BE1024914A1 - A HEATING SYSTEM AND A HEATING METHOD - Google Patents

Abstract

A heating system and method for heating by means of at least one processing unit having at least one processor for performing computational tasks. A container unit is adapted to hold a medium, wherein the at least one processing unit is thermally coupled to at least a portion of the container unit for transferring thermal energy produced by the at least one processing unit to the at least a portion of the container unit for heating medium in the holder unit.

Description

(30) Priority data:

(71) Applicant (s):

MINNOY BVBA 3220, HOLSBEEK Belgium (72) Inventor (s):

MINNOY Chris 3220 HOLSBEEK Belgium (54) A HEATING SYSTEM AND A HEATING METHOD (57) A heating system and method of heating by at least one processing unit having at least one processor for performing computational tasks. A container unit is arranged to hold a medium, in which the at least one processing unit is thermally coupled to at least part of the container unit for transferring thermal energy produced by the at least one processing unit to the at least part of the container unit for heating medium in the container unit.

Fig. 1

BE2017 / 5024

Title: a heating system and a heating method

FIELD OF THE INVENTION

The invention relates to heating systems, and methods of heating. The invention further relates to a heat storage container unit.

BACKGROUND OF THE INVENTION

Heating systems are extensively used to provide heating to a designated space and / or to heat a designated medium, for example, to supply hot water to a building or facility. Heating can be performed using a combustion heating system, e.g. using natural gas, fuel oil, wood pellets, etc., a heat pump system, solar heating system and / or an electric heating system. Other heating systems are also well known. However, there is a constant need to improve the efficiency of these heating systems. Efficient use of energy during heat production and heat transfer can play an important role in reducing net energy consumption and consequently emissions of greenhouse gases. Rising costs of energy sources such as fossil fuels are expected to become a relevant concern in many industries and households. In addition, global warming and climate change appear to be at the forefront of global attention, further increasing the need for improved heating efficiency. There is a desire for a significant reduction in the carbon footprint and / or a significant improvement in the efficient use of renewable energy.

Data centers come in various sizes and shapes and tend to consume a relatively large amount of (electrical) energy for their operation.

A data center can consist of one or more processing units.

Energy consumption can be a central theme for data centers, which can range from a few kW or even lower for a rack of servers in a data center cabinet to several tens of MW for large data center facilities. The electric

BE2017 / 5024 energy can be supplied by power stations, which can be powered by natural gas, coal and / or other energy sources, such as nuclear, wind energy, hydropower, etc. Data centers are becoming increasingly important because they offer computational means for carrying out a wide range of calculation tasks. A data center may include one or more computer servers which may be arranged to serve primarily as a computing node (CPU and / or GPU intensive tasks) or as a data node (primarily data storage), or a combination of the two. Typically, a data center includes a relatively large processing capacity and a large storage capacity. As a result of ever-increasing connectivity, a large number of computers / server, typically housed in a data center, become available for direct or indirect use. The datacenter's computers / servers may include computing or processing units, which may be configured, for example, to perform computational tasks for a longer period of time. Many online services, which can be used, for example, by means of a mobile phone, desktop, laptop, etc., use large data centers to provide and deliver their digital (online) services. Furthermore, additional data centers designed to manage the Internet of Things (ΙοΤ) are expected to further increase the demand for electricity, making the need for energy-efficient systems even more important.

SUMMARY OF THE INVENTION

It is an object of the invention to provide a heating system and method by means of at least one processing unit which overcomes at least one of the above-mentioned drawbacks.

It is a further object of the invention to improve efficiency and / or reduce heating costs.

To this end, according to one aspect, a system for heating by means of a processing unit is provided. The system includes at least one processing unit with at least one processor for performing computational tasks. The system further includes a container unit for holding a medium. The at least one processing unit can be thermally coupled to at least a part of the container unit by means of

BE2017 / 5024 at least one heat pipe. The at least one heat pipe may be arranged to transfer thermal energy produced by the at least one processing unit to the at least one part of the container unit for heating medium in the container unit.

Inexpensive. thermal energy generated by the at least one processing unit as a result of performing computational tasks can be transferred to the medium in the container unit by means of a heat pipe cooling. In this way, the system has the ability to reuse thermal energy, otherwise lost to the environment, and channels the heat through the heat pipe to the medium in the container unit where this heat energy can be converted to produce hot water and / or supply heat, carried by the medium, to residents in buildings. In an example, a plurality of heat pipes may be arranged to extract heat from the at least one processing unit to the medium in the container unit, rather than transfer the heat to, for example, a heat sink for dissipation to the environment. In one embodiment, the container unit may be in the form of a vessel or a tank for storage of the medium. Advantageously, the container unit can be insulated to limit heat loss. In this way, the thermal energy of the heated medium can be collected for later use. Such a container unit may be a water storage tank, arranged for domestic water heating to enable rapid delivery of hot water on demand, for commercial, industrial and / or private use.

The heat pipe is arranged to facilitate the transfer of heat generated to the one or more heat processing units of the system. to the medium in the container unit. A heat pipe typically consists of a liquid in a tube, which begins to boil, thereby removing local heat. The clamp formed as a result of cooking can then condense at some distance, releasing its heat. The condensed liquid may then flow back through gravity and / or capillaries through narrow passages. As a result of the capillary means, the displacement of liquid can take place without the need for gravity. In this way, a supply end of the heat pipe, i.e. an end where the liquid starts boiling in use, can

BE2017 / 5024 be arranged higher than an output end of the heat pipe, i.e. an end where the vapor formed from the liquid starts to condense. Therefore, a heat pipe can be thought of as a two-phase heat transfer (boiling liquid). Typically, such a heat transfer is more efficient and / or faster than heat transfer through a solid heat transfer material, such as copper.

Optionally, the system is designed, e.g. optimized, for private household use, e.g. in a family home.

Optionally, the container unit 4 may have a volume of less than 500 liters, preferably less than 250 liters, more preferably less than 200 liters. Consequently, the holder can be optimized for private household use, e.g. in one family house.

Optionally, the at least one processing unit is arranged under and / or at the bottom of the container unit.

In this way, the heat pipes can transfer heat up to the container unit, allowing efficient cooling of the at least one processing unit performing one or more computational tasks. In an example, a computer equipment including at least one processing unit can be cooled at any time as a result of arranging the processing unit below / below the container unit.

According to a second aspect, there is hereby provided a system for heating by means of a processing unit. The system includes at least one processing unit having at least one processor for performing computational tasks. The system. further includes a container unit for holding a medium. The at least one processing unit can be arranged below or below the container unit. At least one heat pipe can be arranged to transfer thermal energy produced by the at least one processing unit to the part of the container unit for heating medium within the container unit.

In this way, advantageously, an increased amount of thermal energy generated by the at least one processing unit can be recovered for use of tap water or heating a building. Advantageously, a processing unit (e.g. a computer server) can be arranged under the holder unit.

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The generated heat as a result of the at least one processing unit performing one or more computational tasks can be transferred by a heat pipe to a medium, within the container unit, forming at least part of a thermal path between the at least one processing unit and the medium in the container unit.

Optionally, a radiator can be arranged with one or more heat pipes to extract residual heat from the computer equipment of the processing unit and to transfer it efficiently to the container unit containing a medium for thermal storage. The medium can be but is not limited to water, oil or a phase change material (PCM). In this way, advantageously, a stable temperature range can be provided for the electronic equipment.

Optionally, the processing unit is arranged next to the holder unit. Heat generated by the processing unit as a result of performing computational tasks can be transferred by one or more heat pipes arranged between the processing unit and the container unit. In this way, heat can be transferred through the heat pipes from the processing unit to the holding unit. The heat pipe can for instance be connected to a wall part of the holder unit. This allows the transfer of generated heat to the medium in the container unit.

Optionally, the heat pipes are arranged to utilize the capillary effect so that other orientations of the processing unit can be used with respect to the container unit.

Optionally, the at least one processing unit is directly thermally coupled to a wall portion of the container unit by means of the at least one heat pipe.

The heat generated by the at least one processing unit can be guided to a wall part of the holder unit by means of the at least one heat pipe, in which the heated wall part of the holder unit can further transfer the heat to the medium in the holder unit, forming a thermal path between the processing unit and the medium in the container unit. Advantageously, the wall part of the holder unit can be formed from a thermally conductive material.

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Optionally, the at least one processing unit is directly thermally coupled to the medium in the container unit by means of the at least one heat pipe.

In this way, heat transfer between the at least one processing unit and the medium in the container can be enhanced. The loss of heat to the environment can thus be reduced by applying a direct thermal coupling.

Optionally, the system further comprises a thermal coupling member arranged to form a thermal coupling between the at least one processing unit and a part of the container unit.

Other ways can also be used to form the thermal path from the at least one processing unit to a part of the container unit to transfer the heat to the medium within the container unit, so that, but not limited to, a plate (e.g. in copper) adapted to improve the heat transfer, a heat sink, a heat pump element, a Peltier element, etc. A combination of different means can also be used as a thermal coupling part. For example, one or more heat pipes can be thermally coupled to a heat sink,

Optionally, the thermal coupling member comprises a heat pump arranged to transfer thermal energy from the at least one processing unit to the container unit.

The heat transfer rate from the at least one processing unit to a part of the holding unit can be adjusted by means of a heat pump. In an example, the rate of heat transfer by the heat pump is controlled depending on the amount of heat generated by the at least one processing unit. Advantageously, the temperature of the at least one processing unit can be monitored, while allowing efficient energy transfer to the medium in the container unit.

Optionally, the thermal coupling member includes a thermoelectric cooler for adjusting the rate of thermal energy transfer to the container unit.

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Typically, such a thermoelectric cooler (TEC) uses the Peltier effect to create a heat flux between the junction of two types of materials, such a heat pump uses electrical energy and is configured to transfer heat from one side of the device to the other side of the device depending on the direction of the flow. In fact, a Peltier heat pump can be used for either heating or cooling. In an example, the thermoelectric cooler is arranged to control the cooling of the at least one processing unit. Advantageously, the thermoelectric cooler has no circulating liquid (cf, heat pipe) and moving parts and can be small in size,

Optionally, the thermal coupling member includes means for coupling the at least one processing unit to a heat exchanger arranged in the container unit.

In this way, the heat transfer can be further improved.

Also, advantageously, losses of heat to the environment can be reduced since the heat exchanger is substantially contained in the container unit.

Optionally, the thermal coupling member includes means for coupling the at least one processing unit to a heat exchanger arranged outside of the container unit.

In this way, the system can be simplified while heat transfer is improved. In an example, the heat exchanger is arranged over at least part of a wall of the container unit.

Optionally, the heat exchanger is a spiral heat exchanger.

The spiral heat exchanger can be arranged to improve heat transfer from the at least one processing unit to the medium in the container unit. Many types of spiral heat exchangers exist. The heat exchanger can be arranged inside, outside, or both hinning and outside the container unit.

Optionally, at least two processing units are arranged, in which a first processing unit of the at least two processing units is thermally coupled to a first location on or in the container unit by means of a first heat pipe, and a second processing unit of the at least two processing units is thermally coupled to a second location on or in the

BE2017 / 5024 holder unit by means of a second heat pipe, in which the first location is different from the second location. In this way, the processing units can have independent thermal paths to the container unit. This can improve heat transfer and can also make the system more robust.

Optionally, the first processing unit is coupled to a first heat exchanger positioned at the first location on or in the container unit and the second processing unit is coupled to a second heat exchanger positioned at a second location on or in the container unit, wherein the first heat exchanger and the second heat exchanger are respectively offset opposite one another in a height direction of the container unit. The height direction of the container may be, for example, a longitudinal direction or an upright container unit.

The temperature of the medium in the container unit may depend on the location. Typically, in certain cases, during use, the temperature of the medium within the container unit depends on the height with respect to a height direction of the container unit. Heat transfer can be improved by arranging the first and second heat exchangers at different heights. In an example, the rate of heat production (heat flux) by the first processing unit and the rate of heat production by the second processing unit are different, so that heat transfer can be enhanced by thermally coupling the first processing unit with the first heat exchanger and the second processing unit with the second heat exchanger,

Optionally, in use, the first processing unit has a higher thermal energy output capacity than that of the second processing unit, wherein the first heat exchanger is arranged closer to an upper end of the container unit than the second heat exchanger.

As a result of the formed thermal paths from the first processing unit to the first heat exchanger and from the second processing unit to the second heat exchanger, the entire heat transfer of the heat generated from the first processing unit and the second processing unit to the medium in the container unit can be promoted .

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Optionally, the at least one processing unit includes a plurality of components, wherein at least a first component is thermally coupled to a third location on or in the container unit by a third heat pipe and at least a second component is thermally coupled to a fourth location on or in the container unit through a fourth heat pipe, the third location different from the fourth location.

Different components of the at least one processing unit, in use, can result in different heat fluxes. By forming different thermal paths from the different components to different locations on or in the container unit, the entire heat transfer can be improved,

Optionally, at least the first component is coupled to a first heat exchanger placed at the third location on or in the container unit and / or at least a second component is coupled to a second heat exchanger placed at the fourth location on or in the container unit, wherein the first heat exchanger and the second heat exchanger are offset from each other in a height direction of the container unit.

Advantageously, the overall heat transfer from the first and second components to the medium in the container unit can be further improved.

Optionally, in use, the at least one first component has a higher thermal energy output capacity than the at least a second component, wherein the first heat exchanger is arranged closer to an upper end of the container unit than the second heat exchanger.

Optionally, the at least one processing unit is arranged on a bottom side of the holder unit and is coupled to a bottom part of the holder unit.

Optionally, the system further comprises a module holder adapted to hold at least one processing unit, wherein the module holder is thermally coupled to the holder unit by means of at least one heat pipe.

Such a module holder can be advantageous for installation of a processing unit. Also, replacement of a processing unit can be facilitated. In this way, a modular design can be achieved

BE2017 / 5024 in which each processing unit can be seen as a module. The module holder may already include means for forming a thermal path from a processing unit placed in a module holder slot to the holder unit. Advantageously, the module holder can be adapted to reduce heat loss to the environment, so as to improve the heat transfer efficiency from the processing unit held by the module holder to the medium in the holder unit.

Optionally, a plurality of processing units are received in the module holder.

The module holder may be arranged to hold a plurality of processing units and allow thermal coupling between the processing units and the medium in the holder unit. The module holder may comprise a plurality of slots in which a slot is arranged to hold a processing unit.

Optionally, at least one processing unit is removably connected to the module holder.

The module holder may include a slot to allow insertion and removal of a processing unit. A thermal coupling and an electrical connection for supplying power to the processing unit can be provided by means of the slot. A slot can be arranged to hold a single processing unit. Additionally or alternatively, a slot can also be arranged to hold one or more processing units. Furthermore, in an example, a slot can include a cover so as to reduce heat loss to the environment. The slots may have a destination forming a thermal path to a location of the container unit. In an example, a plurality of slots are arranged to allow a thermal path to different locations of the container unit. A single slot can allow different thermal paths to different locations on or in the container unit. This can improve the transfer of generated heat from the at least one processing unit to the medium in the container unit.

Optionally, the module holder includes at least one receiving slot adapted to receive a processing unit, wherein a processing unit of the at least one processing unit is arranged to receive

BE2017 / 5024 slide into a receiving slot of the module holder, wherein the module holder is arranged to provide a thermal coupling between the at least one processing unit inserted in the at least one receiving slot and a part of the holder unit.

The receiving slot may also include locking capabilities adapted to lock a processing unit in the receiving slot. Furthermore, drive means may be arranged to allow at least partial automatic insertion of the processing unit into the receiving slot of the module holder. Advantageously, the processing unit can be arranged. to slide into a receiving slot in a position under the holder unit.

Optionally, the module holder includes a plurality of receiving slots each configured to receive a processing unit.

In an example, a stack of receiving slots are arranged in the module holder. In this way, the multitude of receiving slots can be easily accessed, which can also be beneficial for maintenance. In a further embodiment, a module holder may include an opening and drive capabilities to automatically move a processing unit inserted into the opening of a readily available slot. Such a solution can be particularly advantageous when the module holder comprises a relatively large number of receiving slots. The system can be simplified, as a plurality of receiving slots can be occupied using only one insertion opening. Through the drive options, potentially hard-to-reach receiving slots can be easily selected. Also, the system can be arranged to automatically detect the specifications of the processing unit and select a receiving slot based on the available specifications. For example, a power requirement or heat production of a processing unit can be taken into account by the receiving slot selection system. The receiving slots can allow a thermal path to different locations in or on the container unit.

Optionally, the at least one processing unit in the module holder is cooled by means of a cooling device arranged for transferring

BE2017 / 5024 heat from the at least one processing unit in the module holder to the medium in the holder unit. The cooling device can allow active and / or passive cooling of the processing unit,

Optionally, the system includes a closed housing to house the at least one processing unit. Optionally, the system includes a plurality of closed enclosures, each housing a respite / individual processing unit. The closed housing can form a removable module, removable from the system.

Optionally, the at least one processing unit is cooled by means of immersion cooling. The at least one processing unit can be immersed in a liquid in the closed housing in order to improve the heat transfer. After all, cooling can also allow higher power consumption by the electronic components of the processing unit, since more efficient cooling can be provided.

Optionally, the container unit includes a supply opening for receiving a liquid and a discharge opening for releasing a liquid, containing the heating system. is adapted to increase the temperature of the liquid received at the supply opening before releasing the liquid at the discharge opening. Better heat transfer can be obtained when the liquid is liquid. Advantageously, the liquid in the container unit is water.

Optionally, the supply opening and discharge opening are the same.

Optionally, the medium in the container unit is water and the container unit is a hot water tank equipped for hot water storage.

Water can be supplied to the container unit through the supply opening to be heated in the container unit. When necessary, hot water can be taken through the drain hole of the container unit. The hot water can be warm tap water.

Optional, the medium in the container unit is an oil,

Optionally, the medium in the container unit is a phase change material. A phase change material (PCM) is a substance capable of storing and releasing energy. A PGM can be a latent heat storage unit in which, for example, heat is absorbed or

BE2017 / 5024 released when the material changes from solid to liquid and vice versa.

Optionally, the container unit includes one or more sub-tanks in an outer tank of the container unit. The at least one heat pipe can be thermally coupled to at least one of the one or more sub-tanks and / or the medium in the at least one of the one or more sub-tanks,

Optionally, the system further comprises a control unit adapted to determine a need for thermal energy output for heating the medium in the container unit, selecting one or more computational tasks to be performed by the at least one processing unit depending on the need thermal energy output, and controlling the at least one processing unit to perform the one or more computational tasks to obtain the resulting thermal energy output substantially corresponding to the required thermal energy output.

In this way, the computational tasks can be adapted to the demand of the thermal energy needed to heat the medium in the container unit (e.g. water),

Optionally, the resulting thermal energy output is increased by selecting more computational tasks.

Optionally, the resulting thermal energy output is increased by reducing an interval between successive tasks.

Optionally, the thermal energy output is increased by selecting a more computationally intensive task.

Optionally, the thermal energy output is increased by selecting more or different processing devices. The thermal energy output generated by a CPU and a GPU may differ. In an example, the energy output is increased by selecting more GPU tasks performed on a GPU processing device. Furthermore, also an application specific integrated circuit (ASIC) can be applied for the purpose of changing the thermal energy output by selecting more or different processing devices.

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Optionally, the thermal energy output is programmatically controlled based on a pressure level or liquid level in the housing. Preferably the housing is a closed enclosure.

Optionally, the thermal energy output is programmatically controlled based on a pressure level or liquid level in the container.

Optionally, the at least one processing unit is connected to an electric power source, wherein the control unit is configured to obtain data representative of a parameter of electricity from the power source and to assign the one or more computational arithmetic tasks over time based on the parameter. Accordingly, the local consumption of electric power to perform computational tasks can be controlled based on the parameter of electricity from the power source.

Optionally, the power source is at least one from a power grid, a local photovoltaic solar unit, or a rechargeable battery.

Optionally, the parameter is one or more of a voltage of the electricity from the electricity grid, a cost per unit of the electricity from the electricity grid, a availability of renewable energy, or a frequency of electricity from the power source,

Optionally, the data representative of the parameter is based on a prediction. The value of the parameter can be variable over time. The prediction can predict the variable value over time.

Optionally, the controller is configured to determine data representative of an amount of thermal energy required within a time schedule for heating the medium in the container unit to a desired temperature, determining a parameter of the power source's electricity for at least one divide the time schedule, and assign the one or more computational arithmetic tasks over the time schedule based on the prediction of the parameter and the data representative of the amount of thermal energy required. Accordingly, the local consumption of electrical power to perform the computational tasks can be checked over time based on the prediction of the power source parameter of electricity and based on the thermal energy required within the timetable.

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Optionally, the data representative of the amount of thermal energy required is based on a prediction. For example, the forecast may be based on historical data on a thermal energy usage pattern over time.

Optionally, the prediction of the parameter and / or the prediction of the amount of thermal energy required is a continuous prediction.

Optionally, the computational tasks are adapted to the mode of operation, such as playing, media streaming, batch calculations, etc. Likewise, the system can be arranged to provide quality management to the power grid while heating the container unit.

Optionally, the heating system is arranged to monitor the temperature in the vessel to protect against overheating of the electronic computer equipment of the at least one processing unit. Optionee]., The heating system is arranged, when the temperature in the vessel exceeds a first temperature threshold, to indicate to a user that a limited time remains before the processing unit will be slowed and / or stopped, and / or, when the temperature in the vessel exceeds a second temperature threshold, slowing down the processing unit and / or stopping.

Optionally, the heating system is arranged to present the user with an estimated time remaining before the second temperature threshold is reached. For example, the time remaining can be calculated based on the current temperature, the maximum temperature allowed, the average power while the processing unit is running and the properties of the storage medium (water, oil or PGM). This information can be presented locally, eg on a screen, eg via LED indication, via sound, and / or on a remote device. The remote device can be, for example, a TV, smart TV, mobile phone, smart watch, tablet, VR glasses, etc. It is possible that when the second temperature threshold. The processing performed on the processing unit continues on another computer server and can be streamed over the Internet.

Optionally, the container unit is thermally insulated so as to store thermal energy in the medium in the container unit.

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Optional, the container unit is an upright vessel,

According to a further aspect, there is hereby provided a heating system for heating a medium by means of a processing unit. The system includes at least one processing unit having at least one processor for performing computational tasks, and a container unit for containing a medium. The at least one processing unit can be thermally coupled to transfer thermal energy produced by the at least one processing unit to the medium. The at least one processing unit can be connected to an electric power source. The controller can be configured to obtain data representative of a parameter of electricity from the power source and to assign one or more computational computational tasks over time based on the parameter. The data representative of the parameter may be based on a prediction of the parameter.

Optionally, the control unit is configured to determine the data representative of an amount of thermal energy required within a time frame for heating the medium to a desired temperature, determining the prediction of the power source parameter for at least part of the power source. time schedule, and assigning the one or more computational arithmetic tasks over the time schedule based on the prediction of the parameter and the data representative of the amount of thermal energy required.

Optionally, the data representative of the amount of thermal energy required is based on a prediction.

Optionally, the electric power source is at least one of a power grid, a local photovoltaic solar unit, or a rechargeable battery.

Optionally, the parameter of electricity from the power source is one or more of a voltage of the electricity from the power source, a cost per unit of the electricity from the power grid, a renewable energy availability, or a frequency of electricity from the power source.

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The invention further relates to a holder unit, processing unit and module holder for use in the described heating system.

According to a further aspect, a method for heating by means of a processing unit is hereby provided. The working method exists; providing at least one processing unit having at least one processor for performing computational tasks, and a container unit containing a medium, and thermally coupling the at least one processing unit to at least a portion of the container unit arranged by at least one heat pipe transmitting thermal energy produced by the at least one processing unit to the at least part of the container unit to heat the medium in the container unit.

Optionally, a control unit is used to determine a need for thermal energy output for heating medium in the container unit, to select one or more computational tasks to be performed by controlling the at least one processing unit depending on the required thermal energy output the at least one processing unit to perform the one or more computational tasks to obtain a resulting thermal energy output substantially corresponding to the required thermal energy output.

It will also be understood that any one or more of the above aspects, features and capabilities can be combined. It will be understood that any one of the options described with regard to any of the aspects may equally apply to any of the other aspects. It will also be understood that all aspects, features and capabilities mentioned with regard to the Systems are also equivalent apply to the working methods and vice versa.

BRIEF DESCRIPTION OF THE DRAWING

The invention will be further elucidated on the basis of exemplary embodiment which are represented in a drawing. The exemplary embodiments are presented in a non-limitative illustration. Note that the figures are only a schematic representation of the embodiments of the invention which are included as a non-limiting example.

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In the drawing:

Fig. 1 shows an example of a heating system;

Fig. 2 shows an example of a heating system;

Fig. 3 shows an example of a heating system;

Fig. 4 shows an example of a heating system;

Fig. 5 shows an example of a radiator element;

Fig. 6 shows an example of a heating system;

Fig. 7 (a), (h), (e) and (d) show examples of heating systems;

Fig. 8 shows an example of a heating system;

Fig. 9 shows an example of a heating system;

Fig. 10 shows an example of a heating system;

Fig. 11 shows an example of a heating system;

Fig. 12 shows an example of a heating system;

Fig. 13 shows an example of a heating system;

Fig. 14 shows an example of a heating system;

Fig. 15 shows an example of a heating system; and

Fig. 16 shows an example of a heating system.

DETAIL DESCRIPTION

Fig. 1 shows a heating system 1 for heating by means of a processing unit 2. The heating system 1 consists of at least one processing unit 2 which has at least one processor for performing arithmetic tasks. The heating system 1 further consists of a holder unit 4 for containing a medium 10 held in the holder unit 4. The at least one processing unit 2 is thermally coupled to at least a part 6 of the holder unit 4 by means of heat pipes 8, here two heat pipes 8, organized to move thermal energy produced by the at least one processing unit 2 to the at least one part 6 of the container unit 4 for heating medium 10 in the container unit 4. In this example, the processing unit 2 is organized below or below the container unit 4 with gravity pointing down. This can be advantageous for the heat pipes 8, in which, as a result of gravity G, the condensed liquid, from gas, into the heat pipe 8 from

BE2017 / 5024 an upper part 8a of the heat pipe 8 can flow back to a lower part 8b of the heat pipe 8 which is thermally connected / connected to the processing unit 2. In an example, additional means can be used to improve the heat transfer from the components of the processing unit 2 to the heat pipe 8, such as, for example, but not limited to a heat sink, heat pump, heat conducting plate, etc.

Fig. 2 shows a heating system 1 for heating by means of the processing unit 2. The processing unit 2 is placed next to the container unit 4. Heat generated by the processing unit 2 as a result of performing arithmetic tasks is transferred by a plurality of heat pipes 8 A thermal path is formed by the heat pipes 8 from the processing unit 2 to a part of the wall of the container unit 4 so that the heat is generated, transferred to the medium. 10 in the container unit 4. Also in this example, condensed liquid from vapor in the heat pipe 8 to an upper part 8a of the heat pipe 8 can flow back to a lower part 8b of the heat pipe 8 due to gravity G. This can improve the robustness of the system, since the heat pipes do not depend on the capillary effect. However, one or more heat pipes using the capillary effect can also be used.

Fig. 3 shows a heating system 1 consisting of a container unit 4 in the form of a vessel 4 arranged to supply a heated medium 10. In this example, the medium 10 in the vessel 4 is water 10.

The water 10 can be heated in the vessel 4 by the heat produced by the processing unit 2 which performs one or more arithmetic tasks. In this example, the processing unit 2 is constituted by a computer server which is contained in a housing 12 located under the vessel 4. The vessel 4 comprises a supply 14 at a bottom part for obtaining unheated and / or cold water 10 in the vessel 4, and an outlet 16 at an upper part for hot water. The purpose of the heated or hot water drawn down the drain may be for commercial, industrial or private use. Hot tap water production in a single domestic home would be an advantageous use. The water vessel 4 has multiple contact surfaces for exchanging energy in the form of heat with the computer equipment. The computer server used can

BE2017 / 5024 adjust its arithmetic tasks, and thus the power consumption of the server, based on the needs of the user, the quality of the electricity network and the required heat. In an advantageous example, the vessel 4 can have a volume of less than 500 liters, preferably less than 250 liters, preferably less than 200 liters.

In an example, model A, the system is optimized for heating water for daily hygiene. The use of tap water during a family workday is around early morning and late evening. During the weekend, a more widespread use of heated water can be expected, although moments of high and low consumption are still possible. Model A is capable of reaching a maximum temperature for stopping the growth of legionella bacteria, e.g., at or above 65 degrees Celsius. In order to achieve these high temperatures, it is possible that the water in the tank 4 has to stand still for a certain time, depending on the thermally generated power of the electronic components of at least one processing unit 2. The thermal power of the components of the at least one processing unit 2 depends on the type of the components and its active use.

In another example, model B, the system can be optimized for heating homes or buildings, with a lower maximum temperature. Model A can be designed to heat water that is stationary in vessel 4 for a longer period of time than Model B. This model has no need to stop water but can also be used for a period of time while the water is not circulating , to a safe maximum temperature. When the maximum water temperature is reached, the computer server (s) of one or more processing units 2 can stop or reduce their arithmetic activities. Alternatively, when the maximum temperature is reached, the surplus of energy can be delivered to an outside radiator, a different nearby home, a swimming pool, a geothermal heat sink, a conservatory or a public heat distribution network. Usually for Model B purposes, the vessel 4 may be larger than for Model A purposes, although this is not always necessary. To heat building parts is

BE2017 / 5024 often requires more energy which is translated into more computer equipment installed.

In an example, a model can be applied that fulfills the objectives of the two models A and B.

Model A can be intended for hot tap water use in private homes or in commercial, industrial and public buildings. Its design is optimized to heat hot tap water that is stationary during different times of the day in the barrel 4. At irregular intervals, a user use hot water 10 from the vessel or tank 4, which at the same time allows cold tap water to flow into the tank 4 at a lower part of the tank 4. As a result, the bit of the tank 4 is partially or completely removed. Fresh tap water entering at the bottom through supply 14 can have a typical temperature range between 10 and 25 degrees Celsius. The target temperature of the hot water leaving the vessel through drain 16 can typically be between 45 and 65 degrees Celsius. Other medium temperatures can also be used.

The cold water entering the tank 4 via supply 14 can be heated in the tank 4 in various ways, where some or all can be used simultaneously. Due to the tendency of water to create temperature layers in the tank 4, we have come up with several different ways to heat water 10 to the desired operating temperature.

One or more processing units 2, which may be in the form of one or more computer servers, may be placed at the bottom of the vessel 4 using at least one heat pipe 8 to raise the heat produced by the one or more computer servers. This can ensure that the computer equipment remains cool at all times. Cold water at the bottom of the tank 4 is heated by heat transferred from one or more heat absorbing radiator elements 18 by means of one or more heat pipes 8. These heat pipes 8 are designed as best suited for optimal heat transfer. The diameter, material and liquid / gas of the heat pipe 8 are selected based on the expected heat to be transferred from the computer server (s) 2 in the housing 12. A heat pipe 8 can heat

BE2017 / 5024 move from the bottom 8b (warm side) to the top 8a of its tube (cold side). The top side 8a of the heat pipes 8 can be connected to the vessel 10 containing water 10. The heat pipes 8 can be connected directly to the vessel 4 or via an intermediate heat conducting body to spread the contact surface, heat transfer and thermal energy more evenly. This can be in the form of a metal ring fitting snugly around the vessel 4 or it could be a metal alloy block with which the heat pipes 8 are connected. It is also possible to use Pyrolytic Highly Oriented Graphite auctions (PGS Graphite) to improve heat transfer. The efficiency of the heat transfer body can possibly be further improved by applying horizontally one or more heat pipes 8 around the vessel 4, allowing a more proportional distribution of the energy flow around the contact surface. Alternatively, these horizontal heat pipes 8 can be replaced by a sheet of PGS which has excellent heat transfer properties. The bottom sides of the heat pipes 8 are connected to the radiator elements 18. The vessel or water tank 4 can be made of a metal or a metal alloy, eg copper or stainless steel. This metal can improve the heat transfer efficiency to the water 10 contained in the vessel 4.

The heat absorbing radiator element 18 is usually designed from anodised aluminum. Although it could be designed using other materials that allow heat transfer such as copper. The radiator element 18 can be assembled as one piece, or it can be an assembly of several smaller radiators. The radiator element 18 can use horizontal or vertical heat pipes 8 to improve its efficiency and / or to connect smaller radiators (not shown in Fig. 3).

A heat pipe 8 can be designed from a metal pipe, usually copper, in a gas containing under very low pressure. One or more heat pipes 8 can be connected to the heat absorbing radiator element 18. The number depends on the amount of thermal energy that is expected to be transferred from the housing 12 to the water tank 4. In this example, the bottom side of the heat pipe 8 is the evaporator. The heat pipes 8 are connected at their top side to the water tank 4 (as explained earlier). This side

BE2017 / 5024 is called the condenser. In the example shown in Fig. 3, the upper part of the heat pipe 8 has a higher temperature with respect to the lower part of the heat pipe 8, this shows a heat transfer (flux) from the lower part to an upper part of the heat pipe 8. In several examples it is possible to use heat pipes 8 with or without a capillary sleeve (thermosiphon). In an example, the heat pipes used are 8 Variable Conductance Heat Pipes (VCHP), which allow to keep the housing and the contained equipment at a significantly stable temperature fe.

Optionally, in the processing unit 2 housing 12 or the computer server housing 12, it is possible to have Fans installed which help circulate the air in the housing 12. The purpose is to promote heat transfer to the radiator element 18.

In order to further improve the heat transfer to the vessel 4, the radiator element 18 can be equipped with one or more Peltier elements 20. A Peltier element 20 is a thermoelectric heat pump. By applying a current to the element, one side gets warmer and the other side gets colder. A Peltier element 20 can cause a movement of thermal energy from the cold side to the warm side. For efficient installation, we provide that the cold side is connected directly to the radiator element 18, while the hot side can be connected to a heat pipe 8 that connects to the vessel 4. Using heat pipes 8 it is possible to one-way thermal insulation 22 to be controlled between the server housing 12 and the vessel 4.

The one or more Peltier elements 20 can be controlled by the computer server or by a separate micro-controller (not shown in fig. 3). When the temperature in the computer housing 12, as measured by a temperature sensor, enters safe limits, the Peltier element (s) 20 is / are not in use. When the temperature in the housing 12 is higher than an upper safe limit, the Peltier element 20 can be activated to pump extra heat from the housing 12 to the water tank 4. The presence or and the type / quantity of Peltier elements 20 depends on the characteristics of the computer server installed. The Peltier element 20 can

BE2017 / 5024 receive an optimal control signal, usually a Pulse Width Modulation (PWM) signal from the control unit.

One or more special temperature probe inputs (tubes) 41 can be provided in the vessel 4. These temperature probes 41 can also be pre-tied with the computer server or the specialized micro-controller for use in changing and / or controlling the heat transfer. Probes 41 can provide information about the condition of the temperature in the vessel

4. At least one temperature probe 41 can be provided at the top of the vessel 4 to measure the highest temperature within the tank.

As an optional step, heat can be extracted directly from the computer components by a stream of water or similar coolant (transfer fluid). The components in mind are those with a modest heat output. Water blocks connected to the components transfer the heat to the coolant. The coolant is circulated in a closed loop using a pump 24, The closed loop is connected to a bottom coil 26. After the water has absorbed the heat of the components using the water block (s), it enters at the top of the the bottom spiral 26 flowing through the spiral delivers its thermal energy to the water 10 in the vessel 4. The water is then returned to the components of the at least one processing unit 2 to recool the components. The pump 24 itself is best placed in the loop just before entering the first waterblock, but may be placed anywhere in the loop.

The components intended for connection to this loop include, but are not limited to, one or more central processing units (CPU), the computer motherboard (Southbridge / Northbridge I voltage regulators), the computer's internal RAM (Random Access Memory, often referred to as as DDR memory or DIMMs), the hard drives installed in the system. The correct set of components of the processing unit 2 may depend on the computer and / or the servers used. The number and design of the water blocks may depend on the components used by the computer hardware manufacturer.

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The pump 24 used can be of any suitable type, such as a centrifugal pump. The pump 24 may have a set of sensors built in to determine its operation. The sensors can consist of voltage measurement, current measurement, water flow meter, temperature measurement, vibration measurement. The correct set of sensors may depend on the pump type used. The values of the sensors can be read by the computer server using a connection to the pump (USB or other interconnection). It may also be envisaged that one or more specialized controllers can be built into the system to control the pump (s) 24, the Fans and the Peltier element (s) 20, as well as to read all the sensor information required, These specialized controller can be connected to a network (eg the internet) to allow remote monitoring and control. A screen 28 with control buttons (or touch interface) can be used to visualize the state of the device to the user and to accept commands from the user, such as, for example, to increase or decrease the desired maximum temperature in vessel 4.

The liquid ^T w by each of the blocks and the water pump 24 flows are not under pressure, in order to prevent possible leakage inside the computer case. This liquid can be distilled water. Additives can be added to suppress the growth of bacteria and fungi in the wafer. Specialized coolants can be used. The area around the bottom spiral 26 is expected to be heated to a temperature between 45 and 50 degrees Celsius, but may be higher depending on the electronics and components fitted.

Optionally, the system may have ways to control the temperature of the medium. 10 (eg water) in the tank. 4. For hygienic use of tap water, a maximum temperature of 45 to 50 degrees may not be enough to stop the growth of certain types of bacteria. Some countries have introduced legislation that requires a water heater to reach a temperature of at least 65 degrees. To achieve this kind of temperature, an upper coil 30 can be provided at the top of the vessel 4. This coil can be provided to transfer heat produced by computer components from at least one processing unit 2, which higher

BE2017 / 5024 can and can produce temperatures. For example, a graphics processing unit (GPU) is generally known to be designed to withstand higher temperatures, some even reaching temperatures close to 100 degrees Celsius. Therefore, this kind of computer components can be advantageously connected to the top coil 30 using water blocks and a closed loop. The pump 24 can be installed in the closed loop before the coolant enters the water block of the GPU card. The warmest water can flow into an upper side of the spiral 30 where the heat can be transferred to the water 10 in the vessel 4. After the transfer of produced heat to the water 10 in the vessel 4, the colder water can be returned brought to the GPU card via the pump 24. The temperature of the water entering the upper spiral can be in the range between 65 to 70 degrees Celsius, while the water leaving the spiral 30 is expected to be no more than 55 to 60 degrees Celsius. Other temperature ranges may depend on the technical specifications of the graphics processors or other high-quality temperature-resistant semiconductors used. It is intended that auxiliary processors such as the Intel Phi can also be used in addition to the graphics processors.

Optionally, the system can include additional heating. At certain times, it may be possible that more hot water is required during a certain period of time than the computer server equipment can heat up in the same period of time. Therefore, an optional electric heating element 32 can be installed in and / or on the vessel 4. This can be of the same type as commonly used in existing boiler systems. The heating element can be controlled by the computer server or by the micro-controller. It can be envisaged that a Pulse Width Modulation (PWM) signal is used to drive the heating element to add only the heat needed to achieve the desired temperature. It could also be controlled by a standard two-metal thermal switch as commonly found on the market.

The system may include other parts sometimes found in existing boiler systems. The maintenance hatch 34 is a closed access to allow a technician to inspect the inner surface of the vessel and to

BE2017 / 5024 to remove deposits in vessel 4. An optional anode 36 can be used to prevent corrosion of the vessel 4. It is of a similar type as found in comparable water heaters on the market today. A maintenance door 38 can be provided, which can be used by a technician to access the processing unit 2, the computer server equipment, the pump 24 and / or the other components contained in the housing 12. For both closed loops, namely the top coil 30 and the bottom coil 26, the technician should be able to add and / or vent coolant. Therefore, two small filling systems 40 are provided to allow this, e.g. one for each loop. Extra liquid and air is kept in the filler pipe to allow the necessary expansion of the liquid during heating (liquid can expand at higher temperatures in the vessel 4),

The vessel 4 has the possibility to use a return system, in order to have a higher comfort level for the users. The return system can consist of a return supply 17. This is similar to existing hot water constructions. The return system pump is not shown in the figure. The return system pump can be controlled by the computer server or by an assigned control unit, or by a clock outside the unit.

Fig. 4 shows a system. 1 according to another example using temperature resistant semiconductors 42. The system includes high temperature resistant equipment, such as, for example, hash calculating semiconductors. It is possible that none. need to use. of coils in the vessel 4, such as the bottom coil 26 and the top coil 30 in the example of Fig. 3. In this example, the semiconductors 42 may be placed in close proximity to the radiator element 18, or may be directly connected to the radiator or via a heat pipe 8 or spreader. In such an example, the coils 26, 30 may be omitted for economic reasons, and all heat transfer can be done through the heat pipes 8 at the bottom of the vessel 4,

Fig. 5 shows the semiconductors connected directly to the radiator element 18, which aims to efficiently transfer the heat produced by the semiconductors 42 to the heat pipes 8. In one example, a sheet of PGS

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Graphite placed between the semiconductors and the radiator to improve heat transfer properties. In an example, the radiator element 18 can be thermally shielded from the housing 12. Various insulating materials can be used, such as, for example, a NASBIS insulating sheet from Panasonic.

Fig. 6 shows another example in which the computer equipment 2 or the high-quality semiconductors 42 are placed in a module or closed housing 44 filled with an electrically non-conductive liquid. In an advantageous example, the closed housing 44 is a metal housing. The closed housing 44 can be pushed in at the bottom and pressed against the radiator 18. The non-conductive liquid can be transformer oil or mineral oil; or it may be a more advanced fluid such as 3M ™ Fluorinert ™ FC-72, 3M ™ Novec ™ 7000, 3M ™ Novec ™ 7100, 3M ™ Novec ™ 649 or any mixture thereof. The metal housing 44 may be connected to the radiator or pressed against the radiator element 18 using a pushing mechanism (not shown in the figure). In this example, the radiator can take the form of a flat plate or any other usable shape to easily press the closed housing 44 against the radiator element 18. The main advantage of using a closed housing 44 is the ability to prevent corrosion. better to resist and to easily replace the computer server. When a two-phase immersion coolant is used, it is also possible to omit the moving parts to move liquid and thus to reduce audible noise and energy consumption. In the example of the system in Fig. 6, a closed housing 44 is shown which can be slid under the radiator element 18. By using quick connection plugs on the back of the housing and cover unit, the heat producing computer can be easily installed and replaced by an experienced technician.

Alternatively, or additionally, drip free liquid and / or gas connections can be used to connect the liquid in the closed housing 44 to a piping system at the rear of the vessel in case there is a need to transfer heat to the coils 30, 26, in such case there is a need to have a higher thermal release to the vessel 4. The coils can

BE2017 / 5024 are directly filled with the coolant (as mentioned above) or can be filled with an intermediate coolant, such as distilled water. In case an intermediate coolant is used, an extra pump can be placed to circulate the intermediate liquid. The pump (s) to move the liquid around can be installed in the housing or in the closed housing.

Fig. 7a shows a heating system 1 which includes a closed two-phase immersion cooling housing. The computer equipment is immersed in a liquid, shown in Figure 7a by a liquid level 46. A heat pipe 8c is placed in the housing, connected to the top of the closed housing. The bottom part of this heat pipe 8c has heat pipe fins 48 attached to improve heat transfer. The heat pipe 8c and the fins 48 are placed above the liquid level 46. The main function of the heat pipe 8c is to cool the gas formed and quickly move the heat to the top of the housing where it can be transferred via the PGS sheet to the heat, pipes 8 connected to the tank or container unit 4. When the gas cools it can liquefy and drip down making this a closed loop. In another example, the heat pipe 8e in the closed housing is replaced by a folded PGS Graphite sheet, joined to the top of the closed housing (not shown in the figure). The connectors for power and network connection are placed above the liquid level to avoid leakage and preferably above the level of the heat pipe 8c where the gas concentration is lowest. The closed housing can be light, overpressure or underpressure to change the boiling point of the two-phase coolant. When using a two-phase immersion liquid, the used CPU and / or GPU can be treated with a microporous metal boiling enhancement coating to improve heat transfer to improve the fluid and to improve the cooking process.

Fig. 7b shows a heating system. 1 w at ^T comprises a sealed enclosure 44. using a heat pipe 8c to transfer the heat to a back plate 50. In an advantageous example, the closed housing 44 is a metal housing 44. In another example, the heat pipe 8c in the closed housing 44 can be brought out from the closed housing 44, the wall

BE2017 / 5024 penetrating the closed housing 44. During installation, the part of the heat pipe 8c outside the housing can be inserted into the manifold of the back plate 50. The back plate 50 may be made of a metal alloy such as, for example, aluminum or copper. The back plate 50 can be cooled by a heat transfer fluid (e.g. water). The heat transfer fluid can be circulated by means of a pump 49 and cooled as disclosed above. Multiple heat pipes 8e can be used with a single back plate 50 if a single heat pipe 8c is not sufficient to cool the gas within the closed housing 44. It is also possible to add additional heat pipes 8c that are in the housing 44, partially or completely below the liquid level 46 which cools the contained liquid, if necessary.

Fig. 7c shows a heating system 1 with a closed housing 44 filled with dielectric liquid. In this example, the closed housing 44 is filled with mineral oil, transformer oil or bio-based oil. The processing unit electronics are located below the liquid level 46 of the oil. At the top of the closed casing 44 is placed a large radiator 52 consisting of a plurality of fins which are wholly or partly immersed in the oil. The radiator 52 can transfer the heat from the cooling oil to the top of the closed housing 44. To improve heat transfer from the sealed enclosure 44 to the heat pipes 8 connected to the radiator 52, a PGS Graphite sheet can be used similar as in above examples. Optionally, to improve heat transfer to the vessel 4, the oil can be pumped outside the sealed enclosure 44 by means of a pump 49, e.g., via drip-free connectors, transferring the oil to e.g. the coils or heat pipes 8 installed on the barrel. Heat sinks can be connected to the components that produce more heat. These heat sinks allow the oil to pass through them, to efficiently transfer the heat produced by these components to the oil. Another way to cool the oil could be to use one or more heat pipes 8 which penetrate the sealed casing 44 and are cooled by the back plate 50 as previously described.

Fig. 7d shows a heating system 1 with a closed enclosure 44 filled with a liquid, such as a dielectric liquid. This liquid can

BE2017 / 5024 for example be an oil. This liquid remains in the sealed enclosure 44 and is circulated using a pump 49 placed in the housing 44. The oil can pass through the heat sinks connected or coupled to heat producing computer components of the processing unit. The order of transfer can be from these components with the least heat flux first to these components with the highest heat flux last. The oil is then passed on to heat transfer. elements 44h at the top of the sealed housing 44. These heat transfer elements 44h, having fluid ports, are connected at the bottom or to the heat pipes 8i and 8j to efficiently transfer the heat to the heat pipe evaporator. Two heat pipes are shown, but a different number of heat pipes can be used. The housing may also have a radiator 58 to transfer the heat of the oil to the heat pipes 8i, 8j as explained in Fig. 7c. The example shows the use of two heat pipes of different lengths. More or less heat pipes 8i, 8j could be used if needed. By using different lengths for the heat pipes 8i, 8j, different areas of the medium 10 in the container 4 can be prioritized for heat release. It is envisaged that the longest heat pipes will deliver the most energy to the top of the container 4 first, while the shortest heat pipes will deliver the remaining energy to the bottom of the container 4 last. Thus the order of delivery is best kept longest first - shortest last.

In the example shown in Fig. 7d, the sealed housing 44 includes a processing unit including a CPU unit and a GPU unit. Liquid (e.g., oil) is passed to the CPU unit to realize heat transfer, and then passed to the GPU unit. The power of the GPU unit can be higher than the power of the CPU unit, so that more heat can be produced by the GPU unit. As a result, the liquid can first be heated by the CPU unit and then heated by the GPU unit to a higher temperature. It is contemplated that more steps may be used to incrementally increase the temperature of the liquid (e.g., oil or other dielectric liquid). It will be understood that other configurations are possible, e.g. in which the liquid is first heated by a GPU unit and then downstream by a CPU unit.

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Fig. 8 shows. a heating system 1 according to another example comprising (heat exchanging) coils 26a, 30a provided on an outside of the vessel 4. An upper coil 30a and a lower coil 26a are provided. This can be beneficial in a domestic environment. The functionality is similar to the use of coils in the barrel. As seen above, it is possible to use one or two coils. When using one, the coil can cover the entire vessel, or a portion of the vessel, advantageously, a safer system can be obtained, especially when the medium is in the vessel 4 of water has been used, as drinking water. In this case, no toxic components can be released to the water due to leakage from the coil / coils.

Fig. 9 shows a heating system 1 according to another example.

The system 1 has one or more heat pipes 8d inside the vessel 4. The outer coils 26a and 30a can be replaced by heat pipes 8d inserted in the vessel, 4. These heat pipes 8d can have fluid ports and a heat transfer body on the outside of the vessel 4. The heat transfer, body transfers the energy of the liquid flowing through the body to the heat pipe 8d. The heat pipe 8d itself transfers the energy to the water 10.

Fig. 10 shows a heating system. 1 according to another example, the system 1 comprising a, e.g., pressureless, vessel 4 or container unit 4. Water, or other medium, can be supplied to the vessel 4 containing a medium at a higher temperature than the water. A heat exchanger 63 is provided in the vessel 4, at least partially surrounded by the medium 10 in the vessel 4, where the water is passed through this heat exchanger 63 so as to heat the water by heat transfer between the medium. 10 into the vessel 4 and the water pumped through the heat exchanger 63 (e.g. coil). The heated water can then be received at a drain for use. The vessel 4 itself can contain water 10 as the medium, in the vessel 4. The hot tap water can be stored in the large spiral in the vessel where the cold water enters at the bottom of the spiral and exits at the top. The advantage of this example is that the water contained in the vessel is used as a heat storage medium and never leaves the vessel. This prevents calcification in the vessel and thus reduces the

BE2017 / 5024 maintenance costs and makes the installation more sustainable. Another advantage is that because the hot tap water enters the coils 63, no legionella bacteria can form. As a result, the maximum temperature to reach the vessel should not be 60 degrees Celsius or more, but can be reduced to 55 degrees which can save energy costs. The pressureless vessel can be filled with water during installation. When the barrel is filled, the technician closes the tap at the supply. In Figure 10, a pressureless vessel is shown using an optional heat pipe 8d as an auxiliary heater. This can optionally also be one or more coils if there is sufficient space in the vessel.

Fig. 11 illustrates a heating system 1 according to another example, the system 1 comprising a, e.g., pressureless, vessel 4 containing a phase change material (PCM) as a heat storage medium 10 in the vessel 4. Paraffin-based PCMs are known to be expensive and under certain conditions identified as carcinogenic. Paraffin can be distilled from fossil oil and as a result can contribute to climate change. Due to recent breakthroughs in plant phase change materials, PCMs are readily available at affordable prices. Melting points are now in the range where they can be used in domestic environments. Vegetable based PCMs are not carcinogenic and have no negative effects on human health or the environment and can even be used in food sensitive environments. In an example, a vegetable based PCM 10 can be used, with a sharp melting point of about 48 degrees Celsius. The PCM can be completely solid below 47 degrees Celsius and can be completely liquid from 51 degrees and above. Another melting point of the PCM 10 can be used, but it must be in the usable temperature range for its purpose, for example domestic hot water use (35 to 60 degrees Celsius). During the phase transition from solid to liquid, the PCM 10 absorbs a high amount of energy without raising its temperature. This is called latent heat. Only after the PCM 10 has melted completely can the temperature gradually increase (sensible heat) when more energy is added. Because of this effect, a PCM 10 is ideal for use in a hot tap vessel where a processing unit or

BE2017 / 5024 a computer server is used as a heating appliance. Again, a coil heat exchanger 63 is placed in the vessel 4 to allow heat transfer between the PCM medium 10 in the vessel 4 and the water pumped through the heat exchanger. In this way, the temperature of the water can be raised to obtain heated water, which can be used, for example, for domestic, commercial and / or industrial purposes.

The temperature of the computer servers can be kept at a more constant temperature due to the phase transition effect of the PCM, Typically a server's CPU is designed to work safely at their junction with temperatures up to 70 degrees Celsius and a GPU up to 100 degrees . To cool this electronics efficiently, the cooling medium should be no more than 10 degrees below the maximum junction temperature of the components, preferably less. Using a PCM, the temperature in the sealed enclosure may not exceed this limit because there is no need to stop bacteria growth within the vessel by applying a high temperature. When the user uses hot water, the temperature fluctuation within the vessel can be tempered as the latent heat in the PCM can be used to heat the water flowing through the heat exchanger 63 (coils). Using a PCM, the vessel may be able to absorb up to 3 times more energy than a comparable vessel containing water. This feature can be used to store energy over longer periods of time, up to days, which is important for balancing the electricity supply and charging the vessel during specific times such as on sunny days.

In this example, the computer server is contained in a sealed enclosure 44. Various examples as described above can be used. The closed housing 44 can be placed under the vessel 4 by the technician using the sliding guides and pressed against the radiator element 18 using a pushing mechanism. The radiator element 18, similar to the radiators described above, has a large contact area with the closed housing 44. The radiator can be improved using a sheet of PGS, heat spreaders and / or heat pipes to improve its thermal properties. The radiator is connected to one or oö

BE2017 / 5024 multiple large vertical heat pipes 8 which transfer the heat from the radiator 18 to the PGM 10. The one or more heat pipes 8 can be of the thermosiphon type (without a capillary sleeve) because of their vertical position which reduces the overall cost . It is also possible to use other types of heat pipes 8 to improve the heat transfer properties, such as heat pipes 8 with a capillary sleeve, diode heat pipes 8 or variable conduction heat pipes 8. Each heat pipe 8 has a large contact surface with the PCM 10 PCMs may have a lower thermal conductivity than water (usually about half or less), therefore a large contact area is required to transfer sufficient energy to the PCM. Additionally, additives that enhance the thermal conductivity of the PCM may be added to the PCM, such as graphite foams or metal microstructures. Other ways to improve the heat transfer in the PCM can be a thin metal structure which improves the transport of heat in the vessel 4. For example, a lightweight bone structure made of aluminum improves the heat transfer several times without reducing the effectiveness of the PCM. The purpose of the structure is to allow the PCM to have a uniform temperature in the vessel 4, which allows the phase change to occur smoothly. In case even a larger contact area with the PCM would be needed, a second heat exchanger, for example a coil inside the barrel, coil outside the barrel and / or heat pipe, as described above, can be used. In another example, the PCM 10 may be contained in (micro) capsules immersed in a liquid, especially water.

The coil 63 in the vessel (heat exchanger) containing the water for heating for domestic use may also have a large contact area with PCM 10 to ensure that sufficient energy is transferred to the water. The vessel has a maintenance door 34 to fill the vessel 4 with the PCM 10. Since most PCMs 10 expand significantly during their phase change from solid to liquid, the vessel 4 has a space for expansion 54. This space may be filled by the PCM 10 when the PCM 10 is in a liquid stage. The space required depends on the expansion coefficient of the PCM 10. A pressure relief valve 56 can protect the vessel from rupture in the event of a failure.

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Fig. 12 shows an example with a processing unit 2 provided in a two-phase (liquid to gas) closed housing 44, which is cooled by two thermosiphons using a PCM ash heat storage medium 10 within the container unit 4. Multiple heat pipes 8i, 8j, 8k are provided between the processing unit 2 and the medium 10 (PCM) in the container unit 4. The heat pipes 8i, 8j are arranged through a wall part of the container unit 4 and a thermal insulation is placed between the container unit 4 and the processing unit 2, around the heat pipes Si, 8j, so as to reduce heat loss to the environment and / or to improve the heat transfer of the generated heat through the processing unit 2 to the medium in the container unit 4, as a result of performing one or more arithmetic tasks . Furthermore, in the example shown, a third heat pipe 8k is used in conjunction with a Peltier element 20, as previously described. The radiator is improved with gas compartments 9a, 9b below the heat pipes Si, 8j which may partially retain the gas produced above the GPU and / or CPU, respectively. The gas can deliver its heat content more directly to the heat pipe above. When the gas compartment is full, the gas flows to the other parts of the radiator. The heat pipes 8i, 8j are of different lengths, which allows heat to be delivered to different parts of the medium 10 where the electronic components with the highest heat flux can be directed under the heat pipe to deliver their heat at the top of the barrel 4.

The sealed housing 44 may be connected to a back plate to allow power, network to pass through the housing. The liquid in the enclosed container 44 may communicate with a pressure measuring tube 45. This tube may be made in part from a plastic or glass. When the liquid in the closed housing 44 partially transforms into gas, the pressure created by the expansion can push the liquid out into the pressure measuring tube, which moves the floating ball into the tube. A sensor can detect the movement. Advantageously, the processing unit 2 can change its power delivery based on the detected level in the pressure measuring tube. A pressure valve is connected to the pipe, which allows the built-up pressure to be released.

According to another model, model B, the system can be used for heating in a building and / or facility. For heating purposes

Ο /

BE2017 / 5024 of a building often requires a less high temperature. The building that the user wishes to heat up can have high thermal insulation so a low temperature heating system can be used. Because a larger amount of energy is required to heat up a building, more server equipment must be used. Often a larger size of vessel 4 can also be used. While this is often between 100 and 300 liters for a hot drinking water application, it is envisaged that to heat buildings, such as family houses, a vessel 4 between 150 and 1000 liters can be used.

Fig. 13 shows an example of a system 1 for use in the second model B. The boiler is similar to fashion! A described above. An important difference is that there is no need to stop the water (heat transfer fluid) during the heating phase. Often one spiral 57 is sufficient to feed the heat of the housing to the water in the tank 4. Although a variety of coils can be used. As a result, there is also only one closed loop using one or more pumps 24. The cold water in the loop after having exhausted the pump first enters the water blocks of these elements of the one or more processing units 2 which generate less heat ( CPU, hard drives, motherboard, etc.). After diluting these elements, the water can enter the water blocks of these elements that can handle higher temperatures and produce more heat, such as GPUs, The system. of Fig. 13 consists of a plurality of processing units 2. In this example, three computer servers are stacked on top of each other. Other numbers and / or arrangements are also possible. This can be more or less depending on the energy needs of the building. Because less high temperatures are needed to heat up a building, it could be that a server has one or more CPUs, and few or no GPUs. This depends on the arithmetic tasks to be performed. It may be provided that the enclosure 12 may have other equipment required to manage this cluster of computers, such as, for example, a network. switch and / or an uninterruptible power supply (UPS). The main principle of transferring heat from the computer equipment from the at least one processing unit 2 to the vessel 4 remains the same, using one or more heat pipes 8, an optional Peltier element 20 and in this example a spiral 57.

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The temperature of the cold water entering the vessel 4 can be expected to be between 15 and 25 degrees Celsius. The temperature of the warm water leaving the vessel 4 can be expected to be between 18 and 35 degrees Celsius.

Also Model B can be designed using the examples described for Model A to support sealed enclosures or high quality temperature resistant semiconductors.

An optional Peltier element 20 is shown which can be used to control and / or change the heat flow to the vessel 4, if necessary,

Again, at least one heat exchange coil in or on the vessel 4 has been used to promote the heat exchange of specific computer components from the at least one processing unit 2 to the medium 10 within the vessel 4 (e.g., water).

The at least one processing unit 2 may have a housing which is provided to slide into the bottom of the vessel 4, the housing containing the computer equipment to be cooled. The equipment in the closed housing can be heat-cooled, cooled by a two-phase immersion liquid or by mineral or transformer oil. Other solutions can be provided. A phase change material can be used to store the heat of the at least one processing unit 2 (e.g., computer server (s)).

Fig. 14 shows an example for Model B using a PCM 10 as the medium in lift vessel 4. A backplate 50 is provided with one or more manifolds where the heat pipes can contact the cooling medium (in the case of a two-phase immersion model). The cooling medium can be pumped to a coil 57 within the vessel 4. In case the sealed housings are of the oil-containing type, the back plate 50 may be provided with drip-free connections to use the oil directly as the cooling medium in the coil 57 Advantageously, in this example, the melting point of the PCM 10 can be selected depending on the storage capacity and the heating delivery system of the building. The water for heating flows through an assigned heat exchanger 63 (e.g. spiral) to absorb the heat of the medium 10 (e.g. PCM).

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A variety of closed enclosures can be placed side by side, each containing a computer server or similar electronics. All of these can contact the radiator connected to the heat pipe 8. The closed housings 44 can be placed on their side to save space leaving enough space under the vessel 4 to accommodate multiple pieces.

Fig. 15 shows an example usable as model A or B, using a PCM 10 as the medium 10 in the vessel 4, similar to FIG. 14. The container unit 4 includes a sub-tank 62 in an outer tank. A heat pipe 8 is thermally connected to the medium 10 in the container unit 4 and to the water in the sub-tank 62 of the container unit 4. The water tank 62 is surrounded by the PCM 10. The heat pipe 8 can also be in thermal contact with the sub-tank 62, so that heat can be efficiently transferred to the water. A plurality of sub-tanks may be contained by an outer tank of the container unit 4. Additionally or alternatively, the heat pipe may also be coupled to a wall portion of one or more sub-tanks of the container unit so as to improve heat transfer. The water in the tank 62 is ready for immediate use. The sub-tank may be connected to a heat exchanger 63 for easier heating of the water flowing through it. The cooling medium of the closed housing 44 can be pumped through a coil 57 to promote heat transfer. The principles as explained earlier can also be applied to this model.

Fig. 16 shows a system 1 according to a further example. The heating system 1 consists of a module holder 58 which is arranged to hold a plurality of, here four, processing units 2. The module holder is thermally connected to the container unit 4 by means of one or more, here two, heat pipes 8. A plurality of processing units are received in the module holder 58. A processing unit 2 can be removably connected to the module holder 58, so that it can be removed and / or replaced, automatically by a drive or manually by a user. In this example, the module holder 58 includes four receiving slots 60 arranged on a stack, each adapted to receive a processing unit 2. In an example, the processing unit 2 is provided for sliding

BE2017 / 5024 in a receiving slot 60 of the module holder 58. The module holder 58 is provided below / below the container unit 4. The module holder is adapted to provide a thermal coupling, by defining one or more thermal paths, between the at least one processing unit 2 inserted into a receiving slot 60 and part of the container unit 4 or vessel 4.

The receiving slots 60 of the module holder 58 are arranged horizontally on top of each other. However, other configurations are also provided. For example, the receive slots can be arranged vertically. The receiving slots 60 of the module holder 58 may also be rotated. Furthermore, the receiving slots 60 can be arranged side by side instead of one above the other. Many variants are possible.

The heating system 1 can operate multiple modes of operation. Advantageously, the at least one processing unit, e.g. computer server (s), may be provided to provide services to the home users and to provide batch-like arithmetic services to a central server (distributed calculations). The computer server can be configured to adjust its arithmetic tasks based on the priorities associated with certain operating modes. Three modes can be distinguished: an exclusive user mode (eg for gaming), a shared user mode (multimedia applications), and a shared batch mode (distributed calculations).

In exclusive user mode, the computer server can operate with all or most of its IT resources allocated to the user process to provide the best possible experience. The server can behave like a game console to provide a gaming experience to one or more users. This can be in the form of streaming image output to a remote screen (television) or to one or more mobile devices. The game output can be streamed over the local area network (LAN), or other network technology to the output devices (TV / smartphone / tablet or others) using cable or wireless (eg Wi-Fi). Standardized equipment can be used, such as HDMI, DisplayPort, Miracast, Chromecast or others. It is also possible to stream the game content over the internet to remote users or to allow multiple players to participate in the same game. The spei can be

BE2017 / 5024 controlled by a remote control, a joystick, a joypad or mobile device (such as smartphone or tablet). The power of the computer server may fluctuate based on the input of the players and the games involved and thus the vessel may heat up at an accelerated rate. The system 1 may be provided to monitor the temperature in the vessel 4 for the purpose of protecting the electronic computer equipment of the at least one processing unit 2 from overheating. Two temperature limits can be identified: warning and danger. When the temperature in the vessel 4 exceeds a certain temperature, the user (s) playing the game can be warned that the temperature is already quite high and that a limited time remains before ending the game. It is possible to present the user with an estimated time remaining before the hazard threshold is exceeded. The remaining time can be calculated based on the current temperature, the maximum temperature allowed, the average power while the game is running and the properties of the storage medium (water or PCM). During play, LED lighting on heating system 1 can change color to indicate the remaining time available for play until the maximum allowable temperature has been reached. In an example it is possible that when a temperature threshold is reached the game being played can be continued on another computer server streamed over the internet to the output device (s) of the user (s). It is also possible that during the time the game is played the quality of the electricity network deteriorates. This can be expressed by a very low voltage and / or a very low mains frequency in relation to the standard of the electricity network in that area or a signal from a local distribution network operator. In such case, the user (s) can be warned about this occurrence and the choice can be given to stop the game or not. In case the user (s) decide (s) to quit the game, the computer server may consume less electricity and assist in restoring the electricity network quality. The server may also reduce the use of its arithmetic for the game to reduce energy consumption. The user may have the option to request (schedule) the server to temporarily reduce its target temperature during one or

BE2017 / 5024 several specific timeframes (plan in advance), with the intention to build a thermal reserve for gaming. This can ensure that the user (s) have enough time to play their game during that time without reaching the maximum temperature in vessel 4 too quickly. The user can choose not to allow the use of other IT resources during the game or to grant a percentage. In such case the heating system 1 can be connected to a heat consuming device, such as a dishwasher and / or washing machine, via its return system 17, the heating system 1 can send a start signal to these respective appliances and / or the return pump, to start consuming hot water from heating system 1, it will be advantageous to reduce the temperature in the vessel 4 and extend the duration until the maximum temperature is reached in the tank 4.

Another identified mode is the shared user mode. This could be used to provide the user (s) with a multimedia experience. In this mode, less IT resources from the computer server are required to deliver content to the user. Thus, this mode can be shared with other non-exclusive modes depending on the remaining available IT resources. Media in the form of music, movies or other content can be streamed directly to one or more screens and / or media receivers using technologies such as DLNA, Chromecast, Miracast or others over wireless (eg Wi-Fi) or cable. In this mode, the computer server is also able to deliver content via file sharing and web services to local users on the local network (LAN) or to user (s) on the Internet. It is possible to control the playback of the content via an app on a mobile device, a weh browser, an application on a PC, a remote joystick, controller, keyboard or other. The amount of IT resources required strongly influences the rate of temperature rise in the vessel and is difficult to predict. In this mode, power of the computer equipment may often be insufficient to maintain the vessel at temperature or to bring the vessel to the desired temperature at a specific time of day. Therefore, this mode is often shared with the batch calculation mode.

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In the batch calculation mode, the computer server can perform pre-assigned tasks. The computer server can maintain a list of tasks to be performed. When the list is empty or the list is below a certain threshold, the computer server can request more tasks from a central server which keeps track of all tasks to be assigned under all instances available to the central server, i.e. distributed computing. In another example, the database itself is distributed among the different servers, or a blockchain database could be used. The computer server can perform tasks sequentially or can perform multiple tasks simultaneously (parallel execution). The tasks can be of any suitable type, for example scientific, financial or medical applications, crypto-currency calculations, 2D / 3D animation rendering and .more. When the result of a batch, process is calculated, it is immediately sent to the central server over the Internet or at a later time. In case. If a blockchain database is used, the result can be placed on the blockchain itself. In the batch calculation mode, the resources of the computer server can be shared with the multimedia mode, where the multimedia tasks have a higher priority than the batch related tasks. An important difference with the other modes is that the speed of execution of batch related tasks does not depend of the interaction with the user (s) but on the energy required to heat up the vessel and / or the electricity network quality.

For the purpose of assigning consumption to mode or process, system 1 can be equipped with a consumption meter. The meter can be configured to measure power (W), voltage to neutral (V), and mains frequency (Hz). Other parameters can also be read if the meter supports it, such as current (I), line voltage (V), cos-φ and more. By relating the measured power (W) to the power meters in the CPU, the process information in the control system and the performance meters of the GPU, it is possible to clearly assign the power consumption to each mode or task. This allows reporting to the user on the energy consumed for games, multimedia streaming and batch calculations, instantaneous or cumulative over a certain period. By using information from the

BE2017 / 5024 control system, it is possible to allocate consumption down to the process level. The latter can be used for billing purposes.

Furthermore, the quality of the mains voltage becomes an important issue because more distributed energy production is installed on low-voltage lines. The main parameters to control are the voltage and mains frequency. To achieve this, the boiler heating system. 1 behave differently compared to a traditional approach. A prior art boiler would heat the vessel overnight or when the lowest temperature threshold was exceeded. A boiler heating system 1 following the current disclosure can be foreseen to spread its consumption over the day. Consumption is best carried out when the local electricity grid has a very low load and / or when sufficiently distributed renewable energy is available. This can be achieved by measuring the line voltage and the mains frequency.

In the first instance, the capital budget must be determined. This is the amount of thermal energy the processing unit 2 (e.g. computer server) must deliver to heat the vessel 4 to the desired temperature at the specified point in time (e.g. as determined by the user settings). To determine this budget, a naive linear statistical implementation will not be able to deal with the variability and heat extraction of the vessel 4, the changes in the water temperature at the supply port, and in case a phase change material 10 is used as thermal storage medium 10, to deal with the changes in material condition. Therefore. a feedforward neural network can be applied to predict the necessary power budget for the next time slot (e.g. 24 hours). The neural network can be trained with one or more (e.g. all) of the following input parameters: current vessel temperature, target temperature, available time until target temperature is to be reached, day of the week and length of day. Other input parameters can be used in different circumstances, for example in different geographic regions. The output parameter is the amount of energy needed expressed in Wh for the consecutive period. The neural network may be configured to self-correct / train in the user's home when the target temperature is not

BE2017 / 5024 was reached (exceed or fall) at the specified point in time with a temperature deviation of more than a given percentage, for example 5%. The cost function of the neural network is the temperature deviation between the target temperature and the actual temperature. In manufacture, a pre-trained neural network can already be installed on the computer server to reduce the time required for converging the neural network to a good solution. By using a self-adjusting feedforward neural grid, any changes to the boiler heating system can be made. 1 after installation, as well as any changes in the user water consumption patterns, are modeled by the algorithm used.

In a second phase, a long-short term memory (LSTM) neural network, a special form of recurrent neural network, is used to predict the stress pattern. A gated recurrent unit (GRU) neural network can also be used. This network can be trained with the following input parameters: voltage to neutral conductor, voltage parameters over the last sampling period (e.g. 10 minutes) such as minimum, maximum, average and mean absolute deviation, line voltage and line voltage parameters, if available, length of the day , current solar production as indicated by a network operator, predicted next day solar production as available by the network operator, current outdoor temperature and outdoor temperature forecast. Solar information can be obtained from the internet from the central server or from a website of the network operator. Temperature information is available on the internet as is commonly known. The output of the LSTM neural network is the expected minimum, maximum, mean and mean absolute deviation for each sampling period up to the target time. Often the neural network can predict the stress pattern up to 24 hours in advance with a 10 minute interval. This predicted pattern was used in the next step. The advantage of using a recurrent neural network is that summer / winter patterns, sun patterns and changes in the voltage regulator on the network administrator side can be included in the model.

In the next step, the power budget as predicted by the first feed forward neural network is spread over the predicted

BE2017 / 5024 voltage pattern. For each sampling period, the energy (Wh) is determined what is to be consumed per volt deviation from the nominal electricity voltage, possibly with a spread around the average, in order to achieve the power budget and to improve the quality of the mains voltage as much as possible. As a result, the computer server can consume a maximum of energy when the actual voltage measured is highest within that time slot, and the least amount of energy when the actual voltage is minimum within that time slot. With this prediction method, the computer server is able to consume most of the energy when the renewable energy from the sun pushes the line voltage up and / or when the local electricity network is under utilization, often during the night.

As a final step, the computer server can execute the predicted pattern by performing its batch of tasks, checking its power based on the predicted schedule. It is important to note that the actual measured voltage can be used as a control value instead of the predicted voltage. The predicted voltage range is used to calculate the spread of energy over the sampling period. Because irregular voltage patterns can still occur which cannot or cannot be modeled during each sampling period, the algorithm can be extended with, a controller, eg a proportional / integrating controller (Pi controller), This controller can correct the consumption to the desired value as known by the knowledgeable expert. The ΡΙ-controller is able to incorporate the mains frequency in its parameters, which allows the consumption of the computer server to respond to a certain extent, temporarily, to changes in the mains frequency. The recurrent neural network can be pre-trained at the factory but must be updated at regular intervals to keep up with pattern changes.

The computer server can be provided to contact a central server to report on the performance of the neural network, its parameters and to download new models from such neural network when such model becomes available.

Furthermore, the heating system 1 can be smart, grid ready. In a smart grid, not only generators can adapt to the

BE2017 / 5024 changing electricity demand, but also household appliances such as washing machines, drying cabinets and HVAC systems can be used. These should modulate their energy consumption based on the availability of electricity in the electricity network. Using smart meters, household appliances may be able to respond to more or less power produced by the sun or wind. The system 1 can be provided so that not only its arithmetic behavior can be changed based on user demand or demand for heat (for domestic hot water / heating of a building), but also based on external factors such as the availability of sun and wind . The communication and expected behavior of a Smart Device is investigated by the standard organization CENELEC. The system. 1 is advantageously provided to respond to demand from a smart meter, under the control of the network operator, to increase or decrease its consumption. In this way, the system is. 1 able to behave like a smart heating system, depending on or totally independent of the network operator, not only very efficient in its use of resources, but also contributing to the stability of the electricity network.

Some members of most examples of the present invention can be made in multiple parts designed for modular assembly of various sizes and shapes and for easy removal and optionally replacement of certain members or parts of members without disassembly of the entire combination. In addition to the processing unit 2, module holder 58, heat pipe 8, container unit 4, the removable parts can for instance comprise one or more sensors, controllers, operating means, control unit, etc. Other parts can also be removable.

Herein, the invention is described with reference to specific examples of embodiments of the invention. It will be understood, however, that various modifications and changes can be made therein without departing from the essence of the invention. For clarity and a brief description, functions are described here as part of the same or separate embodiments, however, alternative embodiments which describe combinations of all or part of those described in these separate embodiments are also contemplated.

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However, other modifications, variations and alternatives are also possible. The specifications, drawings and examples are, therefore, to be considered in an illustrative rather than a limiting sense.

For clarity and brief description, functions here are described as part of the same or separate embodiments, however, it will be understood that the scope of the invention may include combinations of all or part of the functions described.

In the claims, all reference marks placed in brackets will not be construed, the claim is limited, The word comprising does not exclude, the presence of elements or steps other than those mentioned in a claim, Furthermore, the words' one 'and' one should not "not, are understood to be limited to" only one, "but are used instead to mean" at least one, "and not exclude a multiple. The mere fact that certain measures are listed in mutually different claims does not indicate that a combination of these measures cannot be used to an advantage.

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Claims (56)

Conclusions A heating system for heating by means of a processing unit, the system comprising at least one processing unit with at least one processor for performing computational tasks and a holding unit for holding a medium, the at least one processing unit being thermally coupled with at least a portion of the container unit by means of at least one heat pipe, the at least one heat pipe being adapted to transfer thermal energy produced by the at least one processing unit to the at least one portion of the container unit for heating the medium in the container unit. The heating system according to claim 1, wherein the at least one processing unit is arranged below the container unit. A heating system for heating by means of a processing unit, the system comprising at least one processing unit with at least one processor for performing computational tasks, and a container unit for holding a medium, the at least one processing unit being the container unit is arranged, preferably by means of at least one heat pipe adapted to transfer thermal energy produced by the at least one processing unit to the portion of the container unit for heating the medium in the container unit. The heating system according to any of the preceding claims, wherein the at least one processing unit is directly thermally coupled to a wall portion of the container unit by means of the at least one heat pipe. The heating system according to any one of the preceding claims, wherein the at least one processing unit is directly thermally coupled to the medium in the container unit by means of the at least one heat pipe. BE2017 / 5024 The heating system according to claim 5, wherein the system further comprises a thermal coupling member adapted to form a thermal coupling between the at least one processing unit and a portion of the container unit. The heating system according to claim 6, wherein the thermal coupling part comprises a heat pump adapted to transfer thermal energy from the at least one processing unit to the container unit. The heating system according to claim 6 or 7, wherein the thermal coupling part comprises a thermoelectric cooler for adjusting the rate of thermal energy transfer to the container unit. The heating system according to any one of claims 6-8, wherein the thermal coupling part comprises means for coupling the at least one processing unit to a heat exchanger arranged in the holder unit. The heating system according to any one of claims 6-9, wherein the thermal coupling part comprises means for coupling the at least one processing unit to a heat exchanger arranged outside around the container unit. The heating system according to claim 9 or 10, wherein the heat exchanger is a spiral heat exchanger. The heating system according to any one of the preceding claims, wherein at least two processing units are arranged, wherein a first processing unit of the at least two processing units is thermally coupled to a first location at or in the container unit by means of a first heat pipe, and a second processing unit of the at least two processing units is thermally coupled to a second location at or in container unit by means of a second heat pipe, the first location being different from the second location. BE2017 / 5024 The heating system of claim 12, wherein the first processing unit is coupled to a first heat exchanger positioned at the first location at or in the container unit and the second processing unit is coupled to a second heat exchanger positioned at the second location at or in the container unit, the first heat exchanger and the second heat exchanger are spaced from each other in a longitudinal direction of the container unit. The heating system according to claim 13, wherein, in use, the first processing unit has a higher thermal energy output capacity than that of the second processing unit, the first heat exchanger being arranged closer to an upper end of the container unit than the second heat exchanger. The heating system according to any one of the preceding claims, wherein the at least one processing unit comprises a plurality of components, wherein at least a first component is thermally coupled to a third location at or in the container unit by means of a third heat pipe and at least a second component is thermally coupled to a fourth location at or in the container unit by a fourth heat pipe, the third location being different from the fourth location. The heating system according to claim 15, wherein at least the first component is coupled to a first heat exchanger positioned at the third location at or in the container unit and / or at least the second component is coupled to a second heat exchanger positioned at the fourth location at or in the container unit, wherein the first heat exchanger and the second heat exchanger are spaced from each other in a longitudinal direction of the container unit. The heating system of claim 16, wherein, in use, the at least one first component has a higher thermal energy output capacity than the at least one second component, wherein the first heat exchanger BE2017 / 5024 is arranged closer to an upper end of the container unit than the second heat exchanger. The heating system according to any one of the preceding claims, wherein the at least one processing unit is arranged on a bottom side of the holder unit and is coupled to a bottom part of the holder unit. The heating system according to any one of the preceding claims, further comprising a module holder adapted to hold at least one processing unit, the module holder being thermally coupled to the holder unit by means of at least one heat pipe. The heating system of claim 19, wherein a plurality of processing units are received in the module holder. The heating system according to claim 19 or 20, wherein at least one processing unit is detachably connected to the module holder. The heating system according to any one of claims 19-21, wherein the module holder comprises at least one receiving slot adapted to receive a processing unit, a processing unit of the at least one processing unit being arranged to be slid into a receiving slot of the module holder in a position below the container unit, the module container being arranged to provide a thermal coupling between the at least one processing unit inserted in the at least one receiving slot and a portion of the container unit. The heating system according to claim 22, wherein the module holder comprises a plurality of receiving slots, each configured to receive a processing unit. The heating system according to any one of claims 19-23, wherein the at least one processing unit in the module holder is cooled by means of a cooling device adapted to transfer heat from the at least BE2017 / 5024 one processing unit in the module holder to the medium in the holder unit. The heating system according to any of the claims, wherein the at least one processing unit is cooled by immersion cooling. The heating system according to any one of the preceding claims, wherein the container unit includes an inlet opening for receiving a fluid, and an outlet opening for dispensing a fluid, the heating system being arranged to increase the temperature of fluid received at the inlet opening before delivering the fluid to the outlet port. The heating system according to claim 26, wherein the inlet opening and the outlet opening are the same. The heating system according to any one of the preceding claims, wherein the medium in the container unit is water and the container unit is a hot water reservoir adapted to store hot water. The heating system according to any one of claims 1-27, wherein the medium in the container unit is an oil. The heating system according to any one of claims 1-27, wherein the medium in the container unit is phase change material. The heating system according to any one of the preceding claims, wherein the system further comprises a control unit adapted to: determining a need for thermal energy output for heating the medium in the container unit, selecting one or more computational tasks to be performed by the at least one processing unit depending on the required thermal energy output, BE2017 / 5024 operating the at least one processing unit to perform the one or more computational tasks to obtain a resulting thermal energy output substantially corresponding to the required thermal energy output. The heating system of claim 31, wherein the resulting heat energy is increased by selecting a greater number of computational tasks. The heating system according to claim 31 or 32, wherein the resulting thermal energy is increased by reducing an interval between successive tasks. The heating system of any one of claims 31-33, wherein the thermal energy output is increased by selecting a more computer-intensive task. The heating system according to any one of claims 31-34, wherein the at least one processing unit is connected to an electrical power source, the control unit being configured to obtain data representative of a parameter of electricity from the power source and to allocate the one or more computational computation tasks over time based on the parameter. The heating system of claim 35, wherein the power source is at least one of an electricity network, a local photovoltaic solar cell, or a rechargeable battery. The heating system according to claim 35 or 36, wherein the parameter is one or more of the voltage of the electricity from the electricity grid, a cost per unit of the electricity from the electricity grid, a availability of renewable energy, or a frequency of the electricity from the power source. BE2017 / 5024 The heating system according to any of claims 35-37, wherein the data representative of the parameter is based on a prediction. The heating system according to any of claims 35-38, wherein the control unit is configured to: determining data representative of an amount of thermal energy required within a time schedule for heating the medium in the container unit to a desired temperature, determining a prediction of the power source electricity parameter for at least part of the time schedule, and assigning the one or more computational computation tasks over the time schedule based on the prediction of the parameter and the data representative of the amount of thermal energy required. The heating system according to claim 39, wherein the data representative of the amount of thermal energy required is based on a prediction. The heating system according to claim 39 or 40, wherein the prediction of the parameters and / or the prediction of the amount of thermal energy required is a continuous prediction. The heating system according to any one of the preceding claims, wherein the container unit is thermally insulated to store thermal energy in the medium in the container unit. The heating system according to any of the preceding claims, wherein the container unit is an upright vessel. The heating system according to any one of the preceding claims, which is arranged to monitor the temperature in the vessel, thereby providing protection against overheating of electronic computer equipment of the at least one processing unit. BE2017 / 5024 The heating system of claim 44, arranged to indicate, when the temperature in the vessel exceeds a first temperature threshold, that a limited time remains before the processing unit is slowed and / or stopped, and / or, when the temperature in the vessel is exceeds a second temperature threshold to slow down and / or stop the processing unit. The heating system of claim 45, arranged to present the user with an estimated time remaining before the second temperature threshold is reached. 47. Heating system for heating a medium by means of a processing unit, the system comprising at least one processing unit with at least one processor for performing computational tasks, and a holder unit for holding the medium, the at least one processing unit is thermally coupled for transferring thermal energy produced by the at least one processing unit to the medium, the at least one processing unit being connectable to an electrical power source, the control unit configured to represent data representative of a parameter of electricity from the power source and to assign one or more computational computation tasks over time based on the parameter, where the data representative of the parameter is based on a prediction of the parameter. The heating system of claim 47, wherein the control unit is configured to determine data representative of an amount of thermal energy required within a time schedule for heating the medium to a desired temperature, determining the prediction of the parameter of electricity from the power source for at least part of the time schedule, and assigning the one or more computational computation tasks over the time schedule based on the prediction of the parameter and the data representative of the amount of thermal energy required. BE2017 / 5024 The heating system according to claim 48, wherein the data representative of the amount of thermal energy required is based on a prediction. The heating system according to claims 35-49, wherein the electrical power source is at least one of an electricity network, a local photovoltaic solar cell, or a rechargeable battery. The heating system according to claims 35-50, wherein the parameter of current from the power source is one or more of a voltage of the electricity from the electricity grid, a cost per unit of the electricity from the electricity grid, a availability of renewable energy, or a frequency of electricity from the power source. 52. Holder unit for use in the heating system according to claims 1-51. A processing unit for use in the heating system according to claims 1-52. 54. Module holder for use in the heating system according to claims 19-46. 55. A method of heating by means of a processing unit, the method comprising providing at least one processing unit with at least one processor for performing computational tasks, and a holding unit holding a medium therein, thermally coupling the ten at least one processing unit with at least a portion of the container unit by means of at least one heat pipe arranged to transfer thermal energy produced by heating the at least one processing unit to the at least one portion of the container unit thus the medium in the container unit . BE2017 / 5024 The method of claim 55, wherein a control unit is used for: determining a need for thermal energy output for heating the medium in the container unit, selecting one or more computational output by the at least one processing unit depending on the required thermal energy output, operating the at least one processing unit for performing the one or more computational tasks to obtain a resulting thermal energy output substantially corresponding to the required thermal energy output. B E2017 / 5024