BE657987A - - Google Patents

Info

Publication number
BE657987A
BE657987A BE657987DA BE657987A BE 657987 A BE657987 A BE 657987A BE 657987D A BE657987D A BE 657987DA BE 657987 A BE657987 A BE 657987A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE657987A publication Critical patent/BE657987A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
BE657987D 1964-01-07 1965-01-07 BE657987A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB70564 1964-01-07

Publications (1)

Publication Number Publication Date
BE657987A true BE657987A (xx) 1965-07-07

Family

ID=9709108

Family Applications (1)

Application Number Title Priority Date Filing Date
BE657987D BE657987A (xx) 1964-01-07 1965-01-07

Country Status (6)

Country Link
US (1) US3367806A (xx)
BE (1) BE657987A (xx)
DE (1) DE1546014A1 (xx)
FR (1) FR87277E (xx)
GB (1) GB1023532A (xx)
NL (1) NL6500171A (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1023532A (xx) * 1964-01-07
US3480841A (en) * 1967-01-13 1969-11-25 Ibm Solderable backside ohmic contact metal system for semiconductor devices and fabrication process therefor
US3529350A (en) * 1968-12-09 1970-09-22 Gen Electric Thin film resistor-conductor system employing beta-tungsten resistor films
US3657029A (en) * 1968-12-31 1972-04-18 Texas Instruments Inc Platinum thin-film metallization method
US3642548A (en) * 1969-08-20 1972-02-15 Siemens Ag Method of producing integrated circuits
US3653999A (en) * 1970-09-25 1972-04-04 Texas Instruments Inc Method of forming beam leads on semiconductor devices and integrated circuits
US3961982A (en) * 1974-01-04 1976-06-08 Itek Corporation Method of removing silver images from aluminum lithographic plates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1277057A (fr) * 1959-12-31 1961-11-24 Siemens Ag Procédé d'apport de couches soudables sur des métaux ou des semi-conducteurs difficiles à souder, notamment sur des branches de couples thermo-électriques en tellurure de bismuth
US3256588A (en) * 1962-10-23 1966-06-21 Philco Corp Method of fabricating thin film r-c circuits on single substrate
GB1023532A (xx) * 1964-01-07

Also Published As

Publication number Publication date
FR87277E (fr) 1966-07-08
NL6500171A (xx) 1965-07-08
DE1546014A1 (de) 1970-02-05
US3367806A (en) 1968-02-06
GB1023532A (xx)

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