BE1030701A1 - PRODUCTION PROCESS FOR A VISCOELASTIC SUBSTRATE WITH CONDUCTIVE PATTERNS BASED ON LASER PRINTING TECHNOLOGY - Google Patents

Abstract

The present invention discloses a viscoelastic substrate having conductive patterns and a manufacturing method and application thereof, comprising: forming a pattern on a hydrophobic substrate using a laser printing process, transferring the pattern to the viscoelastic substrate; depositing conductive nano-materials on the pre-deposited substrate to form a conductive film, covering the viscoelastic substrate with the pre-deposited substrate for lamination, wherein the viscoelastic substrate is coated with the conductive nano-materials in an area not covered by the patterns forms a sealed connection body with the conductive film; Separating the pre-deposited substrate from the viscoelastic substrate so that the dense interconnection body separates from the pre-deposited substrate in the area not covered by the patterns to obtain a viscoelastic substrate with conductive patterns. The method will overcome the limitations of laser printers due to liquid electronic ink, enabling the use of laser printers in the field of flexible printed electronics to obtain a viscoelastic substrate with conductive patterns useful in the fabrication of conductive circuits for the flexible electronics can continue to be used.

Description

PRODUCTION PROCESS FOR A VISCOELASTIC SUBSTRATE BE2029/5525

WITH CONDUCTIVE PATTERNS BASED ON THE

LASER PRINTING TECHNOLOGY

TECHNICAL FIELD

The present invention relates to the technical field of manufacturing the flexible

Electronics, in particular a viscoelastic substrate with conductive patterns and a

Manufacturing process and an application thereof.

STATE OF THE ART

Printed electronics is a technology for manufacturing electronics based on conventional printing principles. By updating and redesigning traditional printing devices and inking electronic materials, the

Manufacturing electronic devices and systems by printing the advantages of a simple

Large-scale production, low loss of raw materials, low investment in the

equipment and cost-effective production. For various senior managers

However, with nano materials, the various printing techniques have their own limitations.

The printing process must take into account the roughness of the substrate surface, the solvent tolerance, the

consider surface energy and other factors; the ink for the electronic

Material must have viscosity, surface tension, rheology and others

Meet requirements required for the different printing techniques.

Currently, the printing processes for printed electronics are mainly used

Inkjet printing, screen printing, gravure printing and planographic printing etc. are used. At the

Pressure of conductive nano-materials dispersed in the liquid phase have the

Inkjet printing and screen printing the problem that the conductive ink the nozzles and

Mesh holes clogged, and gravure printing and planographic printing have the problems of missing patterns and lower reliability in transferring conductive ink.

In addition, the conductive ink, printing device and printing substrate must be in

In terms of process matching, electronic printing devices are more expensive compared to conventional printing devices and that

The process is more complex than traditional printing technology.

The laser printer is a more popular office printing device with the advantages that it has a 9/5525 low price, can print patterns on hydrophobic substrates, prints patterns quickly.

A laser printer works by selectively using an organic photoconductor drum

Laser light is irradiated, creating an electrostatic latent image that then

Toner attracts to form a pattern. These patterns are then transferred to the printing substrate, which is finally heat pressed by the fuser roller to create a stable

to form patterns on the substrate. The toner used for printing is mainly composed of resin, carbon black and magnetic powder. The fuser rollers melt the

Toner and press it onto the printing substrate so that the toner adheres to it as it cools

Substrate adheres. Those currently used in the field of printed electronics

However, printing processes are all based on the use of liquid electronic

ink, which severely limits the use of laser printers in the field of printed electronics because the laser printers cannot print liquid electronic ink directly.

CONTENT OF THE PRESENT INVENTION

The purpose of the present invention is to provide a viscoelastic substrate with conductive patterns and a manufacturing method and application thereof

to provide, the method overcoming the limitations of laser printers due to liquid electronic ink, thereby enabling the use of laser printers in the field of flexible printed electronics to obtain a viscoelastic substrate with conductive patterns used in the manufacture of conductive circuits for flexible electronics can be further applied.

The present invention is realized by the following technical solution:

In a first aspect, the present invention provides a method of making a viscoelastic substrate with conductive patterns, comprising: forming a pattern on a hydrophobic substrate using a

Laser printing process, transferring the pattern to the viscoelastic substrate;

depositing conductive nano-materials on the pre-deposited substrate to form a conductive film, covering the viscoelastic substrate with the pre-deposited substrate for lamination, the viscoelastic substrate in one

; . . . a BE2023/5525 area not covered by the patterns forms a tight connection body with the conductive nano-materials on the conductive film;

Separating the pre-deposited substrate from the viscoelastic substrate so that the dense connection body peels away from the pre-deposited substrate in the area not covered by the patterns to form a viscoelastic substrate with conductive

to obtain samples.

Furthermore, in a preferred embodiment of the present invention, the conductive nano-material comprises at least one of silver nanoparticles, silver nanowires,

Copper nanoparticles, copper nanowires, graphene, carbon nanotubes, two-dimensional transition metal carbides and nitrides.

In a preferred embodiment of the present invention, the viscoelastic substrate is a substrate to the surface of which a binder adheres;

Preferably the binder comprises a pressure-sensitive adhesive, silicone or a photosensitive resin.

Further, in a preferred embodiment of the present invention, the conductive film is formed by a vacuum film deposition method

vacuum filtration process or a coating process; preferably the conductive film has a thickness of 0.05-10 µm.

Furthermore, in a preferred embodiment of the present invention

Separating the pre-deposited substrate from the viscoelastic substrate, the conductive nano-material retained on the pre-deposited substrate becomes a conductive

Pattern transferred to the viscoelastic substrate to create a viscoelastic

To obtain substrate with the conductive pattern.

Preferably, the conductive pattern is on another flexible or elastic substrate

Transfer substrate to obtain a patterned flexible conductive body or an elastic conductive body.

Further, in the step of transferring the pattern on the hydrophobic substrate to a viscoelastic substrate in a preferred embodiment of the present

Invention uses a laminating roller for hot pressing and transferring, the 7029/5525

Temperature is 110-130°C.

Further, in the step of covering the viscoelastic substrate with the pre-deposited substrate for laminating, in a preferred embodiment of the present invention, a laminating roller is used for laminating, and no heating is required during the laminating process.

In a preferred embodiment of the present invention, the hydrophobic substrate is a substrate whose surface is subjected to a chemical hydrophobic treatment; The hydrophobic substrate is preferably release paper.

In a second aspect, the present invention provides a viscoelastic substrate with conductive patterns manufactured by the above manufacturing method

Available, with the conductive pattern having a resistance of 0.1-10 ©.

In a third aspect, the present invention provides an application of the above viscoelastic substrate with conductive patterns in flexible conductive circuits

Electronics available.

Compared to the prior art, the present invention has at least the following technical effects:

The conductive patterned viscoelastic substrate provided by the present application uses a laser printer to print the pattern onto a hydrophobic

substrate, then the pattern is printed on a viscoelastic substrate (like

Adhesive tape) is transferred, and the viscoelastic substrate is connected to a pre-deposited substrate on which a conductive nano-material is deposited

Laminating covered. Due to the masking effect of the pattern, a part of the conductive nano-material on the pre-deposited substrate is tightly bonded to the viscoelastic substrate in an area not covered by the pattern, and is easily separated from the pre-deposited in the subsequent separation process

Substrate and adheres to the surface of the viscoelastic substrate to form a viscoelastic substrate with conductive patterns. Due to the

Due to the masking effect of the pattern, another part of the conductive nano-material on the pre-deposited substrate is not bound to the viscoelastic substrate in an area covered by the pattern, and in the subsequent separation process this part of the conductive nano-material is still bonded to the pre-deposited one

Substrate retained and presents a specific conductive pattern, which is then transferred to another viscoelastic substrate to obtain another viscoelastic 5 substrate with the conductive pattern.

The present invention enables the application of laser printers for the first time in the field of flexible printed electronics, in particular, by using the laser printer, a pattern is formed by passing the conductive material pre-deposited on another pre-deposited substrate through the Viscosity of a viscoelastic substrate such as adhesive tape and shielded by the viscosity of the printed pattern, at the same time, the patterning is realized on the viscoelastic substrate and the pre-deposited substrate, and the conductive pattern has a

Resistance of 0.1-10 © The pattern accuracy and minimum graphic size of the present invention are limited by the printing accuracy of the laser printer. The conductive pattern on the viscoelastic substrate can be used as a unique adhesive conductive

Connection can be used, and the conductive pattern on the pre-deposited

Substrate can be further transferred to other elastic substrates.

Furthermore, the method of the present invention enables the

Provides the user with a conductive film on a pre-deposited substrate, allowing the user to create a conductive pattern in the office through a laser printer

Paper can be designed easily, making it easy and convenient to use.

BRIEF DESCRIPTION OF THE DRAWINGS

Figure 1 shows a flowchart of an embodiment 1 of the present

Invention.

DETAILED DESCRIPTION

The embodiments of the present invention are described below

Connection with the exemplary embodiments will be explained in more detail, although the person skilled in the art in this field can understand that the following exemplary embodiments are only for

Illustrative of the present invention and not as a limitation

The scope of the present invention should be considered in the. 92979525

Specific conditions not specified in the embodiments are carried out in accordance with conventional or manufacturer-recommended conditions and the reagents or devices used, for which the manufacturer is not specified, are conventional products that are commercially available.

The present invention uses the following technical solution: a method for producing a viscoelastic substrate with conductive patterns in the present embodiment, comprising the following steps:

Step S1: Forming a pattern on a hydrophobic substrate using a

Laser printing process, transferring the pattern to the viscoelastic substrate;

Further, the hydrophobic substrate is a substrate whose surface is subjected to chemical hydrophobic treatment, the substrate may be paper, plastic, glass and other materials as long as they are subjected to a conventional surface treatment process, in this way a hydrophobic substrate can be obtained. The hydrophobic substrate is used when printing patterns with the laser printer to facilitate the subsequent lamination and

To facilitate transfer to the viscoelastic substrate. The hydrophobic substrate is preferably release paper.

Furthermore, the viscoelastic substrate is a substrate on which

A binder adheres to the surface as long as there is a gel-like substance on the surface of the substrate

Substance adheres and a certain viscosity is shown, in this way the

requirements are met. Preferably the binder comprises a pressure-sensitive adhesive, silicone or a photosensitive resin. Even more preferably, the viscoelastic substrate is an adhesive tape.

Further, in the step of transferring the pattern on the hydrophobic substrate to a viscoelastic substrate, a laminating roller is used for hot pressing and transferring, the temperature being 110-130°C (preferably 115-125°C). This step ensures that the heat-sensitive pattern on the hydrophobic substrate is completely transferred to the viscoelastic substrate.

Step S2: Depositing conductive nano-materials on the pre-deposited

substrate to form a conductive film, covering the viscoelastic substrate with the pre-deposited substrate for lamination, the viscoelastic 39925

Substrate in an area not covered by the patterns with the conductive

Nano materials form a tight connecting body on the conductive film.

Furthermore, the conductive nano material comprises at least one of silver nanoparticles,

silver nanowires, copper nanoparticles, copper nanowires, graphene,

Carbon nanotubes, two-dimensional transition metal carbides and nitrides.

Such conductive nano-materials have excellent electrical conductivity and, once patterned, can be used to produce a variety of flexible circuits. The conductive nano material is preferably

Silver nanoparticles, silver nanowires, copper nanoparticles, copper nanowires, graphene,

Carbon nanotubes, two-dimensional transition metal carbides and nitrides.

More preferably, the conductive nanomaterial is silver nanoparticles, and

Silver nanowires.

The surface of the pre-deposited substrate can be hydrophobic or hydrophilic; the substrate can be paper, plastic, glass, etc. The pre-deposited substrate is preferably a hydrophobic or hydrophilic filter membrane.

Further, the conductive film is formed by a vacuum film deposition method

Vacuum filtration process or a coating process, preferably by a

Vacuum filtration method, and the conductive film has a thickness of 0.05-10 µm (preferably 0.1-0.6 µm).

Further, in the step of covering the viscoelastic substrate with the pre-deposited substrate for laminating, a laminating roller is used for laminating, and no heating is required during the laminating process. The reason is that the viscoelastic material has a sticky surface and the like

Has wetting properties like a liquid, which increases the adhesive strength of the

Can effectively improve contact surfaces.

Step S3: Separating the pre-deposited substrate from the viscoelastic substrate so that the sealed connection body is in the area not covered by the patterns

Area peels away from the pre-deposited substrate to obtain a viscoelastic substrate with conductive patterns.

Further, after separating the pre-deposited substrate from the viscoelastic 99925

Substrate the conductive retained on the pre-deposited substrate

Nano material a conductive pattern that is transferred to a viscoelastic substrate to obtain a viscoelastic substrate with the conductive pattern.

The detailed embodiments of the present invention are explained in more detail below. It goes without saying that the detailed information described here

Embodiments are intended to illustrate the present invention only, rather than limit the present invention.

Example 1

The present exemplary embodiment provides a viscoelastic substrate with conductive

Patterns are available, the process flow of which is as shown in Figure 1, whereby the

Manufacturing process includes:

Printing a pattern on the release paper with a laser printer while applying a pressure-sensitive adhesive to the flexible plastic. The textured side of the release paper is laminated to the pressure sensitive adhesive side of the plastic substrate, then hot pressed by a

Laminating roller (the temperature is set to 120°C). The pattern is transferred to the flexible plastic containing the pressure-sensitive adhesive, and the pressure-sensitive adhesive, located in a location shielded from the pattern, loses its adhesion.

Depositing the silver nanowire ethanol dispersion by vacuum extraction on a hydrophobic filter membrane (the original concentration of the

Silver nanowire ethanol dispersion is 10 mg/ml, and withdrawal of 50 µl of the

Silver nanowire ethanol dispersion, which is mixed with 30 mL of ethanol to form the liquid for the

Vacuum extraction is further diluted. The hydrophobic filter membrane is placed on a

Hot plate dried at 50 degrees Celsius to form a conductive film.

One side of the hydrophobic filter membrane provided with the silver nanowires is applied to the patterned flexible plastic with pressure-sensitive adhesive and passed through a laminating roller (at room temperature). The pressure-sensitive adhesive in an area not covered by the patterns is tightly bonded to the silver nanowires on the conductive film, and the pressure-sensitive

Adhesive in an area covered by the patterns loses its adhesion and therefore cannot be bonded to the silver nanowires on the conductive film. Then the flexible plastic is separated from the hydrophobic with pressure-sensitive adhesive

Filter membrane torn off, the silver nanowires adhere to the unshielded pressure-sensitive adhesive and peel off from the hydrophobic filter membrane to realize the patterning, in this way a flexible plastic substrate with pressure-sensitive adhesive having conductive patterns is obtained. In addition, the remaining silver nanowires on the hydrophobic filter membrane are also patterned and can be transferred to other flexible substrates.

Due to the presence of the pressure-sensitive adhesive, all patterns are transferred with a success rate of almost 100% success and the patterns have a good

Fidelity. The resulting conductive patterns have a resistance in the range of 0.1-10©. The structured silver nanowires are used as electrodes or

Connecting cables used for flexible electronics.

Embodiment 2

The present exemplary embodiment provides a viscoelastic substrate with conductive

Samples available, the manufacturing process comprising:

Printing a pattern on the release paper with a laser printer while applying the silicone to the rigid glass substrate with a sticky surface. The textured side of the release paper is laminated to the silicone side of the rigid glass substrate, then hot pressing is done by a laminating roller (the temperature is set at 125°C). The pattern is transferred to the rigid glass substrate that

contains silicone, and the viscoelastic material, which is located in a place shielded from the pattern, loses its adhesion.

Depositing the aqueous copper nanowire dispersion by vacuum extraction on a hydrophilic filter membrane (the original concentration of the

Copper nanowire ethanol dispersion is 10 mg/ml, and withdrawal of 50 µl of the aqueous copper nanowire dispersion, which is mixed with 30 mL of water to form the liquid for the

Vacuum extraction is further diluted. The hydrophilic filter membrane is placed on a

Hot plate dried at 50 degrees Celsius to form a conductive film.

One side of the filter membrane provided with the copper nanowires is attached to the dei: 0739/5525

Patterns and silicone provided rigid glass substrate applied and through a

Laminating roller (at room temperature). The silicone in an area not covered by the patterns is tightly bonded to the copper nanowires on the conductive film, and the silicone in an area covered by the patterns loses its adhesion and thus cannot be bonded to the copper nanowires on the conductive film. Then the rigid glass substrate with silicone is torn off the hydrophilic filter membrane, which

Copper nanowires adhere to the unshielded silicone and peel off from the hydrophilic filter membrane to realize patterning, thus obtaining a rigid glass substrate with silicone having conductive patterns. In addition, the remaining copper nanowires on the hydrophilic filter membrane are also patterned and can be transferred to other flexible substrates.

Due to the presence of the silicone, all patterns are transferred with a success rate of almost 100% success and the patterns have good fidelity. The resulting conductive patterns have a resistance in the range of 0.1-7 Q. The structured copper nanowires are used as electrodes or connecting lines for flexible electronics.

Example 3

The present exemplary embodiment provides a viscoelastic substrate with conductive

Samples available, the manufacturing process comprising:

Printing a pattern on the hydrophobic plastic substrate with a laser printer while applying a pressure-sensitive adhesive to the plastic substrate.

The textured side of the hydrophobic substrate is laminated to the pressure-sensitive adhesive side of the paper, then this is done

Hot pressing through a laminating roller (the temperature is set at 115°C). The

Pattern is transferred to the plastic substrate containing the pressure-sensitive adhesive, and the pressure-sensitive adhesive, located at a location shielded from the pattern, loses its adhesion.

The silver nanoparticles (the silver nanoparticle-ethanol dispersion has a concentration of 20mg/mL) is applied to the rigid substrate, (removal of 50 µL of the

Silver nanoparticle ethanol dispersion, which is mixed with 0.5 mL of ethanol to form the liquid for the

Coating is further diluted, the surface of the rigid substrate being subjected to a hydrophobic treatment, i.e. the surface is hydrophobic). The liquid film applied to the 6963/5525 rigid substrate is naturally dried to form a conductive

to form film.

Fine side of the rigid substrate provided with the silver nanoparticles is placed on the

Substrate with the pressure sensitive adhesive/plastic substrate having the patterns applied and passed through a laminating roller (at room temperature). The pressure-sensitive adhesive in an area not covered by the patterns is tightly bonded to the silver nanoparticles on the conductive film, and the pressure-sensitive

Adhesive in an area covered by the patterns loses its adhesion and therefore cannot bind to the silver nanoparticles on the conductive film. Then the paper is torn from the rigid substrate using pressure-sensitive adhesive

Silver nanoparticles adhere to the unshielded pressure-sensitive adhesive and detach from the rigid substrate to realize the patterning upon which

Thus, a substrate with the pressure-sensitive adhesive/a plastic substrate having the patterns is obtained. In addition, the remaining

Silver nanoparticles are also structured on the rigid substrate and can be applied to other flexible ones

Substrates are transferred.

Due to the presence of the pressure-sensitive adhesive, all patterns are transferred with a success rate of almost 100% success and the patterns have a good

Fidelity. The resulting conductive patterns have a resistance in the range of 0.1-8 © The substrate with pressure sensitive adhesive/dem

Plastic substrate structured silver nanoparticles can be used as a conductive connector or electrode for flexible electronics, and on the rigid

Substrate structured silver nanoparticles are further applied to the flexible substrate

Transfer electrode or connecting cable for the flexible electronics.

Example 4

The present exemplary embodiment provides a viscoelastic substrate with conductive

Samples available, the manufacturing process comprising:

Printing a pattern on the hydrophobic plastic substrate using a laser printer while applying a photosensitive adhesive to paper. The light-sensitive adhesive hardens after irradiation with certain wavelengths of light and the surface remains sticky. The structured side of the hydrophobic substrate is laminated to the side of the paper provided with the photosensitive adhesive, then hot pressing is carried out by a laminating roller (the temperature is set at 110 ° C). The pattern is transferred to the paper that is light sensitive

Adhesive contains, and the photosensitive adhesive, which is located in a place shielded from the pattern, loses its adhesion.

The carbon nanotubes (the carbon nanotube ethanol dispersion has a

Concentration of 20mg/mL) is applied to the rigid substrate (removal of 50 µL of the aqueous carbon nanotube dispersion, which is mixed with 0.5 mL of water

Liquid for coating is further diluted, leaving the surface rigid

Substrate is subjected to a hydrophilic treatment, i.e. the surface is hydrophilic).

The liquid film on the rigid substrate is naturally dried to form a conductive film.

A carbon nanotube-bearing side of the rigid substrate is applied to the photosensitive adhesive/paper containing the patterns and passed through a laminating roller (at room temperature). The photosensitive adhesive in an area not covered by the patterns is tightly bonded to the carbon nanotubes on the conductive film, and the photosensitive adhesive in one of the

The area covered by the pattern loses its adhesion and can therefore not be adhered to

Carbon nanotubes are bonded to the conductive film. Then the paper is torn from the rigid substrate with photosensitive adhesive

Carbon nanotubes adhere to the unshielded photosensitive adhesive and peel off from the rigid substrate to realize the patterning upon which

Way is a substrate with the photosensitive adhesive/a paper substrate that the

have patterns. In addition, the remaining

Carbon nanotubes are also patterned on the rigid substrate and can be transferred to other flexible substrates.

Due to the presence of the photosensitive adhesive with a sticky

Surface, all patterns are transmitted with a success rate of almost 100% success and the patterns have good fidelity. The resulting conductive patterns have a resistance in the range of 0.5-5 Q. The carbon nanotubes patterned on the substrate with photosensitive adhesive/paper substrate can be used as a conductive connector or electrode for paper-based electronics, and those patterned on the rigid substrate' 29/ 9925

Carbon nanotubes are further attached to the flexible substrate as an electrode or

Transfer connecting cable for the flexible electronics.

It should be noted that the above content is only preferred

represents embodiments of the present invention and is not intended to serve the purpose

Limit the scope of the present invention. All under thoughts and

Changes made to the principles of the present invention are equivalent

Substitutions and improvements are to be considered within the scope of the present invention.

Claims (10)

N BE2023/5525 claims 1. A method for producing a viscoelastic substrate with conductive patterns, characterized in that it comprises: forming a pattern on a hydrophobic substrate using a laser printing process, transferring the pattern to the viscoelastic substrate; depositing conductive nano-materials on the pre-deposited substrate to form a conductive film, covering the viscoelastic substrate with the pre-deposited substrate for lamination, wherein the viscoelastic substrate is coated with the conductive nano-materials in an area not covered by the patterns forms a sealed connection body with the conductive film; Separating the pre-deposited substrate from the viscoelastic substrate so that the dense interconnect body peels away from the pre-deposited substrate in the area not covered by the patterns to obtain a viscoelastic substrate with conductive patterns. 2. A method for producing a viscoelastic substrate with conductive patterns according to claim 1, characterized in that after separating the pre-deposited substrate from the viscoelastic substrate, the conductive nano-material retained on the pre-deposited substrate forms a conductive pattern, the conductive pattern being preferred is transferred to another flexible substrate or elastic substrate to obtain a patterned flexible conductive body or an elastic conductive body. 3. A method for producing a viscoelastic substrate with conductive patterns according to claim 1, characterized in that the conductive nano-material comprises at least one of silver nanoparticles, silver nanowires, copper nanoparticles, copper nanowires, graphene, carbon nanotubes, two-dimensional transition metal carbides and nitrides. 4. A method for producing a viscoelastic substrate with conductive patterns according to claim 1, characterized in that the viscoelastic substrate is a substrate to the surface of which a binder adheres; wherein the binder preferably comprises a pressure-sensitive adhesive, silicone or a photosensitive resin. . . . 2 BE2023/5525 5. A method for producing a viscoelastic substrate having conductive patterns according to claim 1, characterized in that the conductive film is produced by a vacuum film deposition method, a vacuum filtration method or a coating method; wherein the conductive film preferably has a thickness of 0.05-10 µm. 6. A method for producing a viscoelastic substrate with conductive patterns according to claim 1, characterized in that in the step of transferring the pattern on the hydrophobic substrate to a viscoelastic substrate, a laminating roller for hot pressing and transferring is used, the temperature being 110-130 ° C amounts. 7. A method of producing a viscoelastic substrate having conductive patterns according to claim 1, characterized in that in the step of covering the viscoelastic substrate with the pre-deposited substrate for laminating, a laminating roller is used for laminating. 8. A method for producing a viscoelastic substrate with conductive patterns according to claim 1, characterized in that the hydrophobic substrate is a substrate whose surface is subjected to a chemical hydrophobic treatment; wherein the hydrophobic substrate is preferably release paper. 9. Viscoelastic substrate with conductive patterns, which is produced by the manufacturing method according to one of claims 1 to 8, characterized in that the conductive pattern has a resistance of 0.1-10 Q. 10. Application of the viscoelastic substrate with conductive patterns according to claim 9 in conductive circuits of flexible electronics.