WO1999060827A3 - Method for the packing of components, a card module and its cooling system - Google Patents

Method for the packing of components, a card module and its cooling system Download PDF

Info

Publication number
WO1999060827A3
WO1999060827A3 PCT/FI1999/000427 FI9900427W WO9960827A3 WO 1999060827 A3 WO1999060827 A3 WO 1999060827A3 FI 9900427 W FI9900427 W FI 9900427W WO 9960827 A3 WO9960827 A3 WO 9960827A3
Authority
WO
WIPO (PCT)
Prior art keywords
components
card module
cooling system
daughter
packing
Prior art date
Application number
PCT/FI1999/000427
Other languages
French (fr)
Other versions
WO1999060827A2 (en
Inventor
Tommi Haavisto
Original Assignee
Nokia Networks Oy
Tommi Haavisto
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Networks Oy, Tommi Haavisto filed Critical Nokia Networks Oy
Priority to AU42675/99A priority Critical patent/AU4267599A/en
Publication of WO1999060827A2 publication Critical patent/WO1999060827A2/en
Publication of WO1999060827A3 publication Critical patent/WO1999060827A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1447—External wirings; Wiring ducts; Laying cables
    • H05K7/1451—External wirings; Wiring ducts; Laying cables with connections between circuit boards or units

Abstract

The invention relates to a method for the packing of components (1) with conductor pins on a circuit board (2), in which method the component (1) is mounted on a daughter card, and to a daughter card module (10) thus formed. In the invention, the component (1) is connected to a first daughter card (3) by a conductor pin (6) on a first side of the component and to a second daughter card (4) by a conductor pin (5) on a second side of the component, thus forming a daughter card module (10). The daughter card module thus formed is connected by the daughter cards to a circuit board (2). The invention also relates to a cooling system for the cooling of components mounted between two daughter cards disposed at a distance from each other. The cooling system comprises a first cooling element (11) shaped to fit into a space formed between two components mounted between the two daughter cards.
PCT/FI1999/000427 1998-05-18 1999-05-17 Method for the packing of components, a card module and its cooling system WO1999060827A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU42675/99A AU4267599A (en) 1998-05-18 1999-05-17 Method for the packing of components, a card module and its cooling system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI981102 1998-05-18
FI981102A FI981102A (en) 1998-05-18 1998-05-18 Procedure for packing components, card modules and cooling systems thereof

Publications (2)

Publication Number Publication Date
WO1999060827A2 WO1999060827A2 (en) 1999-11-25
WO1999060827A3 true WO1999060827A3 (en) 2000-01-13

Family

ID=8551750

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI1999/000427 WO1999060827A2 (en) 1998-05-18 1999-05-17 Method for the packing of components, a card module and its cooling system

Country Status (3)

Country Link
AU (1) AU4267599A (en)
FI (1) FI981102A (en)
WO (1) WO1999060827A2 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3268772A (en) * 1963-03-26 1966-08-23 North American Aviation Inc Packaged electronic equipment
US3515949A (en) * 1967-11-22 1970-06-02 Bunker Ramo 3-d flatpack module packaging technique
US3671812A (en) * 1970-07-01 1972-06-20 Martin Marietta Corp High density packaging of electronic components in three-dimensional modules
US3725744A (en) * 1971-06-11 1973-04-03 Ball Brothers Res Corp Electrical component connector assembly
US4884168A (en) * 1988-12-14 1989-11-28 Cray Research, Inc. Cooling plate with interboard connector apertures for circuit board assemblies
US5025307A (en) * 1989-03-30 1991-06-18 Mitsubishi Denki Kabushiki Kaisha Modular semiconductor device
US5343359A (en) * 1992-11-19 1994-08-30 Cray Research, Inc. Apparatus for cooling daughter boards
US5761043A (en) * 1996-02-22 1998-06-02 Cray Research, Inc. Daughter card assembly

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3268772A (en) * 1963-03-26 1966-08-23 North American Aviation Inc Packaged electronic equipment
US3515949A (en) * 1967-11-22 1970-06-02 Bunker Ramo 3-d flatpack module packaging technique
US3671812A (en) * 1970-07-01 1972-06-20 Martin Marietta Corp High density packaging of electronic components in three-dimensional modules
US3725744A (en) * 1971-06-11 1973-04-03 Ball Brothers Res Corp Electrical component connector assembly
US4884168A (en) * 1988-12-14 1989-11-28 Cray Research, Inc. Cooling plate with interboard connector apertures for circuit board assemblies
US5025307A (en) * 1989-03-30 1991-06-18 Mitsubishi Denki Kabushiki Kaisha Modular semiconductor device
US5343359A (en) * 1992-11-19 1994-08-30 Cray Research, Inc. Apparatus for cooling daughter boards
US5761043A (en) * 1996-02-22 1998-06-02 Cray Research, Inc. Daughter card assembly

Also Published As

Publication number Publication date
AU4267599A (en) 1999-12-06
WO1999060827A2 (en) 1999-11-25
FI981102A0 (en) 1998-05-18
FI981102A (en) 1999-11-19

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