BE562375A - - Google Patents
Info
- Publication number
- BE562375A BE562375A BE562375DA BE562375A BE 562375 A BE562375 A BE 562375A BE 562375D A BE562375D A BE 562375DA BE 562375 A BE562375 A BE 562375A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US632228A US2916806A (en) | 1957-01-02 | 1957-01-02 | Plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
BE562375A true BE562375A (hu) |
Family
ID=24534632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE562375D BE562375A (hu) | 1957-01-02 |
Country Status (6)
Country | Link |
---|---|
US (1) | US2916806A (hu) |
BE (1) | BE562375A (hu) |
CH (1) | CH359483A (hu) |
DE (1) | DE1100178B (hu) |
FR (1) | FR1190078A (hu) |
GB (1) | GB833828A (hu) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3031747A (en) * | 1957-12-31 | 1962-05-01 | Tung Sol Electric Inc | Method of forming ohmic contact to silicon |
US3124868A (en) * | 1960-04-18 | 1964-03-17 | Method of making semiconductor devices | |
US3172829A (en) * | 1961-01-24 | 1965-03-09 | Of an alloy to a support | |
NL297836A (hu) * | 1962-09-14 | |||
US3349476A (en) * | 1963-11-26 | 1967-10-31 | Ibm | Formation of large area contacts to semiconductor devices |
US3325702A (en) * | 1964-04-21 | 1967-06-13 | Texas Instruments Inc | High temperature electrical contacts for silicon devices |
US3421206A (en) * | 1965-10-19 | 1969-01-14 | Sylvania Electric Prod | Method of forming leads on semiconductor devices |
US3438121A (en) * | 1966-07-21 | 1969-04-15 | Gen Instrument Corp | Method of making a phosphorous-protected semiconductor device |
US3465428A (en) * | 1966-10-27 | 1969-09-09 | Trw Inc | Method of fabricating semiconductor devices and the like |
JPS5946415B2 (ja) * | 1978-04-28 | 1984-11-12 | 株式会社日立製作所 | 半導体装置の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE500302A (hu) * | 1949-11-30 | |||
BE506280A (hu) * | 1950-10-10 |
-
0
- BE BE562375D patent/BE562375A/xx unknown
-
1957
- 1957-01-02 US US632228A patent/US2916806A/en not_active Expired - Lifetime
- 1957-10-26 DE DEW22106A patent/DE1100178B/de active Pending
- 1957-11-20 FR FR1190078D patent/FR1190078A/fr not_active Expired
- 1957-11-21 CH CH359483D patent/CH359483A/de unknown
- 1957-12-31 GB GB40430/57A patent/GB833828A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CH359483A (de) | 1962-01-15 |
US2916806A (en) | 1959-12-15 |
FR1190078A (fr) | 1959-10-09 |
GB833828A (en) | 1960-04-27 |
DE1100178B (de) | 1961-02-23 |