BE626623A - - Google Patents

Info

Publication number
BE626623A
BE626623A BE626623DA BE626623A BE 626623 A BE626623 A BE 626623A BE 626623D A BE626623D A BE 626623DA BE 626623 A BE626623 A BE 626623A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of BE626623A publication Critical patent/BE626623A/xx

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
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    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
BE626623D 1961-12-30 BE626623A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1961S0077373 DE1236660C2 (de) 1961-12-30 1961-12-30 Halbleiteranordnung mit einem plattenfoermigen, im wesentlichen einkristallinen halbleiterkoerper

Publications (1)

Publication Number Publication Date
BE626623A true BE626623A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1900-01-01

Family

ID=7506765

Family Applications (1)

Application Number Title Priority Date Filing Date
BE626623D BE626623A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1961-12-30

Country Status (6)

Country Link
US (1) US3293509A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
BE (1) BE626623A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CH (1) CH406443A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE1236660C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB977284A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (1) NL286498A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3378735A (en) * 1963-06-12 1968-04-16 Siemens Ag Semiconductor device housing with spring contact means and improved thermal characteristics
US3460002A (en) * 1965-09-29 1969-08-05 Microwave Ass Semiconductor diode construction and mounting
CH438497A (de) * 1966-03-11 1967-06-30 Bbc Brown Boveri & Cie Halbleiteranordnung
US3476986A (en) * 1966-09-17 1969-11-04 Nippon Electric Co Pressure contact semiconductor devices
JPS5030428B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1969-03-31 1975-10-01
GB1297046A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1969-08-25 1972-11-22
US4769744A (en) * 1983-08-04 1988-09-06 General Electric Company Semiconductor chip packages having solder layers of enhanced durability
DE3421672A1 (de) * 1984-06-09 1985-12-12 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Wechsellastbestaendiges, schaltbares halbleiterbauelement
GB2215125B (en) * 1988-02-22 1991-04-24 Mitsubishi Electric Corp Semiconductor device
US5220725A (en) * 1991-04-09 1993-06-22 Northeastern University Micro-emitter-based low-contact-force interconnection device
US5660570A (en) * 1991-04-09 1997-08-26 Northeastern University Micro emitter based low contact force interconnection device
US5245248A (en) * 1991-04-09 1993-09-14 Northeastern University Micro-emitter-based low-contact-force interconnection device
EP2089901A4 (en) * 2006-11-09 2011-05-18 Interplex Qlp Inc MICROCIRCUIT HOUSING HAVING A DUCTILE LAYER
CN104647824A (zh) * 2015-03-09 2015-05-27 上海松发合金材料有限公司 一种集成吊顶金属扣板材料

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2889498A (en) * 1955-11-08 1959-06-02 Westinghouse Electric Corp Semiconductor rectifier assembly
US2956214A (en) * 1955-11-30 1960-10-11 Bogue Elec Mfg Co Diode
DE1098103B (de) * 1959-01-14 1961-01-26 Standard Elektrik Lorenz Ag Verfahren zum Einbau eines elektrischen Halbleiterelementes in ein Gehaeuse

Also Published As

Publication number Publication date
DE1236660B (de) 1975-05-22
NL286498A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1900-01-01
CH406443A (de) 1966-01-31
DE1236660C2 (de) 1975-05-22
US3293509A (en) 1966-12-20
GB977284A (en) 1964-12-02

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