AU7547600A - Method of bonding a plurality of thermally conductive elements to a substrate - Google Patents

Method of bonding a plurality of thermally conductive elements to a substrate

Info

Publication number
AU7547600A
AU7547600A AU75476/00A AU7547600A AU7547600A AU 7547600 A AU7547600 A AU 7547600A AU 75476/00 A AU75476/00 A AU 75476/00A AU 7547600 A AU7547600 A AU 7547600A AU 7547600 A AU7547600 A AU 7547600A
Authority
AU
Australia
Prior art keywords
bonding
substrate
thermally conductive
conductive elements
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU75476/00A
Inventor
Caroline Dorothea Sagel-Ransijn
Willem Kornelis Leendert Van Der Voorden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Drukker International BV
Original Assignee
Drukker International BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Drukker International BV filed Critical Drukker International BV
Publication of AU7547600A publication Critical patent/AU7547600A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU75476/00A 1999-10-05 2000-10-04 Method of bonding a plurality of thermally conductive elements to a substrate Abandoned AU7547600A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ZA99/6317 1999-10-05
ZA996317 1999-10-05
PCT/IB2000/001414 WO2001026153A1 (en) 1999-10-05 2000-10-04 Method of bonding a plurality of thermally conductive elements to a substrate

Publications (1)

Publication Number Publication Date
AU7547600A true AU7547600A (en) 2001-05-10

Family

ID=25587945

Family Applications (1)

Application Number Title Priority Date Filing Date
AU75476/00A Abandoned AU7547600A (en) 1999-10-05 2000-10-04 Method of bonding a plurality of thermally conductive elements to a substrate

Country Status (2)

Country Link
AU (1) AU7547600A (en)
WO (1) WO2001026153A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011077614B4 (en) * 2011-06-16 2023-08-17 Osram Gmbh Method for producing a lighting device and lighting device
US9194189B2 (en) 2011-09-19 2015-11-24 Baker Hughes Incorporated Methods of forming a cutting element for an earth-boring tool, a related cutting element, and an earth-boring tool including such a cutting element

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02163955A (en) * 1988-12-17 1990-06-25 Tekunisuko:Kk Coating-type heat sink and its manufacture
JPH02196477A (en) * 1989-01-25 1990-08-03 Nec Corp Manufacture of photosemiconductor device
DE19651528B4 (en) * 1996-12-11 2005-10-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Chip arrangement and method for producing the same

Also Published As

Publication number Publication date
WO2001026153A1 (en) 2001-04-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase