Publication number
- BE705527A BE705527A BE705527DA BE705527A BE 705527 A BE705527 A BE 705527A BE 705527D A BE705527D A BE 705527DA BE 705527 A BE705527 A BE 705527A
- Authority
- BE
- Belgium
- Prior art keywords
- notches
- diamond segments
- web
- diamond
- improvements according
- Prior art date
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 41
- 239000010432 diamond Substances 0.000 claims description 40
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 238000005520 cutting process Methods 0.000 claims description 7
- 230000008901 benefit Effects 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000011218 segmentation Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/02—Circular saw blades
- B23D61/021—Types of set; Variable teeth, e.g. variable in height or gullet depth; Varying pitch; Details of gullet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/02—Circular saw blades
- B23D61/025—Details of saw blade body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
- B24D5/123—Cut-off wheels having different cutting segments
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE705527 | 1967-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE705527A true BE705527A (enrdf_load_html_response) | 1968-03-01 |
Family
ID=3851712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE705527D BE705527A (enrdf_load_html_response) | 1967-10-24 | 1967-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| BE (1) | BE705527A (enrdf_load_html_response) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002002265A1 (en) * | 2000-06-29 | 2002-01-10 | Advanced Micro Devices, Inc. | Saw blade for cutting integrated circuit package boards |
-
1967
- 1967-10-24 BE BE705527D patent/BE705527A/fr unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002002265A1 (en) * | 2000-06-29 | 2002-01-10 | Advanced Micro Devices, Inc. | Saw blade for cutting integrated circuit package boards |
| US6422229B1 (en) | 2000-06-29 | 2002-07-23 | Advanced Micro Devices, Inc. | Saw blade for cutting integrated circuit package boards |
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