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Publication of BE696872ApublicationCriticalpatent/BE696872A/fr
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/02—Containers; Seals
H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Physics & Mathematics
(AREA)
Condensed Matter Physics & Semiconductors
(AREA)
General Physics & Mathematics
(AREA)
Engineering & Computer Science
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Computer Hardware Design
(AREA)
Microelectronics & Electronic Packaging
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Power Engineering
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Cooling Or The Like Of Semiconductors Or Solid State Devices
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Boitier en metal et resine pour dispositif a semi-conducteur, susceptible d'etre fixe sur un dissipateur non parfaitement plan, et son procede de fabrication