AU5427898A - Method for transfer molding standard electronic packages and apparatus formed thereby - Google Patents

Method for transfer molding standard electronic packages and apparatus formed thereby

Info

Publication number
AU5427898A
AU5427898A AU54278/98A AU5427898A AU5427898A AU 5427898 A AU5427898 A AU 5427898A AU 54278/98 A AU54278/98 A AU 54278/98A AU 5427898 A AU5427898 A AU 5427898A AU 5427898 A AU5427898 A AU 5427898A
Authority
AU
Australia
Prior art keywords
transfer molding
apparatus formed
electronic packages
standard electronic
molding standard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU54278/98A
Inventor
Patrick O. Weber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hestia Technologies Inc
Original Assignee
Hestia Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hestia Technologies Inc filed Critical Hestia Technologies Inc
Priority claimed from PCT/US1997/019980 external-priority patent/WO1999025534A1/en
Publication of AU5427898A publication Critical patent/AU5427898A/en
Abandoned legal-status Critical Current

Links

AU54278/98A 1997-11-13 1997-11-13 Method for transfer molding standard electronic packages and apparatus formed thereby Abandoned AU5427898A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1997/019980 WO1999025534A1 (en) 1995-10-16 1997-11-13 Method for transfer molding standard electronic packages and apparatus formed thereby

Publications (1)

Publication Number Publication Date
AU5427898A true AU5427898A (en) 1999-06-07

Family

ID=22261996

Family Applications (1)

Application Number Title Priority Date Filing Date
AU54278/98A Abandoned AU5427898A (en) 1997-11-13 1997-11-13 Method for transfer molding standard electronic packages and apparatus formed thereby

Country Status (3)

Country Link
EP (1) EP0954425A4 (en)
JP (1) JP2001509321A (en)
AU (1) AU5427898A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101463944B1 (en) * 2013-06-28 2014-11-26 주식회사 참테크 Mold for a resin molding objection

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554821A (en) * 1994-07-15 1996-09-10 National Semiconductor Corporation Removable computer peripheral cards having a solid one-piece housing
JP2667369B2 (en) * 1994-08-05 1997-10-27 インターナショナル・ビジネス・マシーンズ・コーポレイション IC card manufacturing method and IC card
US5677511A (en) * 1995-03-20 1997-10-14 National Semiconductor Corporation Overmolded PC board with ESD protection and EMI suppression
WO1996034362A1 (en) * 1995-04-24 1996-10-31 Elco Corporation Integrated circuit card

Also Published As

Publication number Publication date
EP0954425A4 (en) 2001-08-22
EP0954425A1 (en) 1999-11-10
JP2001509321A (en) 2001-07-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase