AU4415700A - Novel adhesive and conductive composition, use thereof and conductor element - Google Patents

Novel adhesive and conductive composition, use thereof and conductor element

Info

Publication number
AU4415700A
AU4415700A AU44157/00A AU4415700A AU4415700A AU 4415700 A AU4415700 A AU 4415700A AU 44157/00 A AU44157/00 A AU 44157/00A AU 4415700 A AU4415700 A AU 4415700A AU 4415700 A AU4415700 A AU 4415700A
Authority
AU
Australia
Prior art keywords
conductive composition
conductor element
novel adhesive
adhesive
novel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU44157/00A
Inventor
Frederic Vicentini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Publication of AU4415700A publication Critical patent/AU4415700A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
AU44157/00A 1999-05-26 2000-05-11 Novel adhesive and conductive composition, use thereof and conductor element Abandoned AU4415700A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9906660A FR2794126B1 (en) 1999-05-26 1999-05-26 NOVEL ADHESIVE AND CONDUCTIVE COMPOSITION, CONNECTION METHOD, METHOD FOR CONSTITUTING ELECTRICAL OR ELECTRONIC COMPONENTS, USE OF SUCH COMPOSITION, CONDUCTIVE ELEMENT
FR9906660 1999-05-26
PCT/FR2000/001267 WO2000073371A1 (en) 1999-05-26 2000-05-11 Novel adhesive and conductive composition, use thereof and conductor element

Publications (1)

Publication Number Publication Date
AU4415700A true AU4415700A (en) 2000-12-18

Family

ID=9546030

Family Applications (1)

Application Number Title Priority Date Filing Date
AU44157/00A Abandoned AU4415700A (en) 1999-05-26 2000-05-11 Novel adhesive and conductive composition, use thereof and conductor element

Country Status (3)

Country Link
AU (1) AU4415700A (en)
FR (1) FR2794126B1 (en)
WO (1) WO2000073371A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002352260A1 (en) * 2002-01-14 2003-07-24 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. System for the production of electric and integrated circuits
FR2882175B1 (en) 2005-02-11 2007-06-22 Oberthur Card Syst Sa CARD HOLDER, METHOD OF USE, AND ADAPTER CARD ASSEMBLY
US9957412B2 (en) 2013-05-16 2018-05-01 Lord Corporation Aqueous conductive coating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1516512A (en) * 1974-05-02 1978-07-05 Gen Electric Chalcogenium salts
JPH07268065A (en) * 1993-11-17 1995-10-17 Sophia Syst:Kk Ultraviolet-curable nonsolvent conductive polymer material
JPH08245764A (en) * 1995-03-13 1996-09-24 Toshiba Chem Corp Electroconductive paste
WO1997042638A1 (en) * 1996-05-06 1997-11-13 Siemens Aktiengesellschaft Electroconductive gluing process
JP3685591B2 (en) * 1997-05-26 2005-08-17 京セラケミカル株式会社 Conductive paste

Also Published As

Publication number Publication date
FR2794126A1 (en) 2000-12-01
FR2794126B1 (en) 2003-07-18
WO2000073371A1 (en) 2000-12-07

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase