BE676467A - - Google Patents
Info
- Publication number
- BE676467A BE676467A BE676467DA BE676467A BE 676467 A BE676467 A BE 676467A BE 676467D A BE676467D A BE 676467DA BE 676467 A BE676467 A BE 676467A
- Authority
- BE
- Belgium
Links
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Wire Bonding (AREA)
- Bipolar Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEJ27519A DE1283969B (de) | 1965-02-16 | 1965-02-16 | Halbleiterbauelement mit elektrisch isolierendem Zwischenkoerper zwischen dem Halbleiterkoerper und einem Gehaeuseteil, sowie Verfahren zu seiner Herstellung |
Publications (1)
Publication Number | Publication Date |
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BE676467A true BE676467A (fr) | 1966-08-16 |
Family
ID=7202990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE676467D BE676467A (fr) | 1965-02-16 | 1966-02-15 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3471752A (fr) |
BE (1) | BE676467A (fr) |
DE (1) | DE1283969B (fr) |
GB (1) | GB1066200A (fr) |
IE (1) | IE29877L (fr) |
NL (1) | NL153722B (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5631892B2 (fr) * | 1972-04-27 | 1981-07-24 | ||
JPS49113555U (fr) * | 1973-01-25 | 1974-09-27 | ||
US3814994A (en) * | 1973-03-07 | 1974-06-04 | Gen Motors Corp | Four terminal power transistor |
US4180414A (en) * | 1978-07-10 | 1979-12-25 | Optical Coating Laboratory, Inc. | Concentrator solar cell array module |
JPS5753947A (en) * | 1980-09-17 | 1982-03-31 | Hitachi Ltd | Transistor and electronic device containing it |
US5317194A (en) * | 1989-10-17 | 1994-05-31 | Kabushiki Kaisha Toshiba | Resin-sealed semiconductor device having intermediate silicon thermal dissipation means and embedded heat sink |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL190331A (fr) * | 1954-08-26 | 1900-01-01 | ||
US2948835A (en) * | 1958-10-21 | 1960-08-09 | Texas Instruments Inc | Transistor structure |
US3020454A (en) * | 1959-11-09 | 1962-02-06 | Solid State Products Inc | Sealing of electrical semiconductor devices |
US3160798A (en) * | 1959-12-07 | 1964-12-08 | Gen Electric | Semiconductor devices including means for securing the elements |
BE638960A (fr) * | 1962-10-23 | |||
CH440478A (de) * | 1963-07-01 | 1967-07-31 | Asea Ab | Verfahren zum Herabsetzen der Durchlasspannung in einem gleichrichtenden Halbleiterkörper und Anordnung zur Ausführung des Verfahrens |
US3290570A (en) * | 1964-04-28 | 1966-12-06 | Texas Instruments Inc | Multilevel expanded metallic contacts for semiconductor devices |
US3283224A (en) * | 1965-08-18 | 1966-11-01 | Trw Semiconductors Inc | Mold capping semiconductor device |
-
1965
- 1965-02-16 DE DEJ27519A patent/DE1283969B/de active Pending
-
1966
- 1966-01-28 GB GB3900/66A patent/GB1066200A/en not_active Expired
- 1966-02-03 US US524812A patent/US3471752A/en not_active Expired - Lifetime
- 1966-02-03 IE IE660112A patent/IE29877L/xx unknown
- 1966-02-14 NL NL666601886A patent/NL153722B/xx unknown
- 1966-02-15 BE BE676467D patent/BE676467A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
US3471752A (en) | 1969-10-07 |
NL6601886A (fr) | 1966-08-17 |
NL153722B (nl) | 1977-06-15 |
IE29877L (en) | 1966-08-16 |
DE1283969B (de) | 1968-11-28 |
GB1066200A (en) | 1967-04-19 |