BE638960A - - Google Patents
Info
- Publication number
- BE638960A BE638960A BE638960DA BE638960A BE 638960 A BE638960 A BE 638960A BE 638960D A BE638960D A BE 638960DA BE 638960 A BE638960 A BE 638960A
- Authority
- BE
- Belgium
Links
Classifications
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- H10W76/17—
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- H10W72/00—
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- H10W72/071—
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- H10W76/10—
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- H10W76/60—
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- H10W99/00—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/926—Elongated lead extending axially through another elongated lead
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US232546A US3252060A (en) | 1962-10-23 | 1962-10-23 | Variable compression contacted semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE638960A true BE638960A (cg-RX-API-DMAC10.html) |
Family
ID=22873575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE638960D BE638960A (cg-RX-API-DMAC10.html) | 1962-10-23 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3252060A (cg-RX-API-DMAC10.html) |
| BE (1) | BE638960A (cg-RX-API-DMAC10.html) |
| GB (1) | GB1009926A (cg-RX-API-DMAC10.html) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3378735A (en) * | 1963-06-12 | 1968-04-16 | Siemens Ag | Semiconductor device housing with spring contact means and improved thermal characteristics |
| SE310385B (cg-RX-API-DMAC10.html) * | 1964-10-29 | 1969-04-28 | G Barrling | |
| DE1489791A1 (de) * | 1964-12-22 | 1969-06-12 | Ckd Praha Narodni Podnik | Halbleiterbauelement mit einer Flaechenhalbleiteranordnung zwischen durch Federdruck angepressten Elektrodenkontaktplatten |
| DE1283969B (de) * | 1965-02-16 | 1968-11-28 | Itt Ind Gmbh Deutsche | Halbleiterbauelement mit elektrisch isolierendem Zwischenkoerper zwischen dem Halbleiterkoerper und einem Gehaeuseteil, sowie Verfahren zu seiner Herstellung |
| US3409808A (en) * | 1965-03-12 | 1968-11-05 | Int Rectifier Corp | High voltage diode for low pressure applications |
| GB1140677A (en) * | 1965-05-07 | 1969-01-22 | Ass Elect Ind | Improvements relating to semi-conductor devices |
| US3337781A (en) * | 1965-06-14 | 1967-08-22 | Westinghouse Electric Corp | Encapsulation means for a semiconductor device |
| GB1147645A (en) * | 1965-07-01 | 1969-04-02 | English Electric Co Ltd | Housings for semi-conductor devices |
| US3450962A (en) * | 1966-02-01 | 1969-06-17 | Westinghouse Electric Corp | Pressure electrical contact assembly for a semiconductor device |
| US3382419A (en) * | 1966-05-12 | 1968-05-07 | Int Rectifier Corp | Large area wafer semiconductor device |
| GB1121717A (en) * | 1966-06-20 | 1968-07-31 | Ass Elect Ind | Improvements in semi-conductor devices |
| GB1128400A (en) * | 1966-11-04 | 1968-09-25 | Ass Elect Ind | Pressure contact semi-conductor devices |
| US3427395A (en) * | 1967-04-27 | 1969-02-11 | Int Rectifier Corp | Steel insert for semiconductor device stud |
| US4684763A (en) * | 1984-05-28 | 1987-08-04 | Koto Electric Co., Ltd. | Hermetically sealable package for electronic component |
| US4624303A (en) * | 1985-04-29 | 1986-11-25 | The Nippert Company | Heat sink mounting and method of making |
| US20090103342A1 (en) * | 2007-10-17 | 2009-04-23 | Saul Lin | Silicon-controlled rectifier with a heat-dissipating structure |
| CN103168356B (zh) * | 2011-10-13 | 2014-07-02 | 丰田自动车株式会社 | 半导体模块 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB853876A (en) * | 1956-08-15 | 1960-11-09 | Sarkes Tarzian | Semiconductor diode |
| US3025435A (en) * | 1959-05-15 | 1962-03-13 | Tung Sol Electric Inc | Casing for semiconductor diode |
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0
- BE BE638960D patent/BE638960A/xx unknown
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1962
- 1962-10-23 US US232546A patent/US3252060A/en not_active Expired - Lifetime
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1963
- 1963-09-26 GB GB37883/63A patent/GB1009926A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1009926A (en) | 1965-11-17 |
| US3252060A (en) | 1966-05-17 |