BE333311A - - Google Patents

Info

Publication number
BE333311A
BE333311A BE333311DA BE333311A BE 333311 A BE333311 A BE 333311A BE 333311D A BE333311D A BE 333311DA BE 333311 A BE333311 A BE 333311A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE333311A publication Critical patent/BE333311A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C47/00—Winding-up, coiling or winding-off metal wire, metal band or other flexible metal material characterised by features relevant to metal processing only
    • B21C47/26—Special arrangements with regard to simultaneous or subsequent treatment of the material
    • B21C47/265—"helicofil" systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Wire Processing (AREA)
BE333311D 1925-05-23 BE333311A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB13490/25A GB254067A (en) 1925-05-23 1925-05-23 Improved process and apparatus for the electro-deposition of metals on wire or narrow strip

Publications (1)

Publication Number Publication Date
BE333311A true BE333311A (ja)

Family

ID=10023901

Family Applications (1)

Application Number Title Priority Date Filing Date
BE333311D BE333311A (ja) 1925-05-23

Country Status (5)

Country Link
US (1) US1601642A (ja)
BE (1) BE333311A (ja)
DE (1) DE452369C (ja)
FR (1) FR615849A (ja)
GB (1) GB254067A (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2495695A (en) * 1944-05-08 1950-01-31 Kenmore Metals Corp Electroplating apparatus
US2680710A (en) * 1950-09-14 1954-06-08 Kenmore Metal Corp Method and apparatus for continuously electroplating heavy wire and similar strip material
BE512758A (ja) * 1951-07-13
BE523457A (ja) * 1952-10-29
US3073773A (en) * 1957-12-05 1963-01-15 Nat Standard Co Electrolytic plating
US3109783A (en) * 1958-11-20 1963-11-05 Nat Standard Co Electrolytic plating
KR20010020807A (ko) 1999-05-03 2001-03-15 조셉 제이. 스위니 고정 연마재 제품을 사전-조절하는 방법
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
TW200720494A (en) * 2005-11-01 2007-06-01 Applied Materials Inc Ball contact cover for copper loss reduction and spike reduction

Also Published As

Publication number Publication date
FR615849A (fr) 1927-01-17
GB254067A (en) 1926-07-01
DE452369C (de) 1927-11-10
US1601642A (en) 1926-09-28

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