AU6395700A - Method and apparatus for cleaving a substrate - Google Patents

Method and apparatus for cleaving a substrate

Info

Publication number
AU6395700A
AU6395700A AU63957/00A AU6395700A AU6395700A AU 6395700 A AU6395700 A AU 6395700A AU 63957/00 A AU63957/00 A AU 63957/00A AU 6395700 A AU6395700 A AU 6395700A AU 6395700 A AU6395700 A AU 6395700A
Authority
AU
Australia
Prior art keywords
cleaving
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU63957/00A
Inventor
Michael A. Bryan
James K. Kai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silicon Genesis Corp
Original Assignee
Silicon Genesis Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/370,958 external-priority patent/US6263941B1/en
Priority claimed from US09/371,436 external-priority patent/US6221740B1/en
Application filed by Silicon Genesis Corp filed Critical Silicon Genesis Corp
Publication of AU6395700A publication Critical patent/AU6395700A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
AU63957/00A 1999-08-10 2000-08-01 Method and apparatus for cleaving a substrate Abandoned AU6395700A (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US37140499A 1999-08-10 1999-08-10
US37190699A 1999-08-10 1999-08-10
US09/370,958 US6263941B1 (en) 1999-08-10 1999-08-10 Nozzle for cleaving substrates
US09371436 1999-08-10
US09371404 1999-08-10
US09/371,436 US6221740B1 (en) 1999-08-10 1999-08-10 Substrate cleaving tool and method
US09370958 1999-08-10
US09371906 1999-08-10
PCT/US2000/021006 WO2001010644A1 (en) 1999-08-10 2000-08-01 Method and apparatus for cleaving a substrate

Publications (1)

Publication Number Publication Date
AU6395700A true AU6395700A (en) 2001-03-05

Family

ID=27503077

Family Applications (1)

Application Number Title Priority Date Filing Date
AU63957/00A Abandoned AU6395700A (en) 1999-08-10 2000-08-01 Method and apparatus for cleaving a substrate

Country Status (2)

Country Link
AU (1) AU6395700A (en)
WO (1) WO2001010644A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0989593A3 (en) * 1998-09-25 2002-01-02 Canon Kabushiki Kaisha Substrate separating apparatus and method, and substrate manufacturing method
US6672358B2 (en) 1998-11-06 2004-01-06 Canon Kabushiki Kaisha Sample processing system
TW484184B (en) 1998-11-06 2002-04-21 Canon Kk Sample separating apparatus and method, and substrate manufacturing method
JP2000150836A (en) 1998-11-06 2000-05-30 Canon Inc Processing system for sample
FR2823373B1 (en) 2001-04-10 2005-02-04 Soitec Silicon On Insulator DEVICE FOR CUTTING LAYER OF SUBSTRATE, AND ASSOCIATED METHOD
FR2823372B1 (en) * 2001-04-10 2004-06-18 Soitec Silicon On Insulator DEVICE FOR CUTTING AND LAYING A SUBSTRATE, AND ASSOCIATED METHOD
JP2002353081A (en) 2001-05-25 2002-12-06 Canon Inc Device and method for separating plate member
JP2002353423A (en) 2001-05-25 2002-12-06 Canon Inc Separation device and processing method of plate member
CN105047589B (en) * 2015-07-08 2018-05-29 浙江中纳晶微电子科技有限公司 Wafer solution bonding apparatus
TWI668739B (en) * 2018-04-03 2019-08-11 環球晶圓股份有限公司 Epitaxy substrate and method of manufacturing the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1275192A (en) * 1917-10-18 1918-08-13 Henry F Alexis Automobile-leaf-spring oiler.
US1412743A (en) * 1921-10-01 1922-04-11 Jacob K Herfjord Spring oiler
US2518273A (en) * 1946-10-22 1950-08-08 Carl N Bergstrom Lubricator for automobile springs
DE834363C (en) * 1951-02-27 1952-03-20 Zentral Werkstatt Goettingen Method and device for the production of thin mica films
US2839221A (en) * 1955-02-25 1958-06-17 Demaret Pierre Device for tapping under pressure a gas containing liquid from a bottle or a can, for instance beer
US3085454A (en) * 1961-11-16 1963-04-16 Stero Chemical Mfg Co Pressurized device for uncorking bottles
KR0165467B1 (en) * 1995-10-31 1999-02-01 김광호 Wafer debonder and wafer debonding method using the wafer debonder
FR2752332B1 (en) * 1996-08-12 1998-09-11 Commissariat Energie Atomique DEVICE FOR PICKING UP WAFERS AND METHOD FOR IMPLEMENTING THE DEVICE
US6155909A (en) * 1997-05-12 2000-12-05 Silicon Genesis Corporation Controlled cleavage system using pressurized fluid

Also Published As

Publication number Publication date
WO2001010644A1 (en) 2001-02-15

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase