BE563190A - - Google Patents

Info

Publication number
BE563190A
BE563190A BE563190DA BE563190A BE 563190 A BE563190 A BE 563190A BE 563190D A BE563190D A BE 563190DA BE 563190 A BE563190 A BE 563190A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE563190A publication Critical patent/BE563190A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S220/00Receptacles
    • Y10S220/29Welded seam

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
BE563190D 1956-09-10 BE563190A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US608791A US2932684A (en) 1956-09-10 1956-09-10 Semi-conductor units and methods of making them

Publications (1)

Publication Number Publication Date
BE563190A true BE563190A (de)

Family

ID=24438018

Family Applications (1)

Application Number Title Priority Date Filing Date
BE563190D BE563190A (de) 1956-09-10

Country Status (3)

Country Link
US (1) US2932684A (de)
BE (1) BE563190A (de)
GB (1) GB869934A (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
BE566767A (de) * 1957-04-16
NL113347C (de) * 1958-10-15
US3117179A (en) * 1959-07-24 1964-01-07 Clevite Corp Transistor capsule and header therefor
US3020454A (en) * 1959-11-09 1962-02-06 Solid State Products Inc Sealing of electrical semiconductor devices
GB959556A (en) * 1960-03-29 1964-06-03 Pye Ltd Cold welding arrangements
US3219748A (en) * 1961-12-04 1965-11-23 Motorola Inc Semiconductor device with cold welded package and method of sealing the same
US3249982A (en) * 1963-01-07 1966-05-10 Hughes Aircraft Co Semiconductor diode and method of making same
US3264399A (en) * 1963-12-16 1966-08-02 Texas Instruments Inc Power transistor device
US3539704A (en) * 1967-07-19 1970-11-10 Tekform Products Co Hermetically sealed enclosure
JPS5952030B2 (ja) * 1981-03-26 1984-12-17 株式会社東芝 冷間圧接方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2736090A (en) * 1956-02-28 Cold pressure welding
US2156324A (en) * 1936-02-19 1939-05-02 Int Nickel Co Radio tube
US2170695A (en) * 1938-09-30 1939-08-22 Gen Electric Discharge device
US2608887A (en) * 1949-03-28 1952-09-02 Gen Electric Co Ltd Means for cold pressure welding
US2697954A (en) * 1949-08-05 1954-12-28 Gen Electric Co Ltd Method of cold pressure welding
US2703997A (en) * 1950-03-08 1955-03-15 Gen Electric Co Ltd Means for and method of cold pressure welding
FR1088170A (fr) * 1952-04-15 1955-03-03 Gen Motors Corp Procédé perfectionné pour réunir des tubes métalliques
GB768103A (en) * 1954-08-17 1957-02-13 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
US2819884A (en) * 1954-08-25 1958-01-14 Metal Specialty Company Pressure-welded tubing
NL203528A (de) * 1955-03-24
BE546710A (de) * 1955-06-08 1900-01-01
US2808543A (en) * 1956-01-30 1957-10-01 Hughes Aircraft Co Mounting means for semiconductor crystal body

Also Published As

Publication number Publication date
US2932684A (en) 1960-04-12
GB869934A (en) 1961-06-07

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