BE537167A - - Google Patents

Info

Publication number
BE537167A
BE537167A BE537167DA BE537167A BE 537167 A BE537167 A BE 537167A BE 537167D A BE537167D A BE 537167DA BE 537167 A BE537167 A BE 537167A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE537167A publication Critical patent/BE537167A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01049Indium [In]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
BE537167D 1954-04-07 BE537167A (hr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE341911X 1954-04-07

Publications (1)

Publication Number Publication Date
BE537167A true BE537167A (hr)

Family

ID=6236583

Family Applications (1)

Application Number Title Priority Date Filing Date
BE537167D BE537167A (hr) 1954-04-07

Country Status (3)

Country Link
US (1) US2906930A (hr)
BE (1) BE537167A (hr)
CH (1) CH341911A (hr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2982894A (en) * 1960-01-12 1961-05-02 Jr Thomas C Tweedie Coaxial microwave diode and method of making the same
BE563189A (hr) * 1956-06-08
US3097976A (en) * 1959-07-06 1963-07-16 Sprague Electric Co Semiconductor alloying process
US3036937A (en) * 1957-12-26 1962-05-29 Sylvania Electric Prod Method for manufacturing alloyed junction semiconductor devices
NL110945C (hr) * 1958-08-01 1900-01-01
FR1217793A (fr) * 1958-12-09 1960-05-05 Perfectionnements à la fabrication des éléments semi-conducteurs
NL122782C (hr) * 1959-08-14 1900-01-01
NL113528C (hr) * 1959-08-27
US3168687A (en) * 1959-12-22 1965-02-02 Hughes Aircraft Co Packaged semiconductor assemblies having exposed electrodes
NL249359A (hr) * 1960-03-12
US3147779A (en) * 1960-09-16 1964-09-08 Gen Electric Cutting and forming transistor leads
US3025439A (en) * 1960-09-22 1962-03-13 Texas Instruments Inc Mounting for silicon semiconductor device
DE1194063B (de) * 1960-11-21 1965-06-03 Siemens Ag Halbleiteranordnung mit mehreren konzentrischen anlegierten Elektroden
US3159775A (en) * 1960-11-30 1964-12-01 Sylvania Electric Prod Semiconductor device and method of manufacture
CH387809A (de) * 1961-11-17 1965-02-15 Bbc Brown Boveri & Cie Lötverbindung an einem Halbleiterelement
US3241011A (en) * 1962-12-26 1966-03-15 Hughes Aircraft Co Silicon bonding technology
US3273029A (en) * 1963-08-23 1966-09-13 Hoffman Electronics Corp Method of attaching leads to a semiconductor body and the article formed thereby
US4385310A (en) * 1978-03-22 1983-05-24 General Electric Company Structured copper strain buffer
US4392153A (en) * 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces
DE2855493A1 (de) * 1978-12-22 1980-07-03 Bbc Brown Boveri & Cie Leistungs-halbleiterbauelement
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2680220A (en) * 1950-06-09 1954-06-01 Int Standard Electric Corp Crystal diode and triode
US2796562A (en) * 1952-06-02 1957-06-18 Rca Corp Semiconductive device and method of fabricating same
US2733390A (en) * 1952-06-25 1956-01-31 scanlon
US2764642A (en) * 1952-10-31 1956-09-25 Bell Telephone Labor Inc Semiconductor signal translating devices

Also Published As

Publication number Publication date
US2906930A (en) 1959-09-29
CH341911A (de) 1959-10-31

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