AU6211000A - A thin film resistor device and a method of manufacture therefor - Google Patents
A thin film resistor device and a method of manufacture thereforInfo
- Publication number
- AU6211000A AU6211000A AU62110/00A AU6211000A AU6211000A AU 6211000 A AU6211000 A AU 6211000A AU 62110/00 A AU62110/00 A AU 62110/00A AU 6211000 A AU6211000 A AU 6211000A AU 6211000 A AU6211000 A AU 6211000A
- Authority
- AU
- Australia
- Prior art keywords
- thin film
- film resistor
- resistor device
- manufacture therefor
- therefor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/20—Resistors
- H01L28/24—Resistors with an active material comprising a refractory, transition or noble metal, metal compound or metal alloy, e.g. silicides, oxides, nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/08—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by vapour deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5228—Resistive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0802—Resistors only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
- H01L23/53223—Additional layers associated with aluminium layers, e.g. adhesion, barrier, cladding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14369199P | 1999-07-14 | 1999-07-14 | |
US60143691 | 1999-07-14 | ||
PCT/US2000/019010 WO2001006547A1 (en) | 1999-07-14 | 2000-07-13 | A thin film resistor device and a method of manufacture therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6211000A true AU6211000A (en) | 2001-02-05 |
Family
ID=22505173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU62110/00A Abandoned AU6211000A (en) | 1999-07-14 | 2000-07-13 | A thin film resistor device and a method of manufacture therefor |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1203400A1 (en) |
AU (1) | AU6211000A (en) |
WO (1) | WO2001006547A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6709882B2 (en) * | 2001-08-27 | 2004-03-23 | Lightwave Microsystems Corporation | Planar lightwave circuit active device metallization process |
US20040070048A1 (en) | 2002-10-15 | 2004-04-15 | Kwok Siang Ping | Providing high precision resistance in an integrated circuit using a thin film resistor of controlled dimension |
US7986027B2 (en) | 2006-10-20 | 2011-07-26 | Analog Devices, Inc. | Encapsulated metal resistor |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01255264A (en) * | 1988-04-05 | 1989-10-12 | Seiko Instr Inc | Manufacture of semiconductor device |
JPH01291401A (en) * | 1988-05-19 | 1989-11-24 | Fuji Elelctrochem Co Ltd | Thin film resistor and manufacture thereof |
US4975386A (en) * | 1989-12-22 | 1990-12-04 | Micro Power Systems, Inc. | Process enhancement using molybdenum plugs in fabricating integrated circuits |
JPH0582519A (en) * | 1991-09-19 | 1993-04-02 | Nec Corp | Wiring for semiconductor device and manufacture thereof |
JP3374680B2 (en) * | 1996-11-06 | 2003-02-10 | 株式会社デンソー | Method for manufacturing semiconductor device |
JPH1187264A (en) * | 1997-09-11 | 1999-03-30 | Asahi Kasei Micro Syst Kk | Semiconductor device and manufacture thereof |
-
2000
- 2000-07-13 EP EP00948639A patent/EP1203400A1/en not_active Withdrawn
- 2000-07-13 WO PCT/US2000/019010 patent/WO2001006547A1/en not_active Application Discontinuation
- 2000-07-13 AU AU62110/00A patent/AU6211000A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2001006547A1 (en) | 2001-01-25 |
EP1203400A1 (en) | 2002-05-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2002221122A1 (en) | Thin film forming method and thin film forming device | |
AU2001288359A1 (en) | Thin film battery and method of manufacture | |
AU7758800A (en) | Method and apparatus for depositing and controlling the texture of a thin film | |
EP0969530A3 (en) | Piezoelectric thin film component and method of manufacturing | |
EP1092233A4 (en) | Method of forming a thin film | |
AU2001266325A1 (en) | Method for forming thin film and apparatus for forming thin film | |
AU2712597A (en) | Piezoelectric thin film device | |
AU2351499A (en) | Thin plastic film | |
AU5444099A (en) | Adhesive tape piece sticking device | |
AU2383601A (en) | A thin film transistor and a method for manufacturing thereof | |
AU2001282547A1 (en) | Method of forming optical thin film and optical element provided with optical thin film | |
AU6924898A (en) | Method and device for keeping watch over premises | |
AU1213900A (en) | Method of forming an improved support member for a fabric and film forming device | |
AU3602399A (en) | Method and device for coating a surface with a plastic film | |
AU6073101A (en) | Method for producing thin film heating element and heating device using same | |
AU2002306649A1 (en) | A method for making thick and/or thin film | |
AU5698800A (en) | A thin multimedia communication device and method | |
AU4456500A (en) | Method of making thin film piezoresistive sensor | |
AU6256396A (en) | Dental adhesive device and method of making | |
AU2292901A (en) | Dental adhesive device and method for producing same | |
AU1540100A (en) | Method and device for the application of reflecting material on a substrate | |
AU1646001A (en) | Device and method for the manual printing of variable information | |
AU6211000A (en) | A thin film resistor device and a method of manufacture therefor | |
AU2002228436A1 (en) | Film forming method and film forming device | |
AU2002223780A1 (en) | Method and device for depositing thin films |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |