AU4267599A - Method for the packing of components, a card module and its cooling system - Google Patents

Method for the packing of components, a card module and its cooling system

Info

Publication number
AU4267599A
AU4267599A AU42675/99A AU4267599A AU4267599A AU 4267599 A AU4267599 A AU 4267599A AU 42675/99 A AU42675/99 A AU 42675/99A AU 4267599 A AU4267599 A AU 4267599A AU 4267599 A AU4267599 A AU 4267599A
Authority
AU
Australia
Prior art keywords
packing
components
cooling system
card module
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU42675/99A
Inventor
Tommi Haavisto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Oyj
Original Assignee
Nokia Telecommunications Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Telecommunications Oy filed Critical Nokia Telecommunications Oy
Publication of AU4267599A publication Critical patent/AU4267599A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1447—External wirings; Wiring ducts; Laying cables
    • H05K7/1451—External wirings; Wiring ducts; Laying cables with connections between circuit boards or units
AU42675/99A 1998-05-18 1999-05-17 Method for the packing of components, a card module and its cooling system Abandoned AU4267599A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI981102 1998-05-18
FI981102A FI981102A (en) 1998-05-18 1998-05-18 Procedure for packing components, card modules and cooling systems thereof
PCT/FI1999/000427 WO1999060827A2 (en) 1998-05-18 1999-05-17 Method for the packing of components, a card module and its cooling system

Publications (1)

Publication Number Publication Date
AU4267599A true AU4267599A (en) 1999-12-06

Family

ID=8551750

Family Applications (1)

Application Number Title Priority Date Filing Date
AU42675/99A Abandoned AU4267599A (en) 1998-05-18 1999-05-17 Method for the packing of components, a card module and its cooling system

Country Status (3)

Country Link
AU (1) AU4267599A (en)
FI (1) FI981102A (en)
WO (1) WO1999060827A2 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3268772A (en) * 1963-03-26 1966-08-23 North American Aviation Inc Packaged electronic equipment
US3515949A (en) * 1967-11-22 1970-06-02 Bunker Ramo 3-d flatpack module packaging technique
US3671812A (en) * 1970-07-01 1972-06-20 Martin Marietta Corp High density packaging of electronic components in three-dimensional modules
US3725744A (en) * 1971-06-11 1973-04-03 Ball Brothers Res Corp Electrical component connector assembly
US4884168A (en) * 1988-12-14 1989-11-28 Cray Research, Inc. Cooling plate with interboard connector apertures for circuit board assemblies
JP2572840B2 (en) * 1989-03-30 1997-01-16 三菱電機株式会社 Semiconductor device and radiation fin
US5343359A (en) * 1992-11-19 1994-08-30 Cray Research, Inc. Apparatus for cooling daughter boards
US5761043A (en) * 1996-02-22 1998-06-02 Cray Research, Inc. Daughter card assembly

Also Published As

Publication number Publication date
WO1999060827A2 (en) 1999-11-25
WO1999060827A3 (en) 2000-01-13
FI981102A (en) 1999-11-19
FI981102A0 (en) 1998-05-18

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase