AU7820998A - Shield for sputter coating method and apparatus - Google Patents

Shield for sputter coating method and apparatus

Info

Publication number
AU7820998A
AU7820998A AU78209/98A AU7820998A AU7820998A AU 7820998 A AU7820998 A AU 7820998A AU 78209/98 A AU78209/98 A AU 78209/98A AU 7820998 A AU7820998 A AU 7820998A AU 7820998 A AU7820998 A AU 7820998A
Authority
AU
Australia
Prior art keywords
shield
coating method
sputter coating
sputter
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU78209/98A
Inventor
David B. Jordan
Raul D. Mercado
Andrew W. Tudhope
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Equipment Tech Inc
Original Assignee
Semiconductor Equipment Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Equipment Tech Inc filed Critical Semiconductor Equipment Tech Inc
Publication of AU7820998A publication Critical patent/AU7820998A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
AU78209/98A 1997-06-04 1998-06-04 Shield for sputter coating method and apparatus Abandoned AU7820998A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US86876397A 1997-06-04 1997-06-04
US08868763 1997-06-04
PCT/US1998/011673 WO1998055666A1 (en) 1997-06-04 1998-06-04 Shield for sputter coating method and apparatus

Publications (1)

Publication Number Publication Date
AU7820998A true AU7820998A (en) 1998-12-21

Family

ID=25352270

Family Applications (1)

Application Number Title Priority Date Filing Date
AU78209/98A Abandoned AU7820998A (en) 1997-06-04 1998-06-04 Shield for sputter coating method and apparatus

Country Status (2)

Country Link
AU (1) AU7820998A (en)
WO (1) WO1998055666A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002222767A (en) * 2001-01-26 2002-08-09 Seiko Epson Corp Method of forming jig for vacuum device
CN112226721A (en) * 2020-07-28 2021-01-15 安徽富乐德科技发展股份有限公司 Preparation process of copper meltallizing layer applied to electronic industry equipment cavity
CN115478249B (en) * 2022-09-20 2024-03-05 宣城开盛新能源科技有限公司 Anti-sticking plate for copper indium gallium selenide sputtering, preparation method and reuse method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5135629A (en) * 1989-06-12 1992-08-04 Nippon Mining Co., Ltd. Thin film deposition system
US5045165A (en) * 1990-02-01 1991-09-03 Komag, Inc. Method for sputtering a hydrogen-doped carbon protective film on a magnetic disk
US5202008A (en) * 1990-03-02 1993-04-13 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
JP2907401B2 (en) * 1991-02-21 1999-06-21 キヤノン株式会社 Sputter deposition equipment
US5482612A (en) * 1992-10-27 1996-01-09 Texas Instruments Incorporated Methods and systems for shielding in sputtering chambers
US5614017A (en) * 1996-03-26 1997-03-25 Arco Chemical Technology, L.P. Cement additives

Also Published As

Publication number Publication date
WO1998055666A1 (en) 1998-12-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase