AU6509900A - Optocoupler on a metallized pcb and method of manufacturing the same - Google Patents
Optocoupler on a metallized pcb and method of manufacturing the sameInfo
- Publication number
- AU6509900A AU6509900A AU65099/00A AU6509900A AU6509900A AU 6509900 A AU6509900 A AU 6509900A AU 65099/00 A AU65099/00 A AU 65099/00A AU 6509900 A AU6509900 A AU 6509900A AU 6509900 A AU6509900 A AU 6509900A
- Authority
- AU
- Australia
- Prior art keywords
- optocoupler
- manufacturing
- same
- metallized
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36905599A | 1999-08-04 | 1999-08-04 | |
US09369055 | 1999-08-04 | ||
PCT/US2000/021023 WO2001011697A1 (en) | 1999-08-04 | 2000-08-01 | Optocoupler on a metallized pcb and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6509900A true AU6509900A (en) | 2001-03-05 |
Family
ID=23453901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU65099/00A Abandoned AU6509900A (en) | 1999-08-04 | 2000-08-01 | Optocoupler on a metallized pcb and method of manufacturing the same |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2003521107A (en) |
AU (1) | AU6509900A (en) |
WO (1) | WO2001011697A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10228390B4 (en) * | 2002-06-25 | 2007-04-19 | Krohne Meßtechnik GmbH & Co KG | optocoupler |
US20060016994A1 (en) * | 2004-07-22 | 2006-01-26 | Suresh Basoor | System and method to prevent cross-talk between a transmitter and a receiver |
KR100580753B1 (en) | 2004-12-17 | 2006-05-15 | 엘지이노텍 주식회사 | Light emitting device package |
US20130181232A1 (en) * | 2012-01-17 | 2013-07-18 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Optocoupler with Surface Functional Coating Layer |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0364163A3 (en) * | 1988-10-14 | 1991-11-21 | AT&T Corp. | Electro-optic device including opaque protective regions |
US5340993A (en) * | 1993-04-30 | 1994-08-23 | Motorola, Inc. | Optocoupler package wth integral voltage isolation barrier |
US5500912A (en) * | 1995-05-02 | 1996-03-19 | Motorola, Inc. | Holographic optical isolator utilizing opto-electronic transmitter and receiver disposed in a package |
US5828074A (en) * | 1997-05-19 | 1998-10-27 | Mini-Systems, Inc. | Optoisolator comprising walls having photosensitive inner surfaces |
-
2000
- 2000-08-01 WO PCT/US2000/021023 patent/WO2001011697A1/en active Application Filing
- 2000-08-01 AU AU65099/00A patent/AU6509900A/en not_active Abandoned
- 2000-08-01 JP JP2001516256A patent/JP2003521107A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2003521107A (en) | 2003-07-08 |
WO2001011697A1 (en) | 2001-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2591400A (en) | Method of manufacturing of a discrete electronic device | |
AU4968500A (en) | Carrier for electronic components and a method for manufacturing a carrier | |
AU4606101A (en) | Lightguide Having a Directly Secured Reflector and Method of Making the Same | |
AU1430600A (en) | A circuit board and a method for manufacturing the same | |
AU5558799A (en) | A mechanical fastener and method for making the same | |
IL134416A0 (en) | Electrical devices and a method of manufacturing the same | |
AU4550397A (en) | Method of manufacturing a sandwich board and a board and structure manufactured by the method | |
AU2002214042A1 (en) | A supercapacitor and a method of manufacturing such a supercapacitor | |
AU7680498A (en) | Integrated circuit, components thereof and manufacturing method | |
AU4706497A (en) | Method of manufacturing a photovoltaic foil | |
AU1325001A (en) | Methods of making a superconductor | |
HK1041863A1 (en) | A wafer carrier having a low tolerance build-up and a method of assembling the same | |
AU7483898A (en) | Flexible lighting element circuit and method of manufacturing the same | |
AU6610198A (en) | A method of manufacturing chipboards, fibre boards and the like boards | |
EP1041715B8 (en) | Electronic component | |
AU2420601A (en) | An arrangement relating to antennas and a method of manufacturing the same | |
AU1898601A (en) | An electronic commerce system and a method of the same | |
AU2001260500A1 (en) | A method of electronic component fabrication and an electronic component | |
AU3878499A (en) | A stress-follower circuit configuration | |
GB9702010D0 (en) | A PCB having an inductor and a method of manufacturing the same | |
AU6420598A (en) | Circuit board and production method thereof | |
AU2650699A (en) | A trimming arrangement and a method of manufacturing the same | |
AU6509900A (en) | Optocoupler on a metallized pcb and method of manufacturing the same | |
AU1793399A (en) | Electronic circuit and manufacturing method for electronic circuit | |
AU5410399A (en) | Electronic component and method for the production thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |