AU6768500A - Apparatus and method for protecting electronic assembly contacts - Google Patents
Apparatus and method for protecting electronic assembly contactsInfo
- Publication number
- AU6768500A AU6768500A AU67685/00A AU6768500A AU6768500A AU 6768500 A AU6768500 A AU 6768500A AU 67685/00 A AU67685/00 A AU 67685/00A AU 6768500 A AU6768500 A AU 6768500A AU 6768500 A AU6768500 A AU 6768500A
- Authority
- AU
- Australia
- Prior art keywords
- electronic assembly
- assembly contacts
- protecting electronic
- protecting
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37446799A | 1999-08-13 | 1999-08-13 | |
US09374467 | 1999-08-13 | ||
PCT/US2000/022145 WO2001013422A1 (en) | 1999-08-13 | 2000-08-10 | Apparatus and method for protecting electronic assembly contacts |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6768500A true AU6768500A (en) | 2001-03-13 |
Family
ID=23476962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU67685/00A Abandoned AU6768500A (en) | 1999-08-13 | 2000-08-10 | Apparatus and method for protecting electronic assembly contacts |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU6768500A (en) |
TW (1) | TW503498B (en) |
WO (1) | WO2001013422A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1271156A3 (en) * | 2001-06-25 | 2004-06-09 | Xpeqt AG | Test/burn in socket assembly |
CN101793912B (en) * | 2009-02-03 | 2011-12-28 | 京元电子股份有限公司 | Tube-to-disc conversion device |
DE202017100381U1 (en) | 2017-01-25 | 2017-02-03 | Hiwin Technologies Corp. | Linear module with a lubrication support |
KR102654550B1 (en) * | 2023-12-12 | 2024-04-04 | 주식회사 프로이천 | Hybrid floating block |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3838413A1 (en) * | 1988-11-12 | 1990-05-17 | Mania Gmbh | ADAPTER FOR ELECTRONIC TEST DEVICES FOR PCBS AND THE LIKE |
US5772451A (en) * | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
JPH08213128A (en) * | 1995-02-08 | 1996-08-20 | Texas Instr Japan Ltd | Socket |
US5783461A (en) * | 1996-10-03 | 1998-07-21 | Micron Technology, Inc. | Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication |
-
2000
- 2000-08-10 WO PCT/US2000/022145 patent/WO2001013422A1/en active Application Filing
- 2000-08-10 AU AU67685/00A patent/AU6768500A/en not_active Abandoned
- 2000-08-11 TW TW89116269A patent/TW503498B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2001013422A1 (en) | 2001-02-22 |
TW503498B (en) | 2002-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |