BE563189A - - Google Patents
Info
- Publication number
- BE563189A BE563189A BE563189DA BE563189A BE 563189 A BE563189 A BE 563189A BE 563189D A BE563189D A BE 563189DA BE 563189 A BE563189 A BE 563189A
- Authority
- BE
- Belgium
Links
Classifications
-
- H10W40/10—
-
- H10P95/00—
-
- H10W76/132—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US590204A US3002271A (en) | 1956-06-08 | 1956-06-08 | Method of providing connection to semiconductive structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE563189A true BE563189A (en:Method) |
Family
ID=24361273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE563189D BE563189A (en:Method) | 1956-06-08 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3002271A (en:Method) |
| BE (1) | BE563189A (en:Method) |
| GB (1) | GB861581A (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1207503B (de) * | 1959-07-24 | 1965-12-23 | Elektronik M B H | Gehaeuse fuer Halbleiteranordnungen mit einem Metallsockel |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3109234A (en) * | 1957-07-22 | 1963-11-05 | Rca Corp | Method of mounting a semiconductor device |
| NL109858C (en:Method) * | 1957-09-20 | 1900-01-01 | ||
| US3109225A (en) * | 1958-08-29 | 1963-11-05 | Rca Corp | Method of mounting a semiconductor device |
| US3164885A (en) * | 1960-11-15 | 1965-01-12 | Semiconductors Ltd | Semiconductors |
| US3204023A (en) * | 1963-03-01 | 1965-08-31 | Texas Instruments Inc | Semiconductor device header with semiconductor support |
| US3234320A (en) * | 1963-06-11 | 1966-02-08 | United Carr Inc | Integrated circuit package |
| US3442432A (en) * | 1967-06-15 | 1969-05-06 | Western Electric Co | Bonding a beam-leaded device to a substrate |
| US3569798A (en) * | 1969-05-13 | 1971-03-09 | Rca Corp | Double heat sink semiconductor device |
| US4787551A (en) * | 1987-05-04 | 1988-11-29 | Stanford University | Method of welding thermocouples to silicon wafers for temperature monitoring in rapid thermal processing |
| DE112011105738B4 (de) * | 2011-10-13 | 2014-12-31 | Toyota Jidosha Kabushiki Kaisha | Halbleitermodul |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2137617A (en) * | 1936-03-04 | 1938-11-22 | Mallory & Co Inc P R | Electrical contact and method of making the same |
| US2409668A (en) * | 1942-07-18 | 1946-10-22 | Westinghouse Electric Corp | Heat transfer means and method of assembly |
| US2464821A (en) * | 1942-08-03 | 1949-03-22 | Indium Corp America | Method of preparing a surface for soldering by coating with indium |
| BE524233A (en:Method) * | 1952-11-14 | |||
| BE527420A (en:Method) * | 1953-03-20 | |||
| US2725505A (en) * | 1953-11-30 | 1955-11-29 | Rca Corp | Semiconductor power devices |
| US2877396A (en) * | 1954-01-25 | 1959-03-10 | Rca Corp | Semi-conductor devices |
| BE537167A (en:Method) * | 1954-04-07 |
-
0
- BE BE563189D patent/BE563189A/xx unknown
-
1956
- 1956-06-08 US US590204A patent/US3002271A/en not_active Expired - Lifetime
-
1957
- 1957-05-29 GB GB17043/57A patent/GB861581A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1207503B (de) * | 1959-07-24 | 1965-12-23 | Elektronik M B H | Gehaeuse fuer Halbleiteranordnungen mit einem Metallsockel |
Also Published As
| Publication number | Publication date |
|---|---|
| US3002271A (en) | 1961-10-03 |
| GB861581A (en) | 1961-02-22 |