BE643415A - - Google Patents
Info
- Publication number
- BE643415A BE643415A BE643415A BE643415A BE643415A BE 643415 A BE643415 A BE 643415A BE 643415 A BE643415 A BE 643415A BE 643415 A BE643415 A BE 643415A BE 643415 A BE643415 A BE 643415A
- Authority
- BE
- Belgium
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB484063A GB1000023A (en) | 1963-02-06 | 1963-02-06 | Semi-conductor devices |
GB1125263 | 1963-03-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE643415A true BE643415A (es) | 1964-05-29 |
Family
ID=26239407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE643415A BE643415A (es) | 1963-02-06 | 1964-02-05 |
Country Status (2)
Country | Link |
---|---|
BE (1) | BE643415A (es) |
GB (1) | GB1000023A (es) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL136731C (es) * | 1965-06-23 | |||
GB1147645A (en) * | 1965-07-01 | 1969-04-02 | English Electric Co Ltd | Housings for semi-conductor devices |
US3513361A (en) * | 1968-05-09 | 1970-05-19 | Westinghouse Electric Corp | Flat package electrical device |
US3571663A (en) * | 1969-01-08 | 1971-03-23 | Chemetron Corp | Releasable clamp assembly for a solid state circuit element |
US3651383A (en) * | 1970-02-05 | 1972-03-21 | Gen Electric | Unitary high power semiconductor subassembly suitable for mounting on a separable heat sink |
CH522288A (de) * | 1970-09-29 | 1972-06-15 | Bbc Brown Boveri & Cie | Halbleitereinheit und Verfahren zur Herstellung derselben |
CA2255441C (en) * | 1997-12-08 | 2003-08-05 | Hiroki Sekiya | Package for semiconductor power device and method for assembling the same |
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1963
- 1963-02-06 GB GB484063A patent/GB1000023A/en not_active Expired
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1964
- 1964-02-05 BE BE643415A patent/BE643415A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
GB1000023A (en) | 1965-08-04 |