BE1027778B1 - Tungsten Carbide Brazed Joint, Manufacturing Process Therefor, and Tungsten Carbide Tool - Google Patents

Abstract

The present disclosure provides a cemented carbide brazed joint, a method of manufacturing the same, and a cemented carbide tool, and relates to the field of welding technology. With this hard metal soldered connection, several buffer substances are inserted into a soldered seam and the buffer substances are evenly distributed along the length direction of the soldered seam, so that the buffer substances are plastically deformed when the hard metal soldered connection is formed to avoid a shrinkage difference, caused by the difference in the coefficients of linear expansion of the hard metal and the steel base body. to compensate, which achieves an effect of the controlled release of the thermal stress, reduces the residual stress at the soldered seam, and solves problems such as crack formation and desoldering of the soldered seam, while the shear strength and impact resistance of the entire hard metal link can also be improved by the buffer substances. This disclosure provides a manufacturing method for the above hard metal brazed joint which enables a simple and stable process and achieves high production efficiency, and is therefore suitable for industrial mass production. This disclosure provides a hard metal tool comprising a hard metal braze joint as described above.

Description

Tungsten Carbide Brazed Joint, Manufacturing Method Therefor, and BE2020 / 5214 Tungsten Carbide Tool Technical Field The present disclosure relates to the field of welding technology, and more particularly relates to a brazed brazed joint, a method of making the same, and a cemented carbide tool.

Technical background In hard metal tools, small hard metal pieces are mostly used to connect with high-strength steel base bodies such as tool steel, while the high-strength steel such as tool steel can withstand impact loads, saving valuable hard metal (hard alloy) and reducing tool costs.

Brazing is one of the most commonly used methods of firmly joining hard metal to the metal of a steel body.

However, the thermal expansion coefficients of the hard metal and the steel body are very different: For example, the linear expansion coefficient of a WC-Co alloy is (4-6) x 10 ° 8 / ° C, while the linear expansion coefficient of ordinary steel is about 12 x 105 / ° C; however, the shrinkage of the steel base body during the cooling process after welding is greater than the shrinkage of the hard metal, for this reason there is great tension between the solder in the soldered seam and the hard metal on both sides and the base material.

The internal stress created in the soldered seam would impair the performance of the hard metal and the base material, shorten the service life of the hard metal, and at the same time also affect the strength of the soldered seam, which greatly reduces the shear strength of the soldered seam and, in serious cases, could cause the soldered seam to crack .

A sandwich composite solder with a three-layer structure is widely used in production, and the plastic deformation of a compensating washer is used to release the thermal stress in the joint in a controlled manner.

In the case of a hard metal solder joint soldered using the sandwich composite solder, the solder alloy at the solder seam has high strength and high hardness, while the compensating spacer generally has good plasticity but low strength, so the hard metal solder joint would be easy on the entire compensating spacer be torn in the soldered seam.

In view of this, the present disclosure is proposed to solve at least one of the above technical problems. 40

Subject matter of the disclosure BE2020 / 5214 The present disclosure is based on a first object to provide a hard metal soldered connection, this hard metal soldered connection having properties such as high strength and good impact resistance by providing a buffer substance distributed in a certain way in the soldered seam.

The present disclosure is based on a second object to provide a production method for an above-described hard metal solder connection.

The present disclosure is based on a third object of providing a hard metal tool, comprising a hard metal soldered connection as described above.

In order to achieve the above objects, the present disclosure provides the following technical solution: The present disclosure provides a hard metal solder connection, comprising a hard metal material and a steel base body, a soldered seam being formed between the hard metal material and the steel base body; Several buffer substances are arranged in the solder seam, which are evenly distributed along the length direction of the solder seam.

Based on the above technical solution of this disclosure, the material of the buffer substance further contains any one or a combination of at least two from the group consisting of copper, a copper alloy, nickel, a nickel alloy, iron or a ferro alloy.

On the basis of the above technical solutions of this disclosure, the buffer substance also contains a thread-like buffer substance and / or a strip-like buffer substance; Preferably, the diameter of the thread-like buffer substance is 0.05-2 mm, and the length thereof is 5-40 mm; Preferably, the thickness of the strip-shaped buffer substance is 0.05-2 mm, the length thereof is 5-40 mm, and the width thereof is 1-4 mm; Preferably, the strip-shaped buffer substance is provided with through holes along the thickness direction thereof.

On the basis of the above technical solutions of this disclosure, the distance between each two adjacent buffer substances along the length direction of the soldered seam is also 0.1-10 mm; The Vickers hardness of the buffer substance is preferably 40-100 HV;

The straightness tolerance of the buffer substance is preferably 5/1000. BE2020 / 5214 On the basis of the above technical solutions of this disclosure, the distance between the multiple buffer substances and the soldering surface of the hard metal material is each independently 0.05-0.2 mm; Preferably, the distance between the plurality of buffer substances and the soldering surface of the steel base body is in each case independently 0.1-0.3 mm; The distance between the buffer substance which is closest to the edge of the solder seam along the width direction of the solder seam and the edge of the solder seam along the width direction of the solder seam is 0.1-0.3 mm.

On the basis of the above technical solutions of this disclosure, the thickness of the solder seam is also 0.2-10 mm.

The present disclosure further provides a manufacturing method for the above hard metal solder connection, comprising the following steps: The hard metal solder connection is obtained by inserting a plurality of buffer substances when soldering the hard metal material and the steel base body in a solder seam formed by the hard metal material and the steel base body.

The manufacturing method for a hard metal solder connection preferably comprises the following steps: (a) coating a surface to be soldered of a hard metal material with a first solder in order to form a first solder layer; (b) Placing a buffer substance having a surface coated with a first solder along the length direction of the solder seam evenly on the surface of the first solder layer, and then coating the surface of the first solder layer on which the buffer substance is placed with a second solder, whereby a second solder layer is formed; (c) coating the surface of the second solder layer with a second solder to form a solder layer; and (d) contacting the surface of the cemented carbide material on which the solder layer is formed with the surface to be soldered of the steel base body at a temperature for soldering so that the first solder layer, the second solder layer and the solder layer are melted and a solder seam is formed therefrom ; and then maintaining the hard metal braze joint after cooling; Preferably, the coating in step (a) and step (c) each independently comprises spray coating or melt coating.

On the basis of the above technical solutions of this disclosure, the thickness of the first solder layer in step (a) is also 0.1-10 mm;

The thickness of the second solder layer in step (b) is preferably 0.1-10 mm; BE2020 / 5214 Preferably, the thickness of the solder layer in step (c) is 0.1-1 mm.

On the basis of the above technical solutions of this disclosure, the production method further comprises, in step (a), before the step of coating a surface of a hard metal material to be soldered with a first solder, a step of de-oiling and sandblasting on the surface of the hard metal material to be soldered; Preferably, the manufacturing process in step (b), before the step of coating the surface of the buffer substance with a first soldering agent, also comprises a step of roughening the surface of the buffer substance using sandpaper down to a roughness Ra of 12.5-50 μm; Preferably, the temperature for soldering in step (d) is To ° C, and the melting point of a substance having a higher melting point among the solders in the first solder layer and the second solder layer is T ° C, with T + 30 <To ST +50.

The present disclosure further provides a hard metal tool comprising a hard metal solder joint as described above or a hard metal solder joint which is produced by the above-described production method for a hard metal solder joint.

Compared to the prior art, the hard metal solder joint and the manufacturing method for it, as well as a hard metal tool, which are provided in this disclosure, have the following technical effects: (1) The present disclosure provides a hard metal solder joint, wherein several buffer substances are inserted in the solder seam and the buffer substances are evenly distributed along the length of the soldered seam, so that the buffer substances are plastically deformed when the hard metal soldered joint is formed in order to compensate for a shrinkage difference caused by the difference in the coefficients of linear expansion of the hard metal and the steel body, which has an effect on the controlled release of thermal stress, the residual stress at the soldered seam is reduced, and problems such as crack formation and desoldering of the soldered seam are solved, while the buffer substances also increase the shear strength and impact strength of the entire hard metal songs can be improved; Compared to the hard metal solder connection made from conventional sandwich composite solder, the several buffer substances in this hard metal solder connection are evenly distributed in the solder seam, which means that the entire buffer substance does not crack when a conventional sandwich composite solder is used

Hard metal tool is fixed, and accordingly the strength of the BE2020 / 5214 hard metal solder connection is increased considerably.

(2) The present disclosure provides a manufacturing method for the above hard metal brazed joint that enables a simple and stable process and achieves high production efficiency, and is therefore suitable for industrial mass production.

(3) The present disclosure provides a hard metal tool comprising a hard metal brazed joint described above or a hard metal brazed joint produced by a hard metal brazed joint production method described above. In view of the advantages of the hard metal soldered connection described above or the use of the above manufacturing method for a hard metal soldered connection, a hard metal tool containing the same has the same advantages.

Description of the drawings In order to more clearly describe technical solutions of the specific embodiments of this disclosure or of the prior art, the following are briefly presented the drawings that are necessary in the explanation of the specific embodiments or of the prior art; and of course the drawings in the following explanation show only some embodiments of the disclosure, and further drawings could be available to those skilled in the art with reference to these drawings without involving inventive step.

FIG. 1 shows a schematic structural representation of a hard metal solder connection according to an embodiment provided in this disclosure; and FIG. 2 shows a schematic structural representation of a hard metal solder connection according to a further embodiment provided in this disclosure.

Reference symbols: 1-hard metal material; 2 solder seam; 3 buffer substance; 4 steel body; 11-soldering surface of the hard metal material; and 41-soldering surface of the steel body.

DETAILED DESCRIPTION OF THE EMBODIMENTS In the following, the technical solutions of this disclosure are to be described clearly and comprehensively with reference to the exemplary embodiments, and obviously the described exemplary embodiments are only partial exemplary embodiments instead of all of the exemplary embodiments of the disclosure.

All further exemplary embodiments that would be available from a person skilled in the art based on the BE2020 / 5214 exemplary embodiments in this disclosure without inventive step fall within the scope of protection of the disclosure. According to a first aspect of this disclosure, there is provided a hard metal solder joint as shown in detail in FIGS. This hard metal solder connection comprises a hard metal material 1 and a steel base body 4, a soldered seam 2 being formed between the hard metal material 1 and the steel base body 4; Several buffer substances 3 are arranged in the soldered seam 2 and are evenly distributed along the length direction of the soldered seam.

The hard metal material (hard alloy material) is mainly an alloy material that is made from a hard compound of the high-melting metal and a binding metal. The types of cemented carbide materials are not limited, and typical but not limiting types are WC-Co alloys, WC-TiC-Co alloys, WC-TaC-Co alloys or WC-TiC-TaC-Co alloys and the like. Several buffer substances are arranged in the soldered seam, but the number of buffer substances is not limited. A uniform distribution of the multiple buffer substances along the length direction of the solder seam means that the distances between two adjacent buffer substances are the same along the length direction of the solder seam, i.e. the buffer substances are equally spaced along the length direction of the solder seam. No restriction is made on the distribution of the plurality of buffer substances along the width direction of the solder seam and along the thickness direction of the solder seam.

The present disclosure provides a hard metal soldered connection, wherein several buffer substances are inserted into the soldered seam and the buffer substances are evenly distributed along the length direction of the soldered seam, so that the buffer substances are plastically deformed when the hard metal soldered connection is formed, by a difference in shrinkage caused by the difference in the coefficient of linear expansion of the hard metal and the steel body, which has the effect of a controlled release of the thermal stress, reduces the residual stress at the soldered seam, and solves problems such as cracking and desoldering of the soldered seam, while the buffer substances also improve the shear strength and impact resistance of the entire hard metal link can be; In comparison to the hard metal soldered connection made from conventional sandwich composite solder, the several buffer substances in this hard metal soldered connection are evenly distributed in the soldered seam, whereby the

Deficiency of cracking of the entire buffer substance is eliminated when using a BE2020 / 5214 of the conventional sandwich composite soldered hard metal tool, and accordingly the strength of the hard metal soldered connection is considerably increased.

As an optional embodiment of this disclosure, the material of the buffer substance contains any one or a combination of at least two of the group consisting of copper, a copper alloy, nickel, a nickel alloy, iron or a ferroalloy.

It should be explained that typical, but not limiting, grade of copper alloys is H96, H90, H85, H80, QMn1.5 or QMn5; typical, but not limiting, grade of nickel alloys is N4, N6, or NCu30; and typical, but not limiting, ferroalloy is high carbon structural steel, low alloy steel, or stainless steel.

By defining the specific material of the buffer substance, this buffer substance is enabled to have good plasticity and strength.

As an optional embodiment of this disclosure, the buffer substance contains a thread-shaped buffer substance and / or a strip-shaped buffer substance.

The expression "the buffer substance contains a thread-like buffer substance and / or a strip-shaped buffer substance" is to be understood that the buffer substance could either only comprise a thread-shaped buffer substance, or could only comprise a strip-shaped buffer substance, or a thread-shaped buffer substance and a strip-shaped buffer substance at the same time could include.

By defining the structure or the shape of the buffer substance it is made possible that this buffer substance improves the shear strength and the impact resistance of the soldered connection.

The dimensions of the thread-like buffer substance and the strip-shaped buffer substance depend on the size of the soldered seam, and the thickness or the diameter of the buffer substance is inevitably smaller than the thickness of the soldered seam.

As an optional embodiment of this disclosure, the diameter of the thread-like buffer substance is 0.05-2 mm; and a typical but non-limiting diameter of the thread-like buffer substance is 0.05 mm, 0.06 mm, 0.08 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm , 0.6mm, 0.7mm, 0.8mm, 1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1 , 8 mm, 1.9 mm, or 2.0 mm.

As an optional embodiment of this disclosure, the length of the thread-like buffer substance is 5-40 mm. A typical but not restrictive length of the thread-like buffer substance is 5 mm, 8 mm,

10 mm, 12 mm, 15 mm, 18 mm, 20 mm, 22 mm, 25 mm, 28 mm, 30 mm, 32 B = 20205214 mm, 35 mm, 38 mm, or 40 mm.

As an optional embodiment of this disclosure, the thickness of the strip-shaped buffer substance is 0.05-2 mm; and a typical but non-limiting thickness of the strip-shaped buffer substance is 0.05 mm, 0.06 mm, 0.08 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm , 0.6mm, 0.7mm, 0.8mm, 1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1 , 8 mm, 1.9 mm, or 2.0 mm.

As an optional embodiment of this disclosure, the length of the strip-shaped buffer substance is 5-40 mm, and the width thereof is 1-4 mm; and a typical but non-limiting length of the strip-shaped buffer substance is 5 mm, 8 mm, 10 mm, 12 mm, 15 mm, 18 mm, 20 mm, 22 mm, 25 mm, 28 mm, 30 mm, 32 mm, 35 mm, 38 mm, or 40 mm, and a typical but non-limiting width of the strip-shaped buffer substance is 1 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5 mm, or 4.0 mm.

If the diameter of the thread-like buffer substance is too large or the strip-shaped buffer substance is too thick, a partial area would be weakened, which would impair the strength of the soldered seam; on the contrary, if the diameter of the thread-like buffer substance is too small or the thickness of the strip-shaped buffer substance is too small, a solder solution would possibly lead to erosion of the buffer substance during welding, then the buffer substance could not function accordingly. Therefore, the dimensions of the thread-like buffer substance and the strip-like buffer substance are preferably each to be limited to a certain range.

As an optional embodiment of this disclosure, the strip-shaped buffer substance is provided with through-holes along the thickness direction thereof.

It should be explained that the number of through holes provided on the strip-shaped buffer substance is not specifically limited. The provision of the through holes serves to increase the tensile strength of the soldered connection.

As an optional embodiment of this disclosure, the distance between any two adjacent buffer substances along the length direction of the solder seam is 0.1-10 mm. A typical but non-limiting distance between two adjacent buffer substances along the length direction of the solder seam is 0.1 mm, 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm , 4mm, 4.5mm, 5mm, 5.5mm, 40mm, 6mm, 6.5mm, 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm, or 10 mm.

As an optional embodiment of this disclosure, the BE2020 / 5214 Vickers hardness of the buffer substance is 40-100 HV; and a typical but non-limiting Vickers hardness of the buffer substance is 40 HV, 45 HV, 50 HV, 55 HV, 60 HV, 65 HV, 70 HV, 75 HV, 80 HV, 85 HV, 90 HV, 95 HV, or 100 HV.

The Vickers hardness of the buffer substance should preferably be limited to a suitable range because the strength of the soldered joint could possibly be weakened because of the buffer substance if the Vickers hardness is less than 40 HV; while with a Vickers hardness of over 100 HV, the buffer substance could possibly not be used for the controlled release of the voltage, which is why the impact resistance of the soldered connection deteriorates.

As an optional embodiment of this disclosure, the straightness tolerance of the buffer substance is 5/1000.

If the straightness tolerance of the buffer substance is too great, this buffer substance would possibly be bent excessively, which is why the controlled released tension of the buffer substance becomes uneven, which not only does not increase the strength of the soldered connection, but could also reduce the strength of the soldered connection.

The position of the buffer substance in the soldered seam must be optimized.

As an optional embodiment of this disclosure, the distance between the plurality of buffer substances and the soldering surface of the hard metal material is each independently 0.05-0.2 mm.

The position of the soldering surface of the hard metal material 11 is shown in FIGS. 1 and 2. A typical but non-limiting distance between the buffer substance and the soldering surface of the hard metal material is 0.05 mm, 0.06 mm, 0.08 mm, 0.10 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, or 0.2mm.

Since there are several buffer substances in the soldered seam, it should be explained that the expression "the distance between the several buffer substances and the soldering surface of the hard metal material is independently 0.05-0.2 mm" is to be understood as meaning that the distance between each buffer substance and the soldering surface of the hard metal material is in the range of 0.05-0.2 mm, and the distances between different buffer substances and the soldering surface of the hard metal material are independent of one another, i.e. the distances between different buffer substances and the soldering surface of the Cemented carbide material could either be the same or different.

As an optional embodiment of this disclosure, the BE2020 / 5214 distance between the multiple buffer substances and the soldering surface of the steel body is each independently 0.1-0.3 mm; The position of the soldering surface of the steel base body 41 is shown in FIGS. A typical but non-limiting distance between the buffer substance and the soldering surface of the steel base body is 0.10 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18mm, 0.19mm, 0.2mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29 mm, or 0.30 mm.

The expression "the distance between the several buffer substances and the soldering surface of the steel base body is independently 0.1-0.3 mm" means that the distance between each buffer substance and the soldering surface of the steel base body is in the range of 0.1-0.3 mm. 0.3 mm, and the distances between different buffer substances and the soldering surface of the steel base body are independent of each other, that is, the distances between different buffer substances and the soldering surface of the steel base body could be either the same or different.

As an optional embodiment of this disclosure, the distance between the buffer substance closest to the edge of the solder seam along the width direction of the solder seam and the edge of the solder seam along the width direction of the solder seam is 0.1-0.3 mm; and a typical but non-limiting distance is 0.1 mm, 0.12 mm, 0.15 mm, 0.18 mm, 0.2 mm, 0.22 mm, 0.25 mm, 0.28 mm, or 0 , 30 mm.

The distance from the buffer substance to the edge of the soldered seam along the width direction of the soldered seam should not be too small, otherwise it easily leads to the partially weak strength of the soldered connection, which could impair the overall strength and lead to lamellar cracks and the like.

As an optional embodiment of this disclosure, the solder seam thickness is 0.2-10 mm. A typical but not limiting thickness of the solder seam is 0.2 mm, 0.5 mm, 0.8 mm, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm , or 10 mm.

According to a second aspect of this disclosure, a production method for a hard metal solder connection described above is further provided, comprising the following steps: The hard metal solder connection is obtained by inserting several buffer substances when soldering the hard metal material and the steel base body in a soldered seam formed by the hard metal material and the steel base body.

In the manufacturing method for BE2020 / 5214 a hard metal brazed joint provided in this disclosure, the manufacturing method enables simple operations, a stable process, and high production efficiency, and is therefore suitable for industrial mass production.

As an optional embodiment of this disclosure, the manufacturing method for a hard metal solder joint comprises the following steps: (a) coating a surface to be soldered of a hard metal material with a first solder in order to form a first solder layer; (b) Placing a buffer substance having a surface coated with a first soldering agent along the length direction of the solder seam evenly on the surface of the first solder layer, and then coating the surface of the first solder layer on which the buffer substance is placed with a second solder, whereby a second solder layer is formed; (c) coating the surface of the second solder layer with a second solder to form a solder layer; and (d) contacting the surface of the cemented carbide material on which the solder layer is formed with the surface to be soldered of the steel base body at a temperature for soldering such that the first solder layer, the second solder layer and the solder layer are melted and a solder seam is formed therefrom ; and then maintaining the cemented carbide solder joint after cooling.

Specifically, in step (a) a surface of a hard metal material to be soldered is made with a first solder in order to form a first solder layer. The type of solder used is not specifically limited as long as good wettability of the hard metal material and the steel base body is ensured by this solder. Typical but not limiting silver-based solders are BAg25CuZnMnNi, BAg49ZnCuMnNi, and BAg40CuZnNi; typical but not limiting copper-based solder is BCu57ZnMnCo, BCu58ZnMn, or BCu48ZnNiSi; and typical but non-limiting nickel-based solder is BNi82CrSiBFe or BNi66MnSiCu.

The step of placing a buffer substance having a surface coated with a first solder along the length direction of the solder seam uniformly on the surface of the first solder layer in step (b) is to be understood as meaning that the buffer substance has a surface coated with a first solder along the Length direction of the solder seam is evenly distributed.

Coating the surface of the buffer substance with a solder contributes to improving the wetting of the buffer substance by means of the solder, therefore a good metallurgical bond is formed with it.

In this step (b) it corresponds to the arrangement of the buffer substance BE2020 / 5214 between the first solder layer and the second solder layer. It should be explained that the types of solders in the first solder layer and in the second solder layer could either be the same or different.

In step (c), the solder layer can remove the oxide film on the surface of the steel base, effect wetting between the solder and the steel base, increase the soldering rate of the solder, and thereby improve the strength of the soldered joint. It should be explained that the type of the second solder in the solder layer could be either the same as or different from the type of the first solder applied on the surface of the buffer substance.

Due to the specific limitation of the operating steps in the manufacturing process for a hard metal solder joint, the stable presence of the buffer substance in the solder seam is made possible, and the strength and impact resistance of the metal solder joint are thereby further increased.

As an optional embodiment of this disclosure, the production method in step (a), prior to the step of coating a surface to be soldered of a hard metal material with a first solder, also comprises a step of de-oiling and sandblasting on the surface of the hard metal material to be soldered.

As an optional embodiment of this disclosure, the thickness of the first solder layer in step (a) is 0.1-10 mm; and a typical but non-limiting thickness of the first solder layer is 0.1 mm, 0.2 mm, 0.5 mm, 0.8 mm, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, or 10 mm.

After the de-oiling and sandblasting treatments, it can be guaranteed that the surface of the hard metal material to be soldered is free of oil, contamination and oxidation.

As an optional embodiment of this disclosure, the manufacturing method in step (b), prior to the step of coating the surface of the buffer substance with a first solder, also comprises a step of roughening the surface of the buffer substance using sandpaper to a roughness Ra of 12 , 5-50 um.

The roughening treatment of the surface of the buffer substance using the sandpaper contributes to the wetting of the buffer substance by a liquid solder and increases the strength of the metallurgical bond between the liquid solder and the buffer substance.

As an optional embodiment of this disclosure, the BE2020 / 5214 buffer substance having a surface coated with a first solder is prepared in step (b) by the following steps: The buffer substance is immersed in a solution containing solder, and then removed therefrom and dried, then the Buffer substance having a surface coated with a first solder is obtained.

As an optional embodiment of this disclosure, the thickness of the second solder layer in step (b) is 0.1-10 mm; and a typical but non-limiting thickness of the second solder layer is 0.1 mm, 0.2 mm, 0.5 mm, 0.8 mm, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, or 10 mm.

As an optional embodiment of this disclosure, the thickness of the solder layer in step (c) is 0.1-1 mm; and a typical but non-limiting solder layer thickness is 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9 mm, or 1 mm.

As an optional embodiment of this disclosure, prior to performing step (d), the steel body undergoes a heating treatment comprising the following steps: induction heating of the steel body, the surface temperature of the steel body rising rapidly under the skin effect; Detecting surface temperature using an on-line infrared temperature detector; Stopping the heating when the temperature for brazing is reached, whereby a steel base body is obtained at the temperature for brazing.

As an optional embodiment of this disclosure, the temperature for soldering in step (d) is To ° C, and the melting point of a substance having a higher melting point among the solders in the first solder layer and the second solder layer is T ° C, with T + 30 <Tos T + 50. For example, the temperature for soldering is in the range of 1230-1250 ° C if the melting point of the substance with a higher melting point among the solders in the first solder layer and the second solder layer is 1200 ° C.

According to a third aspect of this disclosure, a hard metal tool is further provided, comprising an above-described hard metal solder connection or a hard metal solder connection which is produced by a production method for a hard metal solder connection described above.

In view of the advantages of the hard metal soldered connection described above or the use of the above manufacturing method for a hard metal soldered connection, a hard metal tool 40 containing the same has the same advantages, so that the hard metal tool produced has a wide range

Industries such as machining, mining, oil drilling, geological BE2020 / 5214 exploration, and the like.

The present disclosure is to be described in more detail below on the basis of specific exemplary embodiments and comparative examples. Embodiment 1 This embodiment provided a hard metal brazed joint comprising a hard metal material (type: YG13C) and a steel base body 42CrMo, a brazed seam being formed between the hard metal material and the steel base body; In the soldered seam, several copper wires were provided as thread-like buffer substances, which had a diameter of 0.2 mm and a Vickers hardness of 95 HV; and the plurality of thread-like buffer substances were evenly distributed along the length direction of the solder seam, and the distance between each two adjacent thread-like buffer substances along the length direction of the solder seam was 1 mm.

A manufacturing process for this hard metal solder joint comprised the following steps: (a) A first solder BCu58ZnMn was melted, cast, extruded, and drawn, except for a first solder in the form of wire rods with a diameter of 2 mm; The first solder in the form of wire rods was sprayed onto the surface of a hard metal material to be soldered using a thermal spray device after the hard metal material and the surface of a steel base body were subjected to a strict deoiling and sandblasting treatment, whereby a 0.05 mm thick first solder layer was formed; (b) The surface of the copper wires of the buffer substances was subjected to a roughening treatment using sandpaper down to a roughness Ra of 12.5 µm; by in-line dip coating, a layer of a solution containing a first solder was applied to the surface of the buffer substance, this solution containing the first solder being an aqueous ZnCl2 solution with a mass fraction of 30%; and the buffer substance having a surface coated with the first solder was obtained after drying; The buffer substance having a surface coated with the first soldering agent was applied equally spaced (1 mm) and evenly on the surface of the first solder layer; Then a second solder (BAg40CuZnNi) was applied by thermal spray coating to the surface of the first solder layer with the buffer substance, whereby a second solder layer was formed, except for a total thickness of the solder layers required for the solder seam (the first solder layer and the second solder layer) of 0 , 4 mm;

(c) A second solder QJ308 was heated to a molten state BE2020 / 5214, and then the surface of the second solder layer was dip-coated with a layer of the second solder QJ308 to form a 0.2 mm thick solder layer; (d) The steel body underwent induction heating, and the surface temperature of the steel body rose rapidly under the skin effect; and the surface temperature was detected using an on-line infrared temperature detector, and the heating was stopped when it reached 950 ° C; The surface of the cemented carbide material on which the solder layer was formed was brought into contact with the surface to be soldered of the steel base body at the temperature for soldering, so that the first solder layer, the second solder layer and the solder layer were melted and a solder seam was formed therefrom ; and after cooling, this brazed cemented carbide joint was obtained.

Exemplary embodiment 2 This exemplary embodiment provided a hard metal solder connection, the remaining structures being the same as those in exemplary embodiment 1, with the exception of a distance between each two adjacent thread-like buffer substances along the length direction of the solder seam of 2 mm.

With regard to the manufacturing process for this hard metal soldered joint, only the condition “the buffer substance having a surface coated with the first solder was applied equally (1 mm) and evenly to the surface of the first solder layer” in step (b) was replaced by the condition “the Buffer substance having a surface coated with the first solder was “replaced” equally spaced (2 mm) and evenly on the surface of the first solder layer, while the remaining steps and relevant process parameters were the same as those in embodiment 1.

Exemplary embodiment 3 This exemplary embodiment provided a hard metal soldered connection, the copper wire of the thread-like buffer substance having a diameter of 0.2 mm being replaced by a copper strip having a thickness of 0.2 mm and a width of 0.4 mm, while the remaining structures were the same as which were in embodiment 1.

With regard to the manufacturing process for this hard metal soldered connection, only the copper wire in step (b) was replaced by a copper strip with a thickness of 0.2 mm and a width of 0.4 mm, while the remaining 40 steps and process parameters are the same as those in the exemplary embodiment 1 were.

Embodiment 4 BE2020 / 5214 This embodiment provided a hard metal solder joint which had a structure the same as that of the hard metal solder joint provided in embodiment 3.

With regard to the manufacturing method for this cemented carbide solder joint, the only difference was that the thickness of the solder layer in step (c) was 0.1 mm, while the remaining steps and process parameters were the same as those in embodiment 3.

Exemplary embodiment 5 This exemplary embodiment provided a hard metal solder connection, the copper wire of the thread-like buffer substance being replaced by an iron wire, while the remaining structures were the same as those in exemplary embodiment 1.

With regard to the manufacturing process for this hard metal solder joint, only the copper wire in step (b) was replaced by an iron wire, while the remaining steps and process parameters were the same as those in embodiment 1.

Embodiment 6 This embodiment provided a hard metal solder joint having a structure the same as that of the hard metal solder joint provided in embodiment 5.

With regard to the manufacturing method for this hard metal solder joint, the only difference was that the thickness of the solder layer in step (c) was 0.1 mm, while the remaining steps and process parameters were the same as those in embodiment 5.

Embodiment 7 This embodiment provided a hard metal solder joint comprising a hard metal material (type: YG13C) and a steel base body 42CrMo, a soldered seam being formed between the hard metal material and the steel base body; In the soldered seam, several copper wires were provided as thread-like buffer substances, which had a diameter of 0.1 mm and a Vickers hardness of 95 HV; and the plurality of thread-like buffer substances were evenly distributed along the length direction of the soldering seam, and the distance between every two adjacent thread-like buffering substances along the length direction of the soldering seam was 1 mm.

A manufacturing process for this hard metal brazed joint comprised the following steps:

(a) A first solder BAg49ZnCuMnNi was melted, cast, BE2020 / 5214 extruded, and drawn, except for a first solder in the form of wire rod with a diameter of 2 mm; The first solder in the form of wire rods was sprayed onto the surface of a hard metal material to be soldered using a thermal spray device after the hard metal material and the surface of a steel base body were subjected to a strict deoiling and sandblasting treatment, whereby a 0.05 mm thick first solder layer was formed; (b) The surface of the copper wires of the buffer substances was subjected to a roughening treatment using sandpaper down to a roughness Ra of 12.5 µm; by in-line dip coating, a layer of a solution containing a first solder was applied to the surface of the buffer substance, this solution containing the first solder being an aqueous ZnCl> solution with a mass fraction of 30%; and the buffer substance having a surface coated with the first solder was obtained after drying; The buffer substance having a surface coated with the first soldering agent was applied equally spaced (1 mm) and evenly on the surface of the first solder layer; then a second solder (BAg25CuZnMnNi) was applied by thermal spray coating to the surface of the first solder layer with the buffer substance, a second solder layer being formed, except for a total thickness of the solder layers required for the solder seam of 0.3 mm; (c) A second solder FB102 was heated to a molten state, and then the surface of the second solder layer was dip-coated with a layer of the second solder FB102 to form a 0.2 mm thick solder layer; (d) The steel body underwent induction heating, whereby the surface temperature of the steel body rose rapidly under the skin effect; and the surface temperature was detected using an on-line infrared temperature detector, and the heating was stopped when it reached 780 ° C; The surface of the cemented carbide material on which the solder layer was formed was brought into contact with the surface to be soldered of the steel base body at the temperature for soldering so that the first solder layer, the second solder layer and the solder layer were melted and a solder seam was formed therefrom ; and after cooling, this cemented carbide solder joint was obtained.

Embodiment 8

This embodiment provided a hard metal brazed joint, BE2020 / 5214 comprising a hard metal material (type: YG13C) and a steel base body of 42CrMo, a brazed seam being formed between the hard metal material and the steel base body; In the soldered seam, several iron strips were provided as strip-shaped buffer substances, which had a thickness of 0.2 mm, a width of 0.4 mm, and a Vickers hardness of 95 HV; and the plurality of strip-shaped buffer substances were evenly distributed along the length direction of the solder seam, and the distance between every two adjacent strip-shaped buffer substances along the length direction of the solder seam was 1 mm.

A manufacturing process for this hard metal solder joint comprised the following steps: (a) A first solder BAg49ZnCuMnNi was melted, cast, extruded, and drawn, except for a first solder in the form of wire rods with a diameter of 2 mm; The first solder in the form of wire rods was sprayed onto the surface of a hard metal material to be soldered using a thermal spray device after the hard metal material and the surface of a steel base body were subjected to a strict deoiling and sandblasting treatment, a 0.05 mm thick first solder layer being formed; (b) The surface of the copper wires of the buffer substances was subjected to a roughening treatment using sandpaper down to a roughness Ra of 12.5 µm; a layer of a solution containing a first soldering agent was applied to the surface of the buffer substance by in-line dip coating, this solution containing the first soldering agent being an aqueous ZnCl 2 solution with a mass fraction of 30%; and the buffer substance having a surface coated with the first solder was obtained after drying; The buffer substance having a surface coated with the first soldering agent was applied equally spaced (1 mm) and evenly on the surface of the first solder layer; then a second solder (BAg40CuZnNi) was applied by thermal spray coating to the surface of the first solder layer with the buffer substance, whereby a second solder layer was formed, except for a total thickness of the solder layers required for the solder seam of 0.4 mm; (c) A second solder FB102 was heated to a molten state, and then the surface of the second solder layer was dip-coated with a layer of the second solder FB102 to form a 0.1-40 mm thick solder layer;

(d) The steel body underwent induction heating, with BE2020 / 5214 the surface temperature of the steel body rising rapidly under the skin effect; and the surface temperature was detected using an on-line infrared temperature detector, and the heating was stopped when it reached 950 ° C; The surface of the cemented carbide material on which the solder layer was formed was brought into contact with the surface to be soldered of the steel base body at the temperature for soldering, so that the first solder layer, the second solder layer and the solder layer were melted and a solder seam was formed therefrom ; and after cooling, this cemented carbide solder joint was obtained.

Embodiment 9 This embodiment provided a hard metal solder joint comprising a hard metal material and a steel base body, a soldered seam being formed between the hard metal material and the steel base body; In the soldered seam, several strips of an iron-nickel alloy were provided as strip-shaped buffer substances and a thread-shaped buffer substance; and the plurality of strip-shaped buffer substances were evenly distributed along the length direction of the solder seam, and the distance between each two adjacent strip-shaped buffer substances along the length direction of the solder seam was 1 mm.

A manufacturing method for this cemented carbide solder joint comprised the following steps: (a) A cemented carbide material having a type of YG13C and a steel base body of 42CrMo were provided; A first solder BAg49ZnCuMnNi was melted, cast, extruded, and drawn, except for a first solder in the form of wire rod with a diameter of 2 mm; The first solder in the form of wire rods was sprayed onto the surface of a hard metal material to be soldered using a thermal spray device after the hard metal material and the surface of a steel base body were subjected to a strict deoiling and sandblasting treatment, whereby a 0.05 mm thick first solder layer was formed; (b) Copper wires as thread-like buffer substances having a thickness of 0.2 mm, a width of 0.4 mm, and a Vickers hardness of 80 HV were provided; The surface of the copper wires of the buffer substances was subjected to a roughening treatment using sandpaper, except for roughness

Ra of 12.5 µm; a layer of BE2020 / 5214 of a solution containing a first soldering agent was applied to the surface of the buffer substance by an inline dip coating, this solution containing the first soldering agent being a 30% aqueous ZnCl2 solution, the mass fraction of ZnClz being 30%; and the buffer substance having a surface coated with the first solder was obtained after drying; The buffer substance having a surface coated with the first soldering agent was applied equally spaced (1 mm) and evenly on the surface of the first solder layer; Then a second solder (BAg25CuZnMnNi) was applied by thermal spray coating to the surface of the first solder layer with the buffer substance, whereby a second solder layer was formed, except for a total thickness of the solder layers required for the solder seam of 0.4 mm: (c) A second solder FB102 was heated to a molten state, and then the surface of the second solder layer was dip-coated with a layer of the second solder FB102 to form a 0.1 mm thick solder layer; (d) The steel body underwent induction heating, whereby the surface temperature of the steel body rose rapidly under the skin effect; and the surface temperature was detected using an on-line infrared temperature detector, and the heating was stopped when it reached 950 ° C; The surface of the cemented carbide material on which the solder layer was formed was brought into contact with the surface to be soldered of the steel base body at the temperature for soldering so that the first solder layer, the second solder layer and the solder layer were melted and a solder seam was formed therefrom ; and after cooling, this cemented carbide solder joint was obtained.

Comparative Example 1 This comparative example was a contrast experiment of Embodiment 1, wherein the soldering temperature, soldering time and solder were the same as those in Embodiment 1, and included the following steps: a YG13C cemented carbide block, a sandwich composite coated with a solder (ie with a compensating washer) and 42CrMo steel were assembled one after the other; the steel body underwent induction heating, and the surface temperature of the steel body rose rapidly under the skin effect; the surface temperature was detected using an on-line infrared temperature detector, and the heating was stopped when it reached 950 ° C; and after cooling, a BE2020 / 5214 soldered joint made of YG13C hard metal and 42CrMo steel was obtained.

Comparative Example 2 This comparative example represented a contrast experiment of Embodiment 4, wherein the soldering temperature, soldering time, and solder were the same as those in Embodiment 4, and specific steps were the same as those in Comparative Example 1.

Comparative Example 3 This comparative example was a contrast experiment of Embodiment 5, wherein the soldering temperature, soldering time, and solder were the same as those in Embodiment 5, and specific steps were the same as those in Comparative Example 1.

Comparative Example 4 This comparative example represented a contrast experiment of Embodiment 6, wherein the soldering temperature, soldering time, and solder were the same as those in Embodiment 6, and specific steps were the same as those in Comparative Example 1.

Comparative Example 5 This comparative example represented a contrast experiment of Embodiment 7, wherein the soldering temperature, soldering time and solder were the same as those in Embodiment 7, and specific steps were the same as those in Comparative Example 1.

Comparative Example 6 This comparative example represented a contrast experiment of Embodiment 8, wherein the soldering temperature, soldering time, and solder were the same as those in Embodiment 8, and specific steps were the same as those in Comparative Example 1.

Comparative Example 7 This comparative example represented a contrast experiment of embodiment 8, wherein the several strip-shaped buffer substances were unevenly distributed along the length direction of the solder seam, and the distances between each two adjacent strip-shaped buffer substances along the length direction of the solder seam had a distribution rule of 0.5 mm-1, 5mm-0.5mm-1.5mm, while other structures were the same as those in Embodiment 8.

In the manufacturing method for a hard metal brazed joint provided in this comparative example, an equidistant (1 mm) distribution of the buffer substances in step (b) was determined by a distribution rule of

0.5mm-1.5mm-0.5mm-1.5mm replaced, while remaining steps and BE2020 / 5214 process parameters were the same as those in embodiment 8. In order to describe the technical effects of the above working examples and the comparative examples, the following experimental example was specifically carried out.

Experimental Example 1 The shear strength of the cemented carbide solder joints obtained in the respective Working Examples and Comparative Examples were tested, and specific results are shown in Table 1.

The shear strength was tested in the following way: Using the microcomputer-controlled mechanical electronic universal testing machine MTS C45.105, a pressure shear test of soldered joints was carried out at room temperature, the indenter being moved and pressurized at a speed of 1 mm / s, and the shear strength was calculated using the formula T = F / S.

In the formula: T-shear strength of the compound / MPa; F breaking load / N; S-effectively connected area of the solder connection / mm £.

Table 1 Groups of Shear Strength (MPa) Experiment Example 1 203.7 Example 2 202.3 Example 3 201.8 Example 4 204.9 Example 5 201.3 Example 6 202.4 Example 7 233.7 Example 8 232.4 Example 9 229.4 Comparative Example 1 194.6 Comparative Example 2 196.5 Comparative Example 3 191.7 Comparative Example 4 193.6 Comparative Example 5 224.6

It can be seen from the data in Table 1 that the shear strength of the hard metal soldered connections provided by the respective exemplary embodiments of this disclosure is overall better than that of the hard metal soldered connections provided in the comparative examples. A good technical effect of the hard metal solder connection is therefore achieved in this disclosure in that several buffer substances are inserted into a solder seam and the buffer substances are evenly distributed along the length direction of the solder seam.

Finally, it should be explained that the above respective exemplary embodiments are only used to describe the technical solutions of this disclosure, instead of restricting the same. Although this disclosure is described in detail with reference to the preceding respective exemplary embodiments, the person skilled in the art should understand that the technical solutions recorded in the preceding respective exemplary embodiments could still be modified or partial or all technical features therein could be equivalently substituted while these modifications or Substitutions do not cause any deviation of the essence of the corresponding technical solutions from the scope of the technical solutions of the respective exemplary embodiments of this disclosure.

Claims (10)

Expectations: 1. Hard metal soldered connection, characterized in that the hard metal soldered connection comprises a hard metal material and a steel base body, a soldered seam being formed between the hard metal material and the steel base body; In the solder seam several buffer substances are arranged, which are evenly distributed along the length direction of the solder seam. 2. Hard metal solder joint according to claim 1, characterized in that the material of the buffer substance contains any one or a combination of at least two from the group consisting of copper, a copper alloy, nickel, a nickel alloy, iron or a ferro alloy. 3. Hard metal soldered connection according to claim 1, characterized in that the buffer substance contains a thread-like buffer substance and / or a strip-shaped buffer substance; the diameter of the thread-like buffer substance is preferably 0.05-2 mm; the length of the thread-like buffer substance is preferably 5-40 mm; the thickness of the strip-shaped buffer substance is preferably 0.05-2 mm; the length of the strip-shaped buffer substance is preferably 5-40 mm, and the width thereof is 1-4 mm; and the strip-shaped buffer substance is preferably provided with through holes along the thickness direction thereof. 4. Hard metal soldered connection according to claim 1, characterized in that the distance between two adjacent buffer substances along the length direction of the soldered seam is 0.1-10 mm; the Vickers hardness of the buffer substance is preferably 40-100 HV; and the straightness tolerance of the buffer substance is preferably 5/1000. 5. Hard metal solder connection according to claim 1, characterized in that the distance between the plurality of buffer substances and the soldering surface of the hard metal material is in each case independently 0.05-0.2 mm; the distance between the plurality of buffer substances and the soldering surface of the steel base body is preferably in each case 0.1-0.3 mm independently; and the distance between the buffer substance closest to the edge of the soldered seam BE2020 / 5214 along the width direction of the solder seam and the edge of the solder seam along the width direction of the solder seam is preferably 0.1-0.3 mm. 6. Hard metal solder connection according to one of claims 1-5, characterized in that the thickness of the solder seam is 0.2-10 mm. 7. Manufacturing method for a hard metal solder connection according to one of claims 1-6, characterized in that the manufacturing method comprises the following steps: the hard metal solder connection is obtained by inserting several buffer substances when soldering a hard metal material and a steel base body in a solder seam formed by the hard metal material and the steel base body will; the manufacturing method for a hard metal soldered connection preferably comprises the following steps: (a) coating a surface to be soldered of the hard metal material with a first solder in order to form a first solder layer; (b) placing a buffer substance having a surface coated with a first solder along the length direction of the solder seam evenly on the surface of the first solder layer, and then coating the surface of the first solder layer on which the buffer substance is placed with a second solder, whereby a second solder layer is formed; (c) coating the surface of the second solder layer with a second solder to form a solder layer; and (d) contacting the surface of the cemented carbide material on which the solder layer is formed with the surface to be soldered of the steel base body at a temperature for soldering so that the first solder layer, the second solder layer and the solder layer are melted and a solder seam is formed therefrom ; and then maintaining the cemented carbide solder joint after cooling; wherein in step (a) and step (c) the coating preferably each independently comprises spray coating or melt coating. 8. Manufacturing method according to claim 7, characterized in that the thickness of the first solder layer in step (a) is 0.1-10 mm; the thickness of the second solder layer in step (b) is preferably 0.1-10 mm; and the thickness of the solder layer in step (c) is preferably 0.1-1 mm BE2020 / 5214. 9. Manufacturing method according to claim 7 or 8, characterized in that in step (a), before the step of coating a surface to be soldered of the hard metal material with a first solder, the manufacturing method includes a step for de-oiling and sandblasting on the surface to be soldered Hard metal material includes; in step (b), before the step of coating the surface of the buffer substance with a first solder, the manufacturing method preferably further comprises a step of roughening the surface of the buffer substance using sandpaper down to a roughness Ra of 12.5-50 µm; and in step (d), the temperature for soldering is preferably To ° C, and the melting point of a substance having a higher melting point among the solders in the first solder layer and the second solder layer is T ° C, with T +30 <To s T +50. 10. Hard metal tool, characterized in that the hard metal tool comprises a hard metal solder connection according to one of claims 1-6 or a hard metal solder connection which is produced by a manufacturing method for a hard metal solder connection according to one of claims 7-9.