BE684350A - - Google Patents

Info

Publication number
BE684350A
BE684350A BE684350DA BE684350A BE 684350 A BE684350 A BE 684350A BE 684350D A BE684350D A BE 684350DA BE 684350 A BE684350 A BE 684350A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE684350A publication Critical patent/BE684350A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0444Apparatus for wiring semiconductor or solid-state device
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires
    • H10W72/552Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires
    • H10W72/552Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
BE684350D 1965-07-19 1966-07-19 BE684350A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47299965 US3458921A (en) 1965-07-19 1965-07-19 Short pulse vibratory bonding

Publications (1)

Publication Number Publication Date
BE684350A true BE684350A (https=) 1967-01-03

Family

ID=23877760

Family Applications (1)

Application Number Title Priority Date Filing Date
BE684350D BE684350A (https=) 1965-07-19 1966-07-19

Country Status (7)

Country Link
US (1) US3458921A (https=)
BE (1) BE684350A (https=)
DE (1) DE1577011A1 (https=)
FR (1) FR1487050A (https=)
GB (1) GB1153002A (https=)
NL (1) NL6610145A (https=)
SE (1) SE333413B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL162580B (nl) * 1970-12-17 1980-01-15 Philips Nv Werkwijze voor het ultrasoonlassen van draden op het metalen oppervlak van een drager.
US3791028A (en) * 1971-09-17 1974-02-12 Ibm Ultrasonic bonding of cubic crystal-structure metals
US4047657A (en) * 1976-11-01 1977-09-13 Branson Ultrasonics Corporation Method and apparatus for joining metal workpieces using high frequency vibratory energy
US4352972A (en) 1980-07-09 1982-10-05 Lebedev Vladimir K Method of resistance flash butt welding
US4373653A (en) * 1981-09-10 1983-02-15 Raytheon Company Method and apparatus for ultrasonic bonding
EP1332826A1 (de) * 2002-02-01 2003-08-06 Esec Trading S.A. Verfahren für die Bestimmung optimaler Bondparameter beim Bonden mit einem Wire Bonder
KR20030066344A (ko) * 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법
TWI229397B (en) * 2002-10-16 2005-03-11 Esec Trading Sa Method for determining optimum bond parameters when bonding with a wire bonder
DE10347984A1 (de) * 2003-10-15 2005-05-19 Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co Verfahren zum Vibrationsschweißen mit verkürtzter Ausschwingzeit
US7044356B2 (en) * 2003-12-11 2006-05-16 Texas Instruments Incorporated Roller wire brake for wire bonding machine
DE102007054626A1 (de) * 2007-11-12 2009-05-14 Hesse & Knipps Gmbh Verfahren und Vorrichtung zum Ultraschallbonden
DE102009059307A1 (de) * 2009-12-23 2011-06-30 Schunk Sonosystems GmbH, 35435 Verfahren zum elektrisch leitenden Verbinden von Drähten
US20120074206A1 (en) * 2010-09-27 2012-03-29 Kulicke And Soffa Industries, Inc. Methods of forming wire bonds for wire loops and conductive bumps
CN114705357B (zh) * 2022-04-19 2024-03-26 上海工业自动化仪表研究院有限公司 用于磁弹性传感器的相敏解调修正方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056192A (en) * 1957-12-30 1962-10-02 Sonobond Corp Vibratory welding process and apparatus
US3017792A (en) * 1958-07-08 1962-01-23 Aeroprojects Inc Vibratory device
NL282318A (https=) * 1961-08-30 1900-01-01
US3158928A (en) * 1962-03-30 1964-12-01 Aeroprojects Inc Method and means for operating a generating means coupled through a transducer to a vibratory energy work performing device
US3153850A (en) * 1962-07-18 1964-10-27 Daniel C Worlton Method and device for controlling ultrasonic welding apparatus
US3341935A (en) * 1964-04-23 1967-09-19 Cavitron Ultrasonics Inc Energy storage in high frequency vibratory devices

Also Published As

Publication number Publication date
FR1487050A (fr) 1967-06-30
DE1577011A1 (de) 1969-07-10
GB1153002A (en) 1969-05-21
SE333413B (https=) 1971-03-15
US3458921A (en) 1969-08-05
NL6610145A (https=) 1967-01-20

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