AU4554699A - Method for fabricating metal nanostructures - Google Patents

Method for fabricating metal nanostructures

Info

Publication number
AU4554699A
AU4554699A AU45546/99A AU4554699A AU4554699A AU 4554699 A AU4554699 A AU 4554699A AU 45546/99 A AU45546/99 A AU 45546/99A AU 4554699 A AU4554699 A AU 4554699A AU 4554699 A AU4554699 A AU 4554699A
Authority
AU
Australia
Prior art keywords
metal nanostructures
fabricating metal
fabricating
nanostructures
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU45546/99A
Inventor
Isaiah Watas Cox
Avto Tavkhelidze
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borealis Technical Ltd
Original Assignee
Borealis Technical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Borealis Technical Ltd filed Critical Borealis Technical Ltd
Publication of AU4554699A publication Critical patent/AU4554699A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AU45546/99A 1998-06-08 1999-06-08 Method for fabricating metal nanostructures Abandoned AU4554699A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9365298A 1998-06-08 1998-06-08
US09093652 1998-06-08
PCT/US1999/012923 WO1999064642A1 (en) 1998-06-08 1999-06-08 Method for fabricating metal nanostructures

Publications (1)

Publication Number Publication Date
AU4554699A true AU4554699A (en) 1999-12-30

Family

ID=22240057

Family Applications (1)

Application Number Title Priority Date Filing Date
AU45546/99A Abandoned AU4554699A (en) 1998-06-08 1999-06-08 Method for fabricating metal nanostructures

Country Status (2)

Country Link
AU (1) AU4554699A (en)
WO (1) WO1999064642A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7651875B2 (en) 1998-06-08 2010-01-26 Borealis Technical Limited Catalysts
US7074498B2 (en) 2002-03-22 2006-07-11 Borealis Technical Limited Influence of surface geometry on metal properties
US6680214B1 (en) 1998-06-08 2004-01-20 Borealis Technical Limited Artificial band gap
CN100373528C (en) * 2002-03-15 2008-03-05 普林斯顿大学 Laser assisted direct imprint lithography
US8574663B2 (en) 2002-03-22 2013-11-05 Borealis Technical Limited Surface pairs
US20030186405A1 (en) * 2002-04-01 2003-10-02 The Ohio State University Research Foundation Micro/nano-embossing process and useful applications thereof
US7510946B2 (en) 2003-03-17 2009-03-31 Princeton University Method for filling of nanoscale holes and trenches and for planarizing of a wafer surface
US7410904B2 (en) 2003-04-24 2008-08-12 Hewlett-Packard Development Company, L.P. Sensor produced using imprint lithography
GB2400908A (en) * 2003-04-25 2004-10-27 E2V Tech Uk Ltd Molecular detector arrangement
JP2005339669A (en) * 2004-05-27 2005-12-08 Tdk Corp Imprint method, manufacturing method for information recording medium, and imprint apparatus
US7141275B2 (en) * 2004-06-16 2006-11-28 Hewlett-Packard Development Company, L.P. Imprinting lithography using the liquid/solid transition of metals and their alloys
FR2876193B1 (en) * 2004-10-04 2007-01-26 Commissariat Energie Atomique NANOIMPRIME DEVICE COMPRISING METALLIC PATTERNS AND METHOD FOR NANOIMPRESSING METAL PATTERNS
GB0501413D0 (en) 2005-01-24 2005-03-02 Tavkhelidze Avto Method for modification of built in potential of diodes
US8227885B2 (en) 2006-07-05 2012-07-24 Borealis Technical Limited Selective light absorbing semiconductor surface
GB0617934D0 (en) 2006-09-12 2006-10-18 Borealis Tech Ltd Transistor
GB0618268D0 (en) 2006-09-18 2006-10-25 Tavkhelidze Avto High efficiency solar cell with selective light absorbing surface

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4407695A (en) * 1981-12-31 1983-10-04 Exxon Research And Engineering Co. Natural lithographic fabrication of microstructures over large areas
US4639301B2 (en) * 1985-04-24 1999-05-04 Micrion Corp Focused ion beam processing
AU634010B2 (en) * 1989-11-28 1993-02-11 Toyo Seikan Kaisha Ltd. Metallic container equipped with hologram or diffraction grating

Also Published As

Publication number Publication date
WO1999064642A1 (en) 1999-12-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase