AU5152200A - Methods for wet processing electronic components having copper containing surfaces - Google Patents
Methods for wet processing electronic components having copper containing surfacesInfo
- Publication number
- AU5152200A AU5152200A AU51522/00A AU5152200A AU5152200A AU 5152200 A AU5152200 A AU 5152200A AU 51522/00 A AU51522/00 A AU 51522/00A AU 5152200 A AU5152200 A AU 5152200A AU 5152200 A AU5152200 A AU 5152200A
- Authority
- AU
- Australia
- Prior art keywords
- methods
- electronic components
- wet processing
- copper containing
- processing electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
- C11D3/3947—Liquid compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13526799P | 1999-05-21 | 1999-05-21 | |
US60135267 | 1999-05-21 | ||
PCT/US2000/014019 WO2000071782A1 (en) | 1999-05-21 | 2000-05-19 | Methods for wet processing electronic components having copper containing surfaces |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5152200A true AU5152200A (en) | 2000-12-12 |
Family
ID=22467309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU51522/00A Abandoned AU5152200A (en) | 1999-05-21 | 2000-05-19 | Methods for wet processing electronic components having copper containing surfaces |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1198620A4 (en) |
JP (1) | JP2003500537A (en) |
KR (1) | KR20020030742A (en) |
CN (1) | CN1352703A (en) |
AU (1) | AU5152200A (en) |
TW (1) | TW466728B (en) |
WO (1) | WO2000071782A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020072595A (en) * | 2001-03-12 | 2002-09-18 | (주)에스티디 | Oxidization film formation method for copper board and copper board thereby |
CN101356629B (en) * | 2005-11-09 | 2012-06-06 | 高级技术材料公司 | Composition and method for recycling semiconductor wafers having low-K dielectric materials thereon |
JP4973231B2 (en) * | 2006-09-05 | 2012-07-11 | 日立化成工業株式会社 | Copper etching method and wiring board and semiconductor package using this method |
CN105802747B (en) * | 2016-04-15 | 2018-11-09 | 林淑录 | The cleaning agent of cleaning after a kind of solar-energy photo-voltaic cell silicon wafer wool making |
CN115558931B (en) * | 2022-10-26 | 2023-07-04 | 广东华智芯电子科技有限公司 | Refining method of copper surface crystal flower, corrosive liquid combination and application thereof |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS526853B2 (en) * | 1972-12-22 | 1977-02-25 | ||
US4586961A (en) * | 1985-02-15 | 1986-05-06 | Halliburton Company | Methods and compositions for removing copper and copper oxides from surfaces |
JP2909743B2 (en) * | 1989-03-08 | 1999-06-23 | 富山日本電気株式会社 | Chemical polishing method for copper or copper alloy |
JP3154814B2 (en) * | 1991-06-28 | 2001-04-09 | 株式会社東芝 | Semiconductor wafer cleaning method and cleaning apparatus |
JPH06318584A (en) * | 1993-05-10 | 1994-11-15 | Kawasaki Steel Corp | Cleaning method and drying method after cleaning for wafer with cu wiring formed |
JP3338134B2 (en) * | 1993-08-02 | 2002-10-28 | 株式会社東芝 | Semiconductor wafer processing method |
JP3226144B2 (en) * | 1994-07-01 | 2001-11-05 | 三菱マテリアルシリコン株式会社 | Silicon wafer cleaning method |
US5855805A (en) * | 1996-08-08 | 1999-01-05 | Fmc Corporation | Microetching and cleaning of printed wiring boards |
KR100234541B1 (en) * | 1997-03-07 | 1999-12-15 | 윤종용 | Cleaning solution and cleaning method for semiconductor process |
-
2000
- 2000-05-17 TW TW089109421A patent/TW466728B/en not_active IP Right Cessation
- 2000-05-19 AU AU51522/00A patent/AU5152200A/en not_active Abandoned
- 2000-05-19 KR KR1020017014820A patent/KR20020030742A/en not_active Application Discontinuation
- 2000-05-19 EP EP00936165A patent/EP1198620A4/en not_active Withdrawn
- 2000-05-19 CN CN00807855A patent/CN1352703A/en active Pending
- 2000-05-19 JP JP2000620153A patent/JP2003500537A/en active Pending
- 2000-05-19 WO PCT/US2000/014019 patent/WO2000071782A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
CN1352703A (en) | 2002-06-05 |
JP2003500537A (en) | 2003-01-07 |
EP1198620A1 (en) | 2002-04-24 |
EP1198620A4 (en) | 2004-12-22 |
TW466728B (en) | 2001-12-01 |
KR20020030742A (en) | 2002-04-25 |
WO2000071782A1 (en) | 2000-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |