AU6918791A - Mounting for electronic components which need to be cooled - Google Patents

Mounting for electronic components which need to be cooled

Info

Publication number
AU6918791A
AU6918791A AU69187/91A AU6918791A AU6918791A AU 6918791 A AU6918791 A AU 6918791A AU 69187/91 A AU69187/91 A AU 69187/91A AU 6918791 A AU6918791 A AU 6918791A AU 6918791 A AU6918791 A AU 6918791A
Authority
AU
Australia
Prior art keywords
cooled
mounting
need
electronic components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU69187/91A
Other languages
English (en)
Inventor
Werner Hofmeister
Michael Wittenauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of AU6918791A publication Critical patent/AU6918791A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU69187/91A 1990-01-25 1990-12-22 Mounting for electronic components which need to be cooled Abandoned AU6918791A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4002060 1990-01-25
DE19904002060 DE4002060A1 (de) 1990-01-25 1990-01-25 Halterung fuer zu kuehlende elektronische bauelemente

Publications (1)

Publication Number Publication Date
AU6918791A true AU6918791A (en) 1991-08-21

Family

ID=6398701

Family Applications (1)

Application Number Title Priority Date Filing Date
AU69187/91A Abandoned AU6918791A (en) 1990-01-25 1990-12-22 Mounting for electronic components which need to be cooled

Country Status (6)

Country Link
EP (1) EP0511965A1 (fr)
JP (1) JPH05504444A (fr)
AU (1) AU6918791A (fr)
BR (1) BR9007983A (fr)
DE (1) DE4002060A1 (fr)
WO (1) WO1991011897A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9113009U1 (de) * 1991-10-19 1993-02-18 Robert Bosch Gmbh, 7000 Stuttgart Baugruppe für elektronische Steuergeräte
WO1994006625A1 (fr) * 1992-09-14 1994-03-31 Cytec Technology Corp. Reduction de la degradation galvanique de structures metalliques/composites hybrides
US5309979A (en) * 1993-06-08 1994-05-10 Delco Electronics Corp. Self clamping heat sink assembly
US6674164B1 (en) * 1999-04-26 2004-01-06 Aerovironment, Inc. System for uniformly interconnecting and cooling
US7190589B2 (en) 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
JP5267412B2 (ja) * 2009-10-07 2013-08-21 株式会社デンソー 冷媒冷却型両面冷却半導体装置
CN106535543A (zh) * 2017-01-05 2017-03-22 科蒂斯技术（苏州）有限公司 控制器晶体管的固定装置
DE102022123568A1 (de) 2022-09-15 2024-03-21 Eberspächer Catem Gmbh & Co. Kg Steuervorrichtung und Verfahren zur Herstellung einer Steuervorrichtung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3331207A1 (de) * 1983-08-30 1985-03-07 Robert Bosch Gmbh, 7000 Stuttgart Baugruppe fuer elektronische steuergeraete
US4669028A (en) * 1986-02-18 1987-05-26 Ncr Corporation Heat sink for solid state devices connected to a circuit board
US4872089A (en) * 1988-12-19 1989-10-03 Motorola Inc. Heat sink assembly for densely packed transistors

Also Published As

Publication number Publication date
DE4002060A1 (de) 1991-08-01
EP0511965A1 (fr) 1992-11-11
WO1991011897A1 (fr) 1991-08-08
BR9007983A (pt) 1992-12-01
JPH05504444A (ja) 1993-07-08

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