AU7152901A - Method and apparatus for locating and securing a printed wire board on a screen printer - Google Patents
Method and apparatus for locating and securing a printed wire board on a screen printerInfo
- Publication number
- AU7152901A AU7152901A AU7152901A AU7152901A AU7152901A AU 7152901 A AU7152901 A AU 7152901A AU 7152901 A AU7152901 A AU 7152901A AU 7152901 A AU7152901 A AU 7152901A AU 7152901 A AU7152901 A AU 7152901A
- Authority
- AU
- Australia
- Prior art keywords
- locating
- securing
- screen printer
- printed wire
- wire board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
- B41F15/26—Supports for workpieces for articles with flat surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60883300A | 2000-06-30 | 2000-06-30 | |
PCT/US2001/020453 WO2002003765A2 (en) | 2000-06-30 | 2001-07-25 | Method and apparatus for locating and securing a printed wire board on a screen printer |
Publications (1)
Publication Number | Publication Date |
---|---|
AU7152901A true AU7152901A (en) | 2002-01-14 |
Family
ID=24438209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU7152901A Pending AU7152901A (en) | 2000-06-30 | 2001-07-25 | Method and apparatus for locating and securing a printed wire board on a screen printer |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU7152901A (en) |
TW (1) | TW506240B (en) |
WO (1) | WO2002003765A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7631796B2 (en) | 2007-12-04 | 2009-12-15 | Sony Corporation | Selective soldering system |
US7648056B1 (en) | 2008-07-03 | 2010-01-19 | Sony Corporation | Selective soldering bath |
CN102489794A (en) * | 2011-11-18 | 2012-06-13 | 景旺电子(深圳)有限公司 | Method and device for processing threaded holes |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2163371B3 (en) * | 1971-12-16 | 1974-08-23 | Klein Leon | |
BE897929A (en) * | 1983-10-06 | 1984-04-06 | Bell Telephone Mfg | SCREEN PRINTING DEVICE |
US4828240A (en) * | 1986-09-02 | 1989-05-09 | Te-Co. | Workpiece securing apparatus for a machine tool |
JP2709416B2 (en) * | 1990-08-21 | 1998-02-04 | 株式会社インフォム | Positioning holding device |
JP3290788B2 (en) * | 1993-12-14 | 2002-06-10 | 富士通株式会社 | Solder film forming equipment for printed circuit boards |
US5911329A (en) * | 1996-04-30 | 1999-06-15 | Micron Technology, Inc. | Apparatus and method for facilitating circuit board processing |
TW475086B (en) * | 1996-07-03 | 2002-02-01 | Toshiba Corp | Manufacturing method of flat-panel display unit, display panel carrier therefore and manufacturing method of electronic device or optical device |
FR2767731B1 (en) * | 1997-09-03 | 1999-10-29 | Carossino Patricia | HORIZONTAL PUSH ELEMENT FOR HORIZONTAL CLAMPING DEVICE |
-
2001
- 2001-06-29 TW TW90115978A patent/TW506240B/en not_active IP Right Cessation
- 2001-07-25 AU AU7152901A patent/AU7152901A/en active Pending
- 2001-07-25 WO PCT/US2001/020453 patent/WO2002003765A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2002003765A3 (en) | 2002-08-08 |
WO2002003765A2 (en) | 2002-01-10 |
TW506240B (en) | 2002-10-11 |
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