AU5492800A - A method and apparatus for etching carbon-doped organic silicate glass - Google Patents
A method and apparatus for etching carbon-doped organic silicate glassInfo
- Publication number
- AU5492800A AU5492800A AU54928/00A AU5492800A AU5492800A AU 5492800 A AU5492800 A AU 5492800A AU 54928/00 A AU54928/00 A AU 54928/00A AU 5492800 A AU5492800 A AU 5492800A AU 5492800 A AU5492800 A AU 5492800A
- Authority
- AU
- Australia
- Prior art keywords
- silicate glass
- doped organic
- organic silicate
- etching carbon
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005530 etching Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000005368 silicate glass Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34094399A | 1999-06-28 | 1999-06-28 | |
US09340943 | 1999-06-28 | ||
PCT/US2000/016555 WO2001001470A1 (en) | 1999-06-28 | 2000-06-14 | A method and apparatus for etching carbon-doped organic silicate glass |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5492800A true AU5492800A (en) | 2001-01-31 |
Family
ID=23335600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU54928/00A Abandoned AU5492800A (en) | 1999-06-28 | 2000-06-14 | A method and apparatus for etching carbon-doped organic silicate glass |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR20020010728A (en) |
CN (1) | CN1367935A (en) |
AU (1) | AU5492800A (en) |
TW (1) | TW455986B (en) |
WO (1) | WO2001001470A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4014456B2 (en) * | 2002-06-19 | 2007-11-28 | 株式会社日立ハイテクノロジーズ | Etching method |
CN1326791C (en) * | 2005-05-26 | 2007-07-18 | 上海交通大学 | Method for processing micro slot array on borosilicate glass surface |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5356515A (en) * | 1990-10-19 | 1994-10-18 | Tokyo Electron Limited | Dry etching method |
TW363220B (en) * | 1996-07-15 | 1999-07-01 | Applied Materials Inc | Etching organic antireflective coating from a substrate |
EP0911697A3 (en) * | 1997-10-22 | 1999-09-15 | Interuniversitair Microelektronica Centrum Vzw | A fluorinated hard mask for micropatterning of polymers |
EP1070346A1 (en) * | 1998-04-02 | 2001-01-24 | Applied Materials, Inc. | Method for etching low k dielectrics |
US6040248A (en) * | 1998-06-24 | 2000-03-21 | Taiwan Semiconductor Manufacturing Company | Chemistry for etching organic low-k materials |
US6309801B1 (en) * | 1998-11-18 | 2001-10-30 | U.S. Philips Corporation | Method of manufacturing an electronic device comprising two layers of organic-containing material |
-
2000
- 2000-06-14 KR KR1020017016645A patent/KR20020010728A/en not_active Application Discontinuation
- 2000-06-14 AU AU54928/00A patent/AU5492800A/en not_active Abandoned
- 2000-06-14 WO PCT/US2000/016555 patent/WO2001001470A1/en not_active Application Discontinuation
- 2000-06-14 CN CN00809595A patent/CN1367935A/en active Pending
- 2000-09-21 TW TW089112584A patent/TW455986B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW455986B (en) | 2001-09-21 |
KR20020010728A (en) | 2002-02-04 |
WO2001001470A1 (en) | 2001-01-04 |
CN1367935A (en) | 2002-09-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |