AU6023873A - Semiconductor assembly - Google Patents

Semiconductor assembly

Info

Publication number
AU6023873A
AU6023873A AU60238/73A AU6023873A AU6023873A AU 6023873 A AU6023873 A AU 6023873A AU 60238/73 A AU60238/73 A AU 60238/73A AU 6023873 A AU6023873 A AU 6023873A AU 6023873 A AU6023873 A AU 6023873A
Authority
AU
Australia
Prior art keywords
semiconductor assembly
semiconductor
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU60238/73A
Other languages
English (en)
Inventor
Marius Grandin William
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borg Warner Corp
Original Assignee
Borg Warner Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Borg Warner Corp filed Critical Borg Warner Corp
Publication of AU6023873A publication Critical patent/AU6023873A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
AU60238/73A 1972-10-26 1973-09-12 Semiconductor assembly Expired AU6023873A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US00301041A US3808471A (en) 1972-10-26 1972-10-26 Expandible pressure mounted semiconductor assembly
USUS301,041 1972-10-26

Publications (1)

Publication Number Publication Date
AU6023873A true AU6023873A (en) 1975-03-13

Family

ID=23161680

Family Applications (1)

Application Number Title Priority Date Filing Date
AU60238/73A Expired AU6023873A (en) 1972-10-26 1973-09-12 Semiconductor assembly

Country Status (8)

Country Link
US (1) US3808471A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS4974338A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AU (1) AU6023873A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA989511A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2348172A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2204888A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT995589B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
ZA (1) ZA737231B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3916435A (en) * 1974-09-09 1975-10-28 Gen Motors Corp Heat sink assembly for button diode rectifiers
CS180334B1 (en) * 1975-11-28 1977-12-30 Jiri Kovar Power semiconducting disc elements suppressing and jigging equipment
US4263607A (en) * 1979-03-06 1981-04-21 Alsthom-Atlantique Snap fit support housing for a semiconductor power wafer
DE2909138A1 (de) * 1979-03-08 1980-09-11 Siemens Ag Thyristorsaeule
FR2451632A1 (fr) * 1979-03-12 1980-10-10 Alsthom Atlantique Montage de semi-conducteurs de puissance refroidis par un flugene
US4504850A (en) * 1981-10-02 1985-03-12 Westinghouse Electric Corp. Disc-type semiconductor mounting arrangement with force distribution spacer
US4830979A (en) * 1988-08-01 1989-05-16 Sundstrand Corp. Method of manufacturing hermetically sealed compression bonded circuit assemblies
US4954876A (en) * 1988-08-01 1990-09-04 Sundstrand Corporation Hermetically sealed compression bonded circuit assembly having flexible walls at points of application of pressure for compression bonding circuit elements
US5034803A (en) * 1988-08-01 1991-07-23 Sundstrand Corporation Compression bonded semiconductor device having a plurality of stacked hermetically sealed circuit assemblies
US4985752A (en) * 1988-08-01 1991-01-15 Sundstrand Corporation Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements
US5105262A (en) * 1988-09-19 1992-04-14 Ford Motor Company Thick film circuit housing assembly design
US5749413A (en) * 1991-09-23 1998-05-12 Sundstrand Corporation Heat exchanger for high power electrical component and package incorporating same
DE102007016222B3 (de) * 2007-04-04 2008-11-06 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul in Druckkontaktausführung sowie Verfahren zur Herstellung desselben

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL281641A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1961-08-04 1900-01-01
US3413532A (en) * 1965-02-08 1968-11-26 Westinghouse Electric Corp Compression bonded semiconductor device
CH442502A (de) * 1965-04-23 1967-08-31 Siemens Ag Gleichrichteranlage
DE1914790A1 (de) * 1969-03-22 1970-10-01 Siemens Ag Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen
US3652903A (en) * 1971-02-01 1972-03-28 Gen Electric Fluid cooled pressure assembly

Also Published As

Publication number Publication date
ZA737231B (en) 1974-09-25
US3808471A (en) 1974-04-30
JPS4974338A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-07-18
FR2204888A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-05-24
IT995589B (it) 1975-11-20
CA989511A (en) 1976-05-18
DE2348172A1 (de) 1974-05-09

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