AU7054300A - Flip-chip package with image plane reference - Google Patents

Flip-chip package with image plane reference

Info

Publication number
AU7054300A
AU7054300A AU70543/00A AU7054300A AU7054300A AU 7054300 A AU7054300 A AU 7054300A AU 70543/00 A AU70543/00 A AU 70543/00A AU 7054300 A AU7054300 A AU 7054300A AU 7054300 A AU7054300 A AU 7054300A
Authority
AU
Australia
Prior art keywords
flip
image plane
chip package
plane reference
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU70543/00A
Inventor
Jonathan Michael Stern
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SILICON FILM TECHNOLOGIES Inc
Original Assignee
SILICON FILM TECHNOLOGIES Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SILICON FILM TECHNOLOGIES Inc filed Critical SILICON FILM TECHNOLOGIES Inc
Publication of AU7054300A publication Critical patent/AU7054300A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
AU70543/00A 1999-08-06 2000-08-04 Flip-chip package with image plane reference Abandoned AU7054300A (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US14758199P 1999-08-06 1999-08-06
US60147581 1999-08-06
US19251200P 2000-03-28 2000-03-28
US60192512 2000-03-28
US63057900A 2000-08-03 2000-08-03
US09630579 2000-08-03
PCT/US2000/021345 WO2001011694A2 (en) 1999-08-06 2000-08-04 Flip-chip package with image plane reference

Publications (1)

Publication Number Publication Date
AU7054300A true AU7054300A (en) 2001-03-05

Family

ID=27386574

Family Applications (1)

Application Number Title Priority Date Filing Date
AU70543/00A Abandoned AU7054300A (en) 1999-08-06 2000-08-04 Flip-chip package with image plane reference

Country Status (2)

Country Link
AU (1) AU7054300A (en)
WO (1) WO2001011694A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9503622B2 (en) 2014-03-10 2016-11-22 Apple Inc. Preventing artifacts due to underfill in flip chip imager assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56129378A (en) * 1980-03-14 1981-10-09 Hitachi Ltd Solid image-pickup element
US5149958A (en) * 1990-12-12 1992-09-22 Eastman Kodak Company Optoelectronic device component package
JP3161142B2 (en) * 1993-03-26 2001-04-25 ソニー株式会社 Semiconductor device
JP3547869B2 (en) * 1995-11-07 2004-07-28 コニカミノルタホールディングス株式会社 Imaging device
US5925898A (en) * 1996-07-18 1999-07-20 Siemens Aktiengesellschaft Optoelectronic transducer and production methods

Also Published As

Publication number Publication date
WO2001011694A2 (en) 2001-02-15
WO2001011694A3 (en) 2001-08-30

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase